Journal Description
Chips
Chips
is an international, peer-reviewed, open access journal on all aspects of chips published quarterly online by MDPI.
- Open Access— free for readers, with article processing charges (APC) paid by authors or their institutions.
- Rapid Publication: first decisions in 16 days; acceptance to publication in 5.8 days (median values for MDPI journals in the second half of 2022).
- Recognition of Reviewers: APC discount vouchers, optional signed peer review, and reviewer names published annually in the journal.
- Companion journal: Sensors.
Latest Articles
On-Chip Adaptive Implementation of Neuromorphic Spiking Sensory Systems with Self-X Capabilities
Chips 2023, 2(2), 142-158; https://doi.org/10.3390/chips2020009 - 06 Jun 2023
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In contemporary devices, the number and diversity of sensors is increasing, thus, requiring both efficient and robust interfacing to the sensors. Implementing the interfacing systems in advanced integration technologies faces numerous issues due to manufacturing deviations, signal swings, noise, etc. The interface sensor
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In contemporary devices, the number and diversity of sensors is increasing, thus, requiring both efficient and robust interfacing to the sensors. Implementing the interfacing systems in advanced integration technologies faces numerous issues due to manufacturing deviations, signal swings, noise, etc. The interface sensor designers escape to the time domain and digital design techniques to handle these challenges. Biology gives examples of efficient machines that have vastly outperformed conventional technology. This work pursues a neuromorphic spiking sensory system design with the same efficient style as biology. Our chip, that comprises the essential elements of the adaptive neuromorphic spiking sensory system, such as the neuron, synapse, adaptive coincidence detection (ACD), and self-adaptive spike-to-rank coding (SA-SRC), was manufactured in XFAB CMOS 0.35 m technology via EUROPRACTICE. The main emphasis of this paper is to present the measurement outcomes of the SA-SRC on-chip, evaluating the efficacy of its adaptation scheme, and assessing its capability to produce spike orders that correspond to the temporal difference between the two spikes received at its inputs. The SA-SRC plays a crucial role in performing the primary function of the adaptive neuromorphic spiking sensory system. The measurement results of the chip confirm the simulation results of our previous work.
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Open AccessArticle
A Quantitative Review of Automated Neural Search and On-Device Learning for Tiny Devices
Chips 2023, 2(2), 130-141; https://doi.org/10.3390/chips2020008 - 09 May 2023
Abstract
This paper presents a state-of-the-art review of different approaches for Neural Architecture Search targeting resource-constrained devices such as microcontrollers, as well as the implementations of on-device learning techniques for them. Approaches such as MCUNet have been able to drive the design of tiny
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This paper presents a state-of-the-art review of different approaches for Neural Architecture Search targeting resource-constrained devices such as microcontrollers, as well as the implementations of on-device learning techniques for them. Approaches such as MCUNet have been able to drive the design of tiny neural architectures with low memory and computational requirements which can be deployed effectively on microcontrollers. Regarding on-device learning, there are various solutions that have addressed concept drift and have coped with the accuracy drop in real-time data depending on the task targeted, and these rely on a variety of learning methods. For computer vision, MCUNetV3 uses backpropagation and represents a state-of-the-art solution. The Restricted Coulomb Energy Neural Network is a promising method for learning with an extremely low memory footprint and computational complexity, which should be considered for future investigations.
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(This article belongs to the Topic Artificial Intelligence in Smart Industrial Diagnostics and Manufacturing)
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Open AccessArticle
Low-Cost Indirect Measurements for Power-Efficient In-Field Optimization of Configurable Analog Front-Ends with Self-X Properties: A Hardware Implementation
Chips 2023, 2(2), 102-129; https://doi.org/10.3390/chips2020007 - 01 May 2023
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This paper presents a practical implementation and measurement results of power-efficient chip performance optimization, utilizing low-cost indirect measurement methods to support self-X properties (self-calibration, self-healing, self-optimization, etc.) for in-field optimization of analog front-end sensory electronics with XFAB 0.35 µm complementary metal oxide semiconductor
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This paper presents a practical implementation and measurement results of power-efficient chip performance optimization, utilizing low-cost indirect measurement methods to support self-X properties (self-calibration, self-healing, self-optimization, etc.) for in-field optimization of analog front-end sensory electronics with XFAB 0.35 µm complementary metal oxide semiconductor (CMOS) technology. The reconfigurable, fully differential indirect current-feedback instrumentation amplifier (CFIA) performance is intrinsically optimized by employing a single test sinusoidal signal stimulus and measuring the total harmonic distortion (THD) at the output. To enhance the optimization process, the experience replay particle swarm optimization (ERPSO) algorithm is utilized as an artificial intelligence (AI) agent, implemented at the hardware level, to optimize the performance characteristics of the CFIA. The ERPSO algorithm extends the selection producer capabilities of the classical PSO methodology by incorporating an experience replay buffer to mitigate the likelihood of being trapped in local optima. Furthermore, the CFIA circuit has been integrated with a simple power-monitoring module to assess the power consumption of the optimization solution, to achieve a power-efficient and reliable configuration. The optimized chip performance showed an approximate 34% increase in power efficiency while achieving a targeted THD value of −72 dB, utilizing a 1 Vp-p differential input signal with a frequency of 1 MHz, and consuming approximately 53 mW of power. Preliminary tests conducted on the fabricated chip, using the default configuration pattern extrapolated from post-layout simulations, revealed an unacceptable performance behavior of the CFIA. Nevertheless, the proposed in-field optimization successfully restored the circuit’s performance, resulting in a robust design that meets the performance achieved in the design phase.
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Open AccessReview
Silicon Radiation Detector Technologies: From Planar to 3D
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Chips 2023, 2(2), 83-101; https://doi.org/10.3390/chips2020006 - 13 Apr 2023
Abstract
Silicon radiation detectors, a special type of microelectronic sensor which plays a crucial role in many applications, are reviewed in this paper, focusing on fabrication aspects. After addressing the basic concepts and the main requirements, the evolution of detector technologies is discussed, which
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Silicon radiation detectors, a special type of microelectronic sensor which plays a crucial role in many applications, are reviewed in this paper, focusing on fabrication aspects. After addressing the basic concepts and the main requirements, the evolution of detector technologies is discussed, which has been mainly driven by the ever-increasing demands for frontier scientific experiments.
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(This article belongs to the Special Issue Smart IC Design and Sensing Technologies)
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Open AccessReview
Approximate Content-Addressable Memories: A Review
Chips 2023, 2(2), 70-82; https://doi.org/10.3390/chips2020005 - 30 Mar 2023
Cited by 1
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Content-addressable memory (CAM) has been part of the memory market for more than five decades. CAM can carry out a single clock cycle lookup based on the content rather than an address. Thanks to this attractive feature, CAM is utilized in memory systems
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Content-addressable memory (CAM) has been part of the memory market for more than five decades. CAM can carry out a single clock cycle lookup based on the content rather than an address. Thanks to this attractive feature, CAM is utilized in memory systems where a high-speed content lookup technique is required. However, typical CAM applications only support exact matching, as opposed to approximate matching, where a certain Hamming distance (several mismatching characters between a query pattern and the dataset stored in CAM) needs to be tolerated. Recent interest in approximate search has led to the development of new CAM-based alternatives, accelerating the processing of large data workloads in the realm of big data, genomics, and other data-intensive applications. In this review, we provide an overview of approximate CAM and describe its current and potential applications that would benefit from approximate search computing.
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Open AccessReview
Bandpass Sigma–Delta Modulation: The Path toward RF-to-Digital Conversion in Software-Defined Radio
Chips 2023, 2(1), 44-69; https://doi.org/10.3390/chips2010004 - 02 Mar 2023
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This paper reviews the state of the art on bandpass modulators (BP- Ms) intended to digitize radio frequency (RF) signals. A priori, this is the most direct way to implement software-defined radio (SDR) systems since the analog/digital interface is
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This paper reviews the state of the art on bandpass modulators (BP- Ms) intended to digitize radio frequency (RF) signals. A priori, this is the most direct way to implement software-defined radio (SDR) systems since the analog/digital interface is placed closer to the antenna, thus reducing the analog circuitry and doing most of the signal processing in the digital domain. In spite of their higher programmability and scalability, RF BP- M analog-to-digital converters (ADCs) require more energy to operate in the GHz range as compared with their low-pass (LP) counterparts. This makes conventional direct conversion receivers (DCRs) the commonplace approach due to their overall smaller energy consumption. This paper surveys some circuits and systems techniques which can make RF ADCs and SDR-based transceivers more efficient and feasible to be embedded in mobile terminals.
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Open AccessArticle
Methodology for a Low-Power and Low-Circuit-Area 15-Bit SAR ADC Using Split-Capacitor Mismatch Compensation and a Dynamic Element Matching Algorithm
by
and
Chips 2023, 2(1), 31-43; https://doi.org/10.3390/chips2010003 - 27 Feb 2023
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This paper presents a design methodology for a low-power, low-chip-area, and high-resolution successive approximations register (SAR) analog-to-digital converter (ADC). The proposed method includes a segmented capacitive DAC (C-DAC) to reduce the power consumption and the total area. An embedded self-calibration algorithm based on
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This paper presents a design methodology for a low-power, low-chip-area, and high-resolution successive approximations register (SAR) analog-to-digital converter (ADC). The proposed method includes a segmented capacitive DAC (C-DAC) to reduce the power consumption and the total area. An embedded self-calibration algorithm based on a set of trimming capacitors was applied alongside a dynamic element matching (DEM) procedure to control the inherent linearity issues caused by the process mismatch. The SAR ADC and each additional algorithm were modeled in MATLAB to show their efficiency. Finally, a simple methodology was developed to allow for the fast estimation of signal-to-noise ratios (SNRs) without any FFT calculation.
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Open AccessArticle
An Interface Platform for Robotic Neuromorphic Systems
Chips 2023, 2(1), 20-30; https://doi.org/10.3390/chips2010002 - 01 Feb 2023
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Neuromorphic computing is promising to become a future standard in low-power AI applications. The integration between new neuromorphic hardware and traditional microcontrollers is an open challenge. In this paper, we present an interface board and a communication protocol that allows communication between different
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Neuromorphic computing is promising to become a future standard in low-power AI applications. The integration between new neuromorphic hardware and traditional microcontrollers is an open challenge. In this paper, we present an interface board and a communication protocol that allows communication between different devices, using a microcontroller unit (Arduino Due) in the middle. Our compact printed circuit board (PCB) links different devices as a whole system and provides a power supply for the entire system using batteries as the power supply. Concretely, we have connected a Dynamic Vision Sensor (DVS128), SpiNNaker board and a servo motor, creating a platform for a neuromorphic robotic system controlled by a Spiking Neural Network, which is demonstrated on the task of intercepting incoming objects. The data rate of the implemented interface board is 24.64 k symbols/s and the latency for generating commands is about 11ms. The complete system is run only by batteries, making it very suitable for robotic applications.
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Open AccessArticle
Hybrid Inverter-Based Fully Differential Operational Transconductance Amplifiers
Chips 2023, 2(1), 1-19; https://doi.org/10.3390/chips2010001 - 06 Jan 2023
Cited by 1
Abstract
Inverter-based Operational Transconductance Amplifiers (OTAs) are versatile and friendly scalable analog circuit blocks. Especially for the new CMOS technological nodes, several recent applications have been extensively using them, ranging from Analog Front End (AFE) to analog-to-digital converters (ADC). This work tracks down the
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Inverter-based Operational Transconductance Amplifiers (OTAs) are versatile and friendly scalable analog circuit blocks. Especially for the new CMOS technological nodes, several recent applications have been extensively using them, ranging from Analog Front End (AFE) to analog-to-digital converters (ADC). This work tracks down the current advances in inverter-based OTAs design, comparing their basic fully differential structures, such as Nauta (N), Barthelemy (B), Vieru (V) and Mafredini (M) ones, and, in addition, mixing them up to propose new fully differential single-ended and two-stage hybrid versions. The new herein-proposed fully differential hybrid OTAs are the composition of Barthelemy/Nauta (B/N), Barthelemy/Manfredini (B/M), Nauta/Vieru (N/V), and Manfredini/Vieru (M/V) OTAs. All OTAs were designed using the same Global Foundries 180 nm open-source PDK and their performances are compared for post-layout simulations.
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(This article belongs to the Special Issue State-of-the-Art in Integrated Circuit Design)
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Open AccessArticle
A CMOS Voltage Reference with Output Voltage Doubling Using Modified 2T Topology
by
and
Chips 2022, 1(3), 218-232; https://doi.org/10.3390/chips1030015 - 15 Dec 2022
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This paper presents an ultra-low power CMOS voltage reference which operates in the subthreshold region. Modified from the conventional 2T circuit, the proposed circuit is capable of generating higher output voltage by using the resistor subdivision. The design comprises a negative-threshold native NMOS
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This paper presents an ultra-low power CMOS voltage reference which operates in the subthreshold region. Modified from the conventional 2T circuit, the proposed circuit is capable of generating higher output voltage by using the resistor subdivision. The design comprises a negative-threshold native NMOS transistor as the current generator, a high-threshold PMOS transistor as the active load and an active voltage doubling network to generate the reference voltage. Implemented in TSMC 40 nm CMOS technology, the proposed circuit operates at a minimum supply of 0.65 V and consumes 5.5 nA. Under one sample simulation, the obtained T.C. is 16.64 ppm/°C and the nominal is 489.6 mV (75.3% of ) for the temperature range from −20 °C to 80 °C. For Monte-Carlo simulation of 200 samples at room temperature, the average output voltage is 488 mV and the average T.C. is 29.6 ppm/°C whilst with the standard deviation of 13.26 ppm/°C. Finally, at room temperature, the proposed voltage reference has achieved a process sensitivity (σ/μ) of 3.9%, a line sensitivity of 0.51%/V and a power supply rejection of −45.5 dB and −76.3 dB at 100 kHz and 100 MHz. Compared to the representative prior-art works realized in the same technology and a similar supply current, the proposed circuit has offered the best 1-sampe T.C., the best average T.C. in multiple samples, the highest output voltage, the maximum output voltage per minimum supply voltage and the lowest process sensitivity in the output, .
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Open AccessCommunication
FPGA Prototyping of Web Service Using REST and SOAP Packages
Chips 2022, 1(3), 210-217; https://doi.org/10.3390/chips1030014 - 05 Dec 2022
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This Communication reports on FPGA prototyping of an embedded web service that sends XML messages under two different packages, namely Simple Object Access Protocol (SOAP) and Representational State Transfer (REST). The request and response messages are communicated through a 100 Mbps local area
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This Communication reports on FPGA prototyping of an embedded web service that sends XML messages under two different packages, namely Simple Object Access Protocol (SOAP) and Representational State Transfer (REST). The request and response messages are communicated through a 100 Mbps local area network between a Spartan-3E FPGA board and washing machine simulator. The performances of REST-based and SOAP-based web services implemented on reconfigurable hardware are then compared. In general, the former performs better than the latter in terms of FPGA resource utilization (~12% less), message length (~57% shorter), and processing time (~4.5 μs faster). This work confirms the superiority of REST over SOAP for data transmission using reconfigurable computing, which paves the way for adoption of these low-cost systems for web services of consumer electronics such as home appliances.
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Open AccessArticle
Multi-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging
Chips 2022, 1(3), 191-209; https://doi.org/10.3390/chips1030013 - 17 Nov 2022
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The endurability of solder joints in the ball-grid array (BGA) packaging is crucial to the functioning of the microelectronic system. To improve electronic packaging reliability, this paper is dedicated to numerically optimize solder joint array configuration and study the influence of multi-physical fields
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The endurability of solder joints in the ball-grid array (BGA) packaging is crucial to the functioning of the microelectronic system. To improve electronic packaging reliability, this paper is dedicated to numerically optimize solder joint array configuration and study the influence of multi-physical fields on solder joint reliability. The uniqueness of this study is that on the basis of temperature field and stress field, the electric field is added to realize the coupling simulation of three physical fields. In addition, the “Open Angle” is mathematically defined to describe the array configuration, and it was used to reveal the influence factors of solder joint fatigue, including stress, temperature, and current density. In the single solder joint model, the impacts of geometric shape and working conditions on the maximum value and distribution of these evaluation factors (stress, temperature, and current density) were investigated. Overall, the numerical investigation gives the optimal configuration, geometric shape, and working condition of solder joints, which benefits the design of endurable and efficient BGA packaging.
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Open AccessArticle
An Adaptive Downsampling FPGA-Based TDC Implementation for Time Measurement Improvement
Chips 2022, 1(3), 175-190; https://doi.org/10.3390/chips1030012 - 08 Nov 2022
Abstract
In this work, we present a compact “adaptive downsampling” method that mitigates the nonlinearity problems associated with FPGA-based TDCs that utilize delay lines. Additionally, this generic method allows for trade-offs between resolution, linearity, and resource utilization. Since nonlinearity is one of the predominant
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In this work, we present a compact “adaptive downsampling” method that mitigates the nonlinearity problems associated with FPGA-based TDCs that utilize delay lines. Additionally, this generic method allows for trade-offs between resolution, linearity, and resource utilization. Since nonlinearity is one of the predominant issues regarding delay lines in FPGA-based TDCs, combined with the fact that delay lines are utilized for a wide range of TDC architectures (not limited to the delay-line TDC), other implementations (e.g., Vernier or wave union TDCs), also in different FPGA devices, can directly benefit from the proposed adaptive method, with no need for either custom routing or complex tuning of the converter. Furthermore, implementation-related challenges regarding clock skew, measurement uncertainty, and the placement of the TDC are discussed and we also propose an experimental setup that utilizes only FPGA resources in order to characterize the converter. Although the TDC in this work was implemented in a Xilinx Virtex-6 device and was characterized under different operational modes, we successfully optimized the converter’s nonlinearity and resource utilization while retaining single-shot precision. The best performing (in terms of linearity) implementation reached and values of 0.30 LSB and 0.45 LSB, respectively, and the single-shot precision ( ) was 9.0 ps.
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(This article belongs to the Special Issue Smart IC Design and Sensing Technologies)
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Open AccessEditorial
Special Issue “Smart IC Design and Sensing Technologies”
Chips 2022, 1(3), 172-174; https://doi.org/10.3390/chips1030011 - 20 Oct 2022
Abstract
Smart sensing technologies and their inherent data-processing techniques have drawn considerable research and industrial attention in recent years. Recent developments in nanometer CMOS technologies have shown great potential to deal with the increasing demand of processing power that arises in these sensing technologies,
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Smart sensing technologies and their inherent data-processing techniques have drawn considerable research and industrial attention in recent years. Recent developments in nanometer CMOS technologies have shown great potential to deal with the increasing demand of processing power that arises in these sensing technologies, from IoT applications to complicated medical devices. Moreover, circuit implementation, which could be based on a full analog or digital approach or, in most cases, on a mixed-signal approach, possesses a fundamental role in exploiting the full capabilities of sensing technologies. In addition, all circuit design methodologies include the optimization of several performance metrics, such as low power, low cost, small area, and high throughput, which impose critical challenges in the field of sensor design. This Special Issue aims to highlight advances in the development, modeling, simulation, and implementation of integrated circuits for sensing technologies, from the component level to complete sensing systems.
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(This article belongs to the Special Issue Smart IC Design and Sensing Technologies)
Open AccessPerspective
The Integrated Circuit Industry at a Crossroads: Threats and Opportunities
Chips 2022, 1(3), 150-171; https://doi.org/10.3390/chips1030010 - 06 Oct 2022
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With the outbreak of the COVID-19 pandemic, the persistent chip shortage, war in Ukraine, and U.S.–China tensions, the semiconductor industry is at a critical stage. Only if it is capable of major changes, will it be able to sustain itself and continue to
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With the outbreak of the COVID-19 pandemic, the persistent chip shortage, war in Ukraine, and U.S.–China tensions, the semiconductor industry is at a critical stage. Only if it is capable of major changes, will it be able to sustain itself and continue to provide solutions for ongoing exponential technology growth. However, the war has undermined, perhaps definitively, a global order that urged the integration of markets above geopolitical divergences. Now that the trend seems to be reversed, the extent to which the costs of this commercial and technological decoupling can be absorbed and legitimized will have to be understood.
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Open AccessReview
An Overview of State-of-the-Art D-Band Radar System Components
Chips 2022, 1(3), 121-149; https://doi.org/10.3390/chips1030009 - 21 Sep 2022
Cited by 1
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In this article, a literature study has been conducted including 398 radar circuit elements from 311 recent publications (mostly between 2010 and 2022) that have been reported mainly in the F-, D- and G-Band (80–200 GHz). This study is intended to give a
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In this article, a literature study has been conducted including 398 radar circuit elements from 311 recent publications (mostly between 2010 and 2022) that have been reported mainly in the F-, D- and G-Band (80–200 GHz). This study is intended to give a state-of-the-art comparison on the performance of the different technologies—RFCMOS, SiGe/BiCMOS and III–V semiconductor composites—regarding the most crucial circuit parameters of Voltage-Controlled Oscillators (VCO), Power Amplifiers (PA), Phase Shifters (PS), Low-Noise Amplifiers (LNA) and Mixers. The most common topologies of each circuit element as well as the differences between the technolgies will futher be laid out while reasoning their benefits. Since not all devices were derived solely from single device publications, necessary steps to yield as fairly a comparison as possible were taken. Results include the area and power efficiency in RFCMOS, superior noise and power performance in III–V semiconductors and a continuous compromise between efficiency and performance in SiGe. The most rarely published devices, being Mixers and PSs, in the given frequency range have also been identified to give incentive for further developments.
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Open AccessArticle
Integrated Sensor Electronic Front-Ends with Self-X Capabilities
Chips 2022, 1(2), 83-120; https://doi.org/10.3390/chips1020008 - 12 Aug 2022
Cited by 1
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The ongoing vivid advance in integration technologies is giving leverage both to computing systems as well as to sensors and sensor systems. Both conventional computing systems as well as innovative computing systems, e.g., following bio-inspiration from nervous systems or neural networks, require efficient
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The ongoing vivid advance in integration technologies is giving leverage both to computing systems as well as to sensors and sensor systems. Both conventional computing systems as well as innovative computing systems, e.g., following bio-inspiration from nervous systems or neural networks, require efficient interfacing to an increasing diversity of sensors under the constraints of metrology. The realization of sufficiently accurate, robust, and flexible analog front-ends (AFE) is decisive for the overall application system and quality and requires substantial design expertise both for cells in System-on-Chip (SoC) or chips in System-in-Package (SiP) realizations. Adding robustness and flexibility to sensory systems, e.g., for Industry 4.0., by self-X or self-* features, e.g., self-monitoring, -trimming, or -healing (AFEX) approaches the capabilities met in living beings and is pursued in our research. This paper summarizes on two chips, denoted as Universal-Sensor-Interface-with-self-X-properties (USIX) based on amplitude representation and reports on recently identified challenges and corresponding advanced solutions, e.g., on circuit assessment as well as observer robustness for classic amplitude-based AFE, and transition activities to spike domain representation spiking-analog-front-ends with self-X properties (SAFEX) based on adaptive spiking electronics as the next evolutionary step in AFE development. Key cells for AFEX and SAFEX have been designed in XFAB xh035 CMOS technology and have been subject to extrinsic optimization and/or adaptation. The submitted chip features 62,921 transistors, a total area of 10.89 mm (74% analog, 26% digital), and 66 bytes of the configuration memory. The prepared demonstrator will allow intrinsic optimization and/or adaptation for the developed technology agnostic concepts and chip instances. In future work, confirmed cells will be moved to complete versatile and robust AFEs, which can serve both for conventional as well as innovative computing systems, e.g., spiking neurocomputers, as well as to leading-edge technologies to serve in SOCs.
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Open AccessArticle
Signal Amplification by Means of a Dickson Charge Pump: Analysis and Experimental Validation
Chips 2022, 1(2), 72-82; https://doi.org/10.3390/chips1020007 - 18 Jul 2022
Cited by 3
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Recently, with the aim of extending the use of the CP in all those applications where a time-variant signal must be amplified with its DC component above the positive power supply rail, the signal amplification feature of a conventional Dickson charge pump (CP)
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Recently, with the aim of extending the use of the CP in all those applications where a time-variant signal must be amplified with its DC component above the positive power supply rail, the signal amplification feature of a conventional Dickson charge pump (CP) has been investigated, introducing a small-signal model for each particular condition in which a CP can work. In this paper this idea is further investigated, especially under the slow switching limit (SSL) condition, and experimental validation has been carried out using a 65 nm CMOS technology for four different voltage gain values. Starting from an equivalent model of the CP, the main small- and large-signal parameters are analytically derived and discussed in depth. As a proof of concept, experimental measurements on four CPs with different numbers of stages confirm the validity of this unconventional application and the effectiveness of the CP when used as an amplifier.
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Open AccessArticle
Equivalence Checking of System-Level and SPICE-Level Models of Linear Circuits
Chips 2022, 1(1), 54-71; https://doi.org/10.3390/chips1010006 - 13 Jun 2022
Cited by 1
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Due to the increasing complexity of analog circuits and their integration into System-on-Chips (SoC), the analog design and verification industry would greatly benefit from an expansion of system-level methodologies using SystemC AMS. These can provide a speed increase of over × in
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Due to the increasing complexity of analog circuits and their integration into System-on-Chips (SoC), the analog design and verification industry would greatly benefit from an expansion of system-level methodologies using SystemC AMS. These can provide a speed increase of over × in comparison to SPICE-level simulations and allow interoperability with digital tools at the system-level. However, a key barrier to the expansion of system-level tools for analog circuits is the lack of confidence in system-level models implemented in SystemC AMS. Functional equivalence of single Laplace Transfer Function (LTF) system-level models to respective SPICE-level models was successfully demonstrated recently. However, this is clearly not sufficient, as the complex systems comprise multiple LTF modules. In this article, we go beyond single LTF models, i.e., we develop a novel graph-based methodology to formally check equivalence between complex system-level and SPICE-level representations of Single-Input Single-Output (SISO) linear analog circuits, such as High-Pass Filters (HPF). To achieve this, first, we introduce a canonical representation in the form of a Signal-Flow Graph (SFG), which is used to functionally map the two representations from separate modeling levels. This canonical representation consists of the input and output nodes and a single edge between them with an LTF as its weight. Second, we create an SFG representation with linear graph modeling for SPICE-level models, whereas for system-level models we extract an SFG from the behavioral description. We then transform the SFG representations into the canonical representation by utilizing three graph manipulation techniques, namely node removal, parallel edge unification, and reflexive edge elimination. This allows us to establish functional equivalence between complex system-level models and SPICE-level models. We demonstrate the applicability of the proposed methodology by successfully applying it to complex circuits.
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Open AccessEditorial
Chips: A New Open Access Journal in the Domain of ICs
Chips 2022, 1(1), 51-53; https://doi.org/10.3390/chips1010005 - 30 May 2022
Abstract
As Editor-in-Chief, it is my honor and pleasure to introduce Chips [...]
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Smart IC Design and Sensing Technologies
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State-of-the-Art in Integrated Circuit Design
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