Advances in Microelectronics and Semiconductor Engineering

This brief presents a continuously regulated current mirror topology capable of providing a wide range of currents with high-precision and speed control features. The circuit combines a non-linear current-mode feedback solution for fast and energy-efficient operation with an input-referred regulated-cascode configuration for precise current mirroring. The proposed implementation has an output current ranging from 100 $\mathsf{\mu }$A to 2 $\mathrm{mA}$, exhibits a fast response time of ≈100 $\mathrm{ns}$ for the full range steps, while ensuring a high power efficiency (>90%) and low current copy errors (<0.5%). Full article

The effect of high- and low-temperature conditions on the performance of IGZO TFT and logic circuits were investigated in this work. In the temperature range of 250−350 K, the performance of the IGZO TFT did not show significant changes and exhibited a certain degree of high- and low-temperature resistance. When the temperature was below 250 K, as the temperature decreased, the threshold voltage (V_TH) of the IGZO TFT significantly increased, the field effect mobility (μ_FE) and the on state current (I_ON) significantly decreased. This is attributed to the lower excitation degree of charge carriers at extremely low temperatures, resulting in fewer charge carriers transitioning to the conduction or valence bands, and the formation of defects also limits carrier migration. When the temperature exceeded 350 K, as the temperature increased, more electrons could escape from the bandgap trap state and become free charge carriers, and the IGZO layer was thermally excited to produce more oxygen vacancies, resulting in higher μ_FE and lower V_TH. In addition, the drain current noise spectral density of IGZO TFT conformed to the 1/ƒ noise characteristic, and the degradation mechanism of IGZO TFT over a wide temperature range was confirmed based on the changes in noise spectral density at different temperatures. In addition, an inverter logic unit circuit was designed based on IGZO TFT, and the performance changes over a wide temperature range were analyzed. This lays the foundation for IGZO TFT to be applied in integrated circuits with harsh environments. Full article

This paper presents a level-crossing successive-approximation-register (LC-SAR) hybrid analog-to-digital converter (ADC) that combines an LC ADC with an SAR ADC, which may be used for Internet of Things (IoT) random sparse event scenarios. The sampling frequency of a traditional LC ADC is usually proportional to the maximum instantaneous rate of change of the input signal; therefore, a higher input signal frequency inevitably leads to higher system power consumption. However, the proposed hybrid ADC uses the input level difference between the two moments before and after level-crossing detection, thereby ensuring a higher conversion precision and lower power consumption, even at higher input signal frequencies. Compared with traditional LC ADC or SAR ADC, the proposed hybrid ADC combines the ultralow-power advantage of LC ADC with the high-precision advantage of SAR ADC in converting IoT data with sparse characteristics such as ECG, EEG, and brain potential. The LC-SAR hybrid ADC is designed with a 0.18 μm CMOS process and consumes 4.34 μW at a 1.8 V supply voltage, achieving an SNDR of 67.41 dB and a bandwidth of 20 kHz. The spectrum analysis result was 10.85 ENOB when the input sinusoidal signal was 14.975 kHz. When inputted with an ECG signal, the system power consumption was as low as 0.49 μW. Furthermore, the proposed hybrid ADC obtained a good figure of merit, with FoMw and FoMs reaching 58.8 fJ/conv.steps and 164 dB, respectively. Compared to a conventional uniform sampling ADC, approximately 80% of the power savings and an 8x compression ratio can be achieved in physiological signal acquisition applications. Full article

The 8b/10b IBM encoding scheme is used in a plethora of communication technologies, including USB, Gigabit Ethernet, and Serial ATA. We propose two primitive-based structural designs of an 8b/10b encoder and two of an 8b/10b decoder, all targeted at modern AMD FPGA architectures. Our aim is to reduce the amount of resources used for the implementations. We compare our designs with implementations resulting from behavioral models as well as with state-of-the-art solutions from the literature. The implementation results show that our solutions provide the lowest resource utilization with comparable maximum operating frequency and power consumption. The proposed structural designs are suitable for resource-constrained data communication protocol implementations that employ the IBM 8b/10b encoding scheme. This paper is an extended version of our paper published at the 2022 International Symposium on Electronics and Telecommunications (ISETC), Timisoara, Romania, 10–11 November 2022. Full article

With the recent rapid development of IT technology, the demand for multifunctional semiconductor devices capable of high performance has increased rapidly, and the miniaturization of such devices has also faced limitations. To overcome these limitations, various studies have investigated three-dimensional packaging methods of stacking devices, and among them, hybrid bonding is being actively conducted during the bonding process. studies of hybrid bonding during the bonding process are active. In this study, Cu bonding using a nano passivation layer was carried out for Cu/SiO₂ hybrid bonding applications, with Au and Ag deposited on Cu at the nano level and used as a protective layer to prevent Cu oxidation and to achieve low-temperature Cu bonding. Au was deposited at about 12 nm, and Ag was deposited at about 15 nm, with Cu bonding carried out at 180 °C for 30 min, after which an annealing process was conducted at 200 °C for one hour. After bonding, the specimen was diced into a 1 cm × 1 cm chip, and the bonding interface was analyzed using SEM and TEM. Additionally, the 1 cm × 1 cm chip was diced into 2 mm × 2 mm specimens to measure the shear strength of the bonded chip, and the average shear strength of Au and Ag was found to be 5.4 and 6.6 MPa, respectively. The degree of diffusion between Au-Cu and Ag-Cu was then investigated; the diffusion activation energy when Au diffuses to Cu was 6369.52 J/mol, and the diffusion activation energy when Ag diffuses to Cu was 17,933.21 J/mol. Full article

In order to meet the increasing demands of wireless communication for ISM bands, a 433 MHz transmitter RF front-end is designed using a 55 nm low-power CMOS technology. The circuits consist of an active mixer, a driver amplifier and a class-E power amplifier (PA). A double-balanced Gilbert active mixer is designed to realize binary phase-shift keying (BPSK) modulation. The driver is used to preamplify the modulated RF signals. The class-E PA adopts a parallel four-branch cascode structure to control the output power level. The load network of the PA is implemented through an off-chip circuit, in which a finite DC-feed inductance load network is selected to reduce the power loss. The mixer and driver are designed with a 1.2 V supply voltage, while the PA is operated at a 1.8 V supply voltage. The area of the chip is 0.206 mm × 0.089 mm, and the measured results show that it achieves a maximum output power of 2.7 dBm, with a total power consumption of 6.72 mW. At a drain efficiency (DE) of 34.5%, an $S_{22}$ less than −10 dB over the frequency ranges from 393.79 MHz to 455.70 MHz can be measured for the PA. With 192 kbps BPSK data modulated at 433 MHz, the measured EVM is about 0.83% rms. Full article

Iron impurities are believed to act as deep acceptors that can compensate for the n-type conductivity in as-grown Ga₂O₃, but several scientific issues, such as the site occupation of the Fe heteroatom and the complexes of Fe-doped β-Ga₂O₃ with native defects, are still lacking. In this paper, based on first-principle density functional theory calculations with the generalized gradient approximation approach, the controversy regarding the preferential Fe incorporation on the Ga site in the β-Ga₂O₃ crystal has been addressed, and our result demonstrates that Fe dopant is energetically favored on the octahedrally coordinated Ga site. The structural stabilities are confirmed by the formation energy calculations, the phonon dispersion relationships, and the strain-dependent analyses. The thermodynamic transition level Fe³⁺/Fe²⁺ is located at 0.52 eV below the conduction band minimum, which is consistent with Ingebrigtsen’s theoretical conclusion, but slightly smaller than some experimental values between 0.78 eV and 1.2 eV. In order to provide direct guidance for material synthesis and property design in Fe-doped β-Ga₂O₃, the defect formation energies, charge transitional levels, and optical properties of the defective complexes with different kinds of native defects are investigated. Our results show that V_Ga and O_i can be easily formed for the Fe-doped β-Ga₂O₃ crystals under O-rich conditions, where the +3 charge state Fe_GaGa_i and −2 charge state Fe_GaO_i are energetically favorable when the Fermi level approaches the valence and conduction band edges, respectively. Optical absorption shows that the complexes of Fe_GaGa_i and Fe_GaV_Ga can significantly enhance the optical absorption in the visible-infrared region, while the energy-loss function in the β-Ga₂O₃ material is almost negligible after the extra introduction of various intrinsic defects. Full article

Trap density refers to the density of electronic trap states within dielectric materials that can capture and release charge carriers (electrons or holes) in a semiconductor channel, affecting the transistor’s performance. This study aims to investigate the influence of trap density on the electrothermal behavior of nanowire gate-all-around GAAFET devices. The numerical solution of Poisson’s equations and continuity equations, coupled with the heat conduction model, has been used to predict the temperature inside the GAAFET device. The finite element method has been used to discretize the semiconductor equations. Investigations have been carried out on a number of physical and geometric parameters, such as oxide thickness, nanowire radius, and gate length. Their effects on output characteristics and device temperature have been discussed. A thinner oxide thickness, lower device radius, and longer channel length led to a higher current flow. Results also reveal that high trap densities can have significant impacts on the degradation of electronic devices, particularly in the context of semiconductor devices like transistors. Full article

The intrinsic n-type conduction in Gallium oxides (Ga₂O₃) seriously hinders its potential optoelectronic applications. Pursuing p-type conductivity is of longstanding research interest for Ga₂O₃, where the Cu- and Zn-dopants serve as promising candidates in monoclinic β-Ga₂O₃. However, the theoretical band structure calculations of Cu- and Zn-doped in the allotrope α-Ga₂O₃ phase are rare, which is of focus in the present study based on first-principles density functional theory calculations with the Perdew–Burke–Ernzerhof functional under the generalized gradient approximation. Our results unfold the predominant Cu¹⁺ and Zn²⁺ oxidation states as well as the type and locations of impurity bands that promote the p-type conductivity therein. Furthermore, the optical calculations of absorption coefficients demonstrate that foreign Cu and Zn dopants induce the migration of ultraviolet light to the visible–infrared region, which can be associated with the induced impurity 3d orbitals of Cu- and Zn-doped α-Ga₂O₃ near the Fermi level observed from electronic structure. Our work may provide theoretical guidance for designing p-type conductivity and innovative α-Ga₂O₃-based optoelectronic devices. Full article

As the core carrier of information storage, a semiconductor memory device is a basic product with a large volume that is widespread in the integrated circuit industry. With the rapid development of semiconductor manufacturing processes and materials, the internal structure of memory has gradually shifted from a 2D planar packaging structure to a 3D packaging structure to meet industry demands for high-frequency, high-speed, and large-capacity devices with low power consumption. However, advanced 3D packaging technology can pose some reliability risks, making devices prone to failure, especially when used in harsh environmental conditions, including temperature changes, high temperature and humidity levels, and mechanical stress. In this paper, the authors introduce the typical structure characteristics of 3D packaged memory; analyze the reasons for device failure caused by stress; summarize current research methods that utilize temperature, mechanical and hygrothermal theories, and failure models; and present future challenges and directions regarding the reliability research of 3D packaged memory. Full article

In floating gate compute-in-memory (CIM) chips, due to the gate equivalent capacitance of the large-scale array and the parasitic capacitance of the long-distance transmission wire, it is difficult to balance the switching speed and area of the word line driver circuit (WLDC). The difference among multiple voltage domains required for floating gate CIM devices has also far exceeded the withstand voltage range of a single transistor in the WLDC. This paper proposes a novel WLDC based on the working principle of the CIM array. A multi-level pre-processing voltage control method is adopted to carry out an optional hierarchical transmission of multiple high voltages, significantly reducing the propagation delay. The proposed WLDC is based on the Wilson current mirror structure, which substantially reduces the physical design area. The simulation results show that the circuit can convert a 1.2 V low-voltage domain input signal with a frequency of 10 MHz into a high-voltage domain output voltage, and the output voltage range of a single WLDC can reach −10 V to 10 V. With a capacitive load within 5 pF, the transmission delay is less than 10 ns. The layout area is 594.88 µm², which is suitable for a large-scale CIM array. Full article

The monolithic integration structure of the AlGaN/InGaN/GaN−based high electron mobility transistor (HEMT) and light−emitting diode (LED) is attractive in LED lighting and visible light communication (VLC) systems owing to the reduction in parasitic elements by removing metal interconnections. Due to the band−offset and polarization effect, inserting a certain thickness in the InGaN layer into the traditional AlGaN/GaN single heterostructure increases the density of 2DEG to nearly twice the original. At the same time, inserting the InGaN quantum well layer can also improve the luminous efficiency of LED. In this paper, the physical models of two−dimensional electron gas (2DEG) densities and the threshold voltage of AlGaN/InGaN/GaN HEMTs are established and verified with experimental results from the literature. According to the calculation results, the two−dimensional electron gas (2DEG) density in the AlGaN/InGaN/GaN HEMT is 1.47 × 10¹³ cm⁻², and the two−dimensional hole gas (2DHG) density is 0.55 × 10¹³ cm⁻², when Al% = 0.2, In% = 0.1, d_AlGaN = 20 nm. In addition, a physical model for the radiative recombination rate in the monolithic integration structure of HEMT−LED is proposed. This work provides a design guideline for AlGaN/InGaN/GaN HEMT and its application in visible light communication systems. Full article

This manuscript presents a fully differential difference transconductance amplifier (FDDTA) architecture based on CMOS inverters. Designed in a 130-nm CMOS process it operates in weak inversion when supplied with 0.25 V. In addition, the FDDTA requires no supplementary external calibration circuit, like tail current or bias voltage sources, since it relies on the distributed layout technique that intrinsically matches the CMOS inverters. For analytical purposes, we carried out a detailed investigation that describes all the concepts and the whole operation of the FDDTA architecture. Furthermore, a comparison between the modeling equations and measured data assures high performance. Full article

In this study, a K-band complementary metal oxide semiconductor (CMOS) power amplifier was designed using a low-power (LP) process to improve the integration of the beamforming system. In order to reduce the overall system size, a 180° phase-shift function was mounted. It was designed in a four-stage structure to secure sufficient gain. In addition, we propose a way to secure wideband characteristics by utilizing the gains of each of the four stages. The power amplifier was designed with a 40-nm LP CMOS process to verify the feasibility of the proposed technique. The measured P_1dB for 0° and 180° phase-shift modes were 15.25 dBm and 14.30 dBm, respectively, at the operating frequency of 25.0 GHz. The measured phase difference between the two modes was 217° at the 25.0 GHz. Full article

This paper presents a synaptic driving circuit design for processing in-memory (PIM) hardware with a thin-film transistor (TFT) embedded flash (eFlash) for a binary/ternary-weight neural network (NN). An eFlash-based synaptic cell capable of programming negative weight values to store binary/ternary weight values (i.e., ±1, 0) and synaptic driving circuits for erase, program, and read operations of synaptic arrays have been proposed. The proposed synaptic driving circuits improve the calculation accuracy of PIM operation by precisely programming the sensing current of the eFlash synaptic cell to the target current (50 nA ± 0.5 nA) using a pulse train. In addition, during PIM operation, the pulse-width modulation (PWM) conversion circuit converts 8-bit input data into one continuous PWM pulse to minimize non-linearity in the synaptic sensing current integration step of the neuron circuit. The prototype chip, including the proposed synaptic driving circuit, PWM conversion circuit, neuron circuit, and digital blocks, is designed and laid out as the accelerator for binary/ternary weighted NN with a size of 324 × 80 × 10 using a 0.35 μm CMOS process. Hybrid bonding technology using bump bonding and wire bonding is used to package the designed CMOS accelerator die and TFT eFlash-based synapse array dies into a single chip package. Full article

In this paper, a crown-shaped trench gate formed by a sidewall spacer in insulated gate bipolar transistors (IGBT) is proposed to improve breakdown voltage. When a sidewall spacer is added to trench bottom corners, the electric field is distributed to the surface of the sidewall spacer and decreased to 48% peak value of the electric field. Thus, the sidewall spacer IGBT improved to 5% breakdown voltage. Another study proposed an additional oxide layer for trench bottom corners and improved breakdown voltage similar to the proposed IGBT. Previous studies have shown degradation in other electrical characteristics. However, this study shows a sidewall spacer IGBT that increases the current over 3% compared to a conventional trench IGBT when the applied gate voltage is under 4 V. Additionally, the turn-off loss characteristic is similar to conventional trench IGBT. Therefore, the breakdown voltage of the IGBT was improved while maintaining similar electrical properties to existing IGBTs through the crown-shaped gate. Full article

In this paper, the residual stresses with a nanoscale depth resolution at TSV-Cu/TiW/SiO₂/Si interfaces under different thermal loadings are characterized using the ion-beam layer removal (ILR) method. Moreover, the correlations of residual stress, microstructure, and the failure modes of the interfaces are discussed. The residual stresses at the interfaces of TSV-Cu/TiW, TiW/SiO₂, and SiO₂/Si are in the form of small compressive stress at room temperature, then turn into high-tensile stress after thermal cycling or annealing. In addition, the maximum residual stress inside the TSV-Cu is 478.54 MPa at room temperature, then decreases to 216.75 MPa and 90.45 MPa, respectively, after thermal cycling and annealing. The microstructural analysis indicates that thermal cycling causes an increase in the dislocation density and a decrease in the grain diameter of TSV-Cu. Thus, residual stress accumulates constantly in the TSV-Cu/TiW interface, resulting in the cracking of the interface. Furthermore, annealing leads to the cracking of more interfaces, relieving the residual stress as well as increasing the grain diameter of TSV-Cu. Besides this, the applicability of the ILR method is verified by finite element modeling (FEM). The influence of the geometric errors of the micro-cantilever beam and the damage to the materials introduced by the focused ion beam (FIB) in the experimental results are discussed. Full article

This paper describes a 2.4-GHz fully-integrated front-end receiver including a single-pole triple-throw (SP3T) switch and a low-noise amplifier (LNA) with bypass function, which was fabricated in a 0.25 μm GaAs pHEMT process. An asymmetrical SP3T switch architecture is incorporated to enable the receiver to operate in four modes. The exploration of impedance and voltage gain behavior of the proposed LNA help to establish the matching network and alleviate the trade-off between noise figure (NF) and gain performance. In LNA high gain mode, the implemented front-end receiver shows 1.7 dB of NF and 6dBm of input third-order intercept point (IIP3) with 20 dB of power gain drawing 11 mA of current from 5 V power supply at 2.4 GHz. All input and output return loss had exceeded 10 dB with fully on-chip impedance matching network. In bypass mode, the measured insertion loss of typically 7.5 dB is achieved. Full article

In this paper, a novel ring-gate structure AlGaN/GaN HEMT device is proposed and fabricated successfully. When the gate-source spacing Lgs = 5 μm, gate-drain spacing Lgd = 7 μm, gate length Lg = 3 μm, the maximum drain current I_dmax of this ring-gate AlGaN/GaN HEMT device improved by 161.8% comparing with the conventional structure device, the threshold voltage Vth increased by 66.7% from 1.65 V to 2.5 V. In order to further improve the performance of the device, a series of electrode structure optimization designs have been carried out. Firstly, the effect of source-drain electrode alloy type and etching depth under source-drain region on the transfer and output characteristics was investigated, we fabricated devices with two alloy electrodes of multi-layer Ti/Al/Ti/Al/Ti/Al/Ni/Au and single layer Ti/Al/Ni/Au, then perform groove etching under the source and drain electrodes, the etching depth is set to 10/20 nm, after analysis and calculation, it is found that among ring-gate and conventional-gate devices, the device with multi-layer electrodes and an etched depth of 10 nm performs best. Then, the influence of device size parameters on transfer and output characteristics was explored, devices with different Lg and Lgd were prepared, after testing it is found that with the increase of Lg, the Vth of the conventional-gate and ring-gate HEMT devices both showed a positive-shift trend, in conventional device Vth increased from 1.53 V to 1.7 V, and this value increased from 1.5 V to 2.5 V in ring-gate device; the saturation drain current decreases when Lg increasing, and the decrease of the ring-gate device is more obvious, from 51.28 mA at Lg = 3 μm to 24.48 mA at Lg = 6 μm; when Lds decreases, the Vth of the two structures doesn’t change significantly, but the output current increases with the reduction of Lds, among them, the I_dmax of the conventional structure device at Lgd = 19 um is 79.07% lower than that at Lgd = 7 μm; the value of the ring-gate device is reduced by 113.7%. In addition, among all the above devices, the ring-gate devices all show better output characteristics and higher Vth than conventional devices. Full article

The pressure conductive silicone rubber socket (PCR) is one of the promising test socket devices in high-speed testing environments. In this study, we report highly dense PCR device channels comprised of high aspect-ratio flake-shaped Ni powders. The shape-controlled Ni powders are prepared by the high-energy milling process. The scanning electron microscopy (SEM) and particle size analyzer (PSA) results of the synthesized powder samples showed well-defined flake type Ni powder morphology, and the powder sizes are distributed in the range of ~24–49 μm. The cross-sectional SEM study of the fabricated PCR revealed that the channels consisting of flake Ni powder are uniformly, densely distributed, and connected as face-to-face contact. The resistance of the PCR channels comprised of flake-shaped Ni powders showed ~23% lower resistance values than the spherical-shaped Ni powders-based channels, which could be due to the face-to-face contact of the powders in the channels. The magnetic properties study for the flake-type Ni powder showed a high remanence (~2.2 emu/g) and coercivity (~5.24 mT), owing to the shape anisotropy factor. Finally, the fabricated highly dense and conductive channels of the silicone rubber socket device by shape-controlled Ni powder could be a potential test socket device. Full article