Special Issues

Micromachines publishes Special Issues to create collections of papers on specific topics, with the aim of building a community of authors and readers to discuss the latest research and develop new ideas and research directions. Special Issues are led by Guest Editors, who are experts on the topic. The journal’s Editor-in-Chief and/or designated EBM will oversee Guest Editor appointments and Special Issue proposals, checking their content for relevance and ensuring the suitability of the material for the journal. The papers published in a Special Issue will be collected and displayed on a dedicated page of the journal’s website. For any inquiries related to a Special Issue, please contact the Editorial Office.

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Novel Surface and Bulk Acoustic Wave Devices
edited by Wei Luo, Chengjie Zuo, and Jian Zhou
submission deadline 31 Dec 2024 | 6 articles | Viewed by 6407 | Submission Open
Keywords: surface acoustic waves; bulk acoustic waves; RF filters (Hybrid; SAW; BAW); acoustic wave sensors; RF-MEMS
(This special issue belongs to the Section A:Physics)
Intelligent Micro-Manufacturing and Applications submission deadline 31 Dec 2024 | 3 articles | Viewed by 4443 | Submission Open
(This special issue belongs to the Section E:Engineering and Technology)
Advances in Sensors and Electronic Instrumentation 2024 submission deadline 31 Dec 2024 | 2 articles | Viewed by 3830 | Submission Open
Keywords: microelectronic devices; optoelectronics; sensors; transducers; measuring instrumentation; MEMS; NEMS; electronics; plasmonics; metasurfaces; wearables; neuromorphic computing; photonic neural networks
Bioinspired Interface and Fluid Manipulation: From Fundamentals to Applications
edited by and
submission deadline 31 Dec 2024 | 4 articles | Viewed by 3759 | Submission Open
Keywords: bioinspired interface; fluid manipulation; droplet; wettability; microfluidics; bioinspired surface; bubbles; soft materials
(This special issue belongs to the Section E:Engineering and Technology)
Semiconductors and Nanostructures for Electronics and Photonics, Second Edition submission deadline 31 Dec 2024 | 3 articles | Viewed by 3320 | Submission Open
Keywords: 2D materials; doping; twisting; exciton; phonon; quantum states; critical temperature
(This special issue belongs to the Section D:Materials and Processing)
Feature Papers of Micromachines in 'Materials and Processing' 2024 submission deadline 31 Dec 2024 | 1 articles | Viewed by 2675 | Submission Open
Keywords: biomedical microdevices micro/nanofabrication BioMEMS organs-on-a-chip; minimally invasive devices; wearable devices; biosensors; 3D bioprinting; MEMS and CMOS technologies; point-of-care devices; III– V devices; thin-film transistors; artificial intelligence with applications in micro/nanofabrication and sensors
(This special issue belongs to the Section D:Materials and Processing)
New Advances in Wearable and Flexible Sensor Devices and Their Future Prospects submission deadline 31 Dec 2024 | 1 articles | Viewed by 1171 | Submission Open
Keywords: physical sensors; electrochemical biosensors; wearable electronics; flexible; stretchable; nanomaterials; composite materials; 2D materials; elastomeric substrates; textile-based sensors; sensitivity; limit of detection; reliability; biocompatibility
(This special issue belongs to the Section E:Engineering and Technology)
Feature Papers of Micromachines in ‘Engineering and Technology’ 2024 submission deadline 31 Dec 2024 | 1 articles | Viewed by 463 | Submission Open
Keywords: micro/nano fabrication and manufacturing; design and optimization principles of micro- and nanosystems; micro-nanosystems and advanced technologies for engineering applications; electronic system (including electrical circuits and devices; transistors; capacitors; inductors; resistors; diodes; insulators and conductors) engineering
(This special issue belongs to the Section E:Engineering and Technology)
Research Progress of Advanced SiC Semiconductors
edited by
submission deadline 31 Dec 2024 | 1 articles | Viewed by 420 | Submission Open
Keywords: 3C-SiC; 4H-SiC; bulk growth; epitaxial growth; oxidation; film characteristics; FET device; power device
(This special issue belongs to the Section D1: Semiconductor Devices)
Applications of Data Sciences in Semiconductor Industry: Design, Manufacturing, Packaging and Testing
edited by and Yu-Po Wang
submission deadline 31 Dec 2024 | Viewed by 260 | Submission Open
Keywords: data sciences; machine/deep learning; artificial intelligence; optimization; semiconductor; integrated circuit design/manufacturing/packaging/testing; thermal/electrical simulation; design and advanced packaging development
(This special issue belongs to the Section D:Materials and Processing)
Thin Film Microelectronic Devices and Circuits
edited by Chengyuan Dong
submission deadline 31 Dec 2024 | 1 articles | Viewed by 206 | Submission Open
Keywords: thin film electronic devices; thin film transistors; thin film solar cells; thin film sensors; thin film memory; stability; flexibility; thin film circuits; pixel circuits; active-matrix addressing; systems on glass; CMOS technology; semiconductor displays; intelligent sensors; semiconductor memory
(This special issue belongs to the Section D1: Semiconductor Devices)
The 15th Anniversary of Micromachines submission deadline 31 Dec 2024 | Viewed by 190 | Submission Open
Keywords: micro-/nano-scale multiphysics phenomena; micro-/nano-scale devices; various materials based micro- and nano-structures; devices; systems; micro- and nano- fabrication and manufacturing; micro- and nano-technologies in biological; chemical; medical; environmental and energy applications
Recent Progress in 2D Semiconductor Materials and Devices
edited by , Guoqing Xin, , and Dezhong Cao
submission deadline 31 Dec 2024 | Viewed by 172 | Submission Open
Keywords: 2D semiconductor materials; advanced processes; photodetectors; quantum devices; MOSFET devices; semiconductor device reliability; first-principles calculations; modelling and simulation; intelligent design
(This special issue belongs to the Section D1: Semiconductor Devices)
Feature Papers of Micromachines in Physics 2024
edited by
submission deadline 31 Dec 2024 | Viewed by 115 | Submission Open
(This special issue belongs to the Section A:Physics)
MEMS Ultrasonic Transducers
edited by , , Changde He and Zhuochen Wang
submission deadline 31 Dec 2024 | Viewed by 110 | Submission Open
Keywords: PMUT; CMUT; miniature ultrasound transducers; thin-film transducer; hydrophone; ultrasound imaging; ultrasound testing; wearable ultrasound
(This special issue belongs to the Section A:Physics)
Lab on Chips and Optical Detection Methods submission deadline 31 Dec 2024 | Viewed by 105 | Submission Open
Keywords: lab-on-a-chip; optical sensors; optical actuators; absorbance; fluorescence; surface plasmon resonance; waveguides; optic fiber; biomedical application; chemical application; cell cultures; organotypic cultures
(This special issue belongs to the Section E:Engineering and Technology)
High Energy Additive Manufacturing of Advanced Materials
edited by
submission deadline 31 Dec 2024 | Viewed by 100 | Submission Open
Keywords: high energy additive manufacturing (HEAM) processes; advanced materials by HEAM; performance and applications of HEAM; post-processing of HEAM parts; modeling and design of AM processes
(This special issue belongs to the Section D3: 3D Printing and Additive Manufacturing)
Advances in MEMS Inertial Sensors
edited by Tong Zhou, Jing Zhang and Yan Su
submission deadline 31 Dec 2024 | Viewed by 100 | Submission Open
Keywords: MEMS inertial sensors; inertial navigation systems; inertial measurement units
(This special issue belongs to the Section A:Physics)
Feature Papers of Micromachines in Biology and Biomedicine 2024
edited by
submission deadline 31 Dec 2024 | Viewed by 100 | Submission Open
(This special issue belongs to the Section B:Biology and Biomedicine)
Wide-Bandgap Semiconductor Devices: Materials, Fabrication, and Applications
edited by Junshuai Xue, Xi Jiang and Song Yuan
submission deadline 31 Dec 2024 | Viewed by 96 | Submission Open
Keywords: wide-bandgap semiconductor materials and devices; power semiconductor devices; semiconductor performance characterization; power electronics; semiconductor device fabrication; semiconductor device reliability
(This special issue belongs to the Section A:Physics)
Functional Nanostructured Organic and Hybrid Materials: Synthesis, Characterization and Applications in Micromachines submission deadline 31 Dec 2024 | Viewed by 75 | Submission Open
Keywords: organic small molecules; polymers; inorganic nanostructures; hybrid composites; developing nanostructured organic and hybrid materials by wet and dry methods; laser and vapor deposition techniques; lithography processing; characterization of the organic and hybrid nanomaterials; devices integrating functional nanostructured organic and hybrid materials
(This special issue belongs to the Section D:Materials and Processing)
Microfluidic Nanoparticle Synthesis
edited by and Bo Liu
submission deadline 31 Dec 2024 | Viewed by 71 | Submission Open
Keywords: microfluidics; lab-on-a-chip; miniaturized reactors; nanoparticles; nanocomposites; hybrid nanostructures or nanocomposites; nanomaterial synthesis; biosensing; environmental monitoring
(This special issue belongs to the Section D:Materials and Processing)
Recent Advances in 3D Printed Electronics
edited by Sung Hyun Park
submission deadline 31 Dec 2024 | Viewed by 70 | Submission Open
Keywords: 3D printing system; functional material ink; multi-material 3D printing; electronics on freeform surfaces; 3D printed circuit; 3D printed sensor; 3D printed optoelectronic device
(This special issue belongs to the Section D1: Semiconductor Devices)
Soft Actuators: Design, Fabrication and Applications, 2nd Edition
edited by , and
submission deadline 31 Dec 2024 | Viewed by 60 | Submission Open
Keywords: soft robotics; soft actuators; smart materials; bio-inspired designs; novel fabrication techniques; control of soft actuators; soft robotics applications
(This special issue belongs to the Section A:Physics)
MEMS Packaging Technologies and 3D Integration, 3rd Edition
edited by
submission deadline 31 Dec 2024 | Viewed by 58 | Submission Open
Keywords: MEMS; packaging; bonding; integration; vacuum; implantable; biocompatibility; reliability
(This special issue belongs to the Section D:Materials and Processing)
Surface and Bulk Acoustic Wave Devices submission deadline 31 Dec 2024 | Viewed by 56 | Submission Open
Keywords: acoustic wave sensors; piezoelectric materials; signal processing; fabrication techniques; material innovations; device optimization; theoretical modeling
(This special issue belongs to the Section A:Physics)
Nanoscale Lithography—Pressing Miniaturization towards Ever Smaller Sizes
edited by
submission deadline 31 Dec 2024 | Viewed by 54 | Submission Open
Keywords: nanolithography; nanopatterning; Scanning Probe Microscopy (SPM); nanoscience; nanomaterials; organic films and polymers; nanofabrication
(This special issue belongs to the Section E:Engineering and Technology)
Micro and Nanofluidics for Biomedical and Aerospace Applications
edited by , and Beatriz D. Cardoso
submission deadline 31 Dec 2024 | Viewed by 50 | Submission Open
Keywords: microfluidics; nanofluids; biomicrofluidics; microgravity; microfabrication; mass transport; heat transport; computational fluid dynamics; lab-on-a-chip; organ-on-chips; cell mechanics; nanoparticles; blood flow; microcirculation; biosensors
(This special issue belongs to the Section A:Physics)
Feature Reviews in Micromachines 2024
edited by
submission deadline 31 Dec 2024 | Viewed by 48 | Submission Open
Novel Information Storage Micro/Nano Materials and Micro/Nano Devices
edited by Yue Peng
submission deadline 31 Dec 2024 | Viewed by 46 | Submission Open
Keywords: novel principle devices for realizing storage; novel ferroelectric storage materials and improvement of their non-ideal properties; fabrication of resistance random access memory (RRAM) and performance improvement; phase change storage materials and their devices; simulated and design of novel types of information storage materials; neuromorphic devices and integrated technology
(This special issue belongs to the Section D:Materials and Processing)
Nanotechnology for Biomedical Imaging
edited by Damber Thapa
submission deadline 31 Dec 2024 | Viewed by 45 | Submission Open
Keywords: the development of novel nanoparticle-based contrast agents for imaging; nanoparticle-mediated targeted imaging and drug delivery; advances in imaging technologies; clinical translation and future prospects of nanotechnology in biomedical imaging; advanced image analysis techniques; nanotechnology-based therapeutic approaches; applications in cancer therapy
(This special issue belongs to the Section B:Biology and Biomedicine)
Biosensors for Diagnostic and Detection Applications, 2nd Edition submission deadline 31 Dec 2024 | Viewed by 36 | Submission Open
Keywords: biosensors; diagnostics; biotechnology; biomedicine; nanomaterials
(This special issue belongs to the Section B1: Biosensors)
Biosensors for Pathogen Detection 2024
edited by
submission deadline 31 Dec 2024 | Viewed by 28 | Submission Open
Keywords: pathogen detection; DNA sensors; nucleic acids; optical biosensors; electrochemical biosensors; acoustic biosensors; nanomaterials; point of care; lab-on-chip
(This special issue belongs to the Section B1: Biosensors)
Advances in Micro/Nano Systems for Blood Analysis and Intravascular Applications
edited by , Chaoyu Yang and Xingping Quan
submission deadline 31 Dec 2024 | Viewed by 17 | Submission Open
Keywords: intravascular applications; micro/nano systems; thrombosis; microfluidic devices; targeted drug delivery
(This special issue belongs to the Section B:Biology and Biomedicine)
Recent Development of Micro/Nanofluidic Devices, 2nd Edition submission deadline 31 Dec 2024 | Viewed by 17 | Submission Open
Keywords: micromixer; microreactor; microseparator; microsprayer; micro/nano sensor; micro/nano fabrication; droplet manipulation; lab on a chip
(This special issue belongs to the Section E:Engineering and Technology)
Exploring the Potential Applications of Microfluidics
edited by
submission deadline 31 Dec 2024 | Viewed by 2 | Submission Open
Keywords: Microfluidic flow; microchannels; fabrication of microfluidic components; microfluidic circuits; microfluidic applications; particles fabrication; particles separation; particle detection; liposomes; microfluidics vs. milifluidics; hybrid microfluidics
Advanced Photonic Biosensors: From Materials Research to Applications
edited by and
submission deadline 30 Jan 2025 | Viewed by 68 | Submission Open
Keywords: sensors; biosensors; biomedical sensors; environment sensors; biomarker detection; enzyme-based biosensors; microstructure sensors; metasurface sensors; optic sensors; smart sensors; portable sensors; artificial intelligent/machine learning
(This special issue belongs to the Section B:Biology and Biomedicine)
Emerging Quantum Optical Devices and Their Applications
edited by Yu Zhou and Junfeng Wang
submission deadline 31 Jan 2025 | Viewed by 49 | Submission Open
Keywords: quantum devices; quantum optics; quantum hardware and quantum chips
(This special issue belongs to the Section A:Physics)
Piezoelectric MEMS/NEMS—Materials, Devices, and Applications, Third Edition
edited by
submission deadline 31 Jan 2025 | Viewed by 24 | Submission Open
Keywords: piezoelectric sensors and actuators; microrobotics; piezoelectric MEMS resonators; acoustic MEMS devices; surface acoustic wave devices; energy-harvesting technologies; simulation and modeling of piezoelectric MEMS; application of smart materials in MEMS; micro/nanofabrication
(This special issue belongs to the Section E:Engineering and Technology)
Nanomaterials for Micro/Nano Devices, 2nd Edition submission deadline 31 Jan 2025 | Viewed by 22 | Submission Open
Keywords: nanomaterials; nanocomposites; nanoelectronics; micro/nano devices; synthesis and characterization; integration and performance; energy harvesting; sensing and actuation; biomedicine
(This special issue belongs to the Section D:Materials and Processing)
Nanomaterials for Sensors and Energy Storage Applications
edited by Muhammad Hilal and
submission deadline 31 Jan 2025 | Viewed by 18 | Submission Open
Keywords: nanomaterials; 2D materials; polymers; composites; supercapacitors; batteries; gas sensors; wearable sensors; biosensors
(This special issue belongs to the Section D:Materials and Processing)
Development and Applications of Small-Scale Soft Robotics
edited by , , Ren Tao and
submission deadline 31 Jan 2025 | Viewed by 6 | Submission Open
Keywords: small-scale soft robotics; micro-scale soft robotics; soft actuators; soft robotics sensors; control systems for small-scale soft robotics; applications in extreme environments; integration of soft robotics
(This special issue belongs to the Section E:Engineering and Technology)
Advanced Applications in Microrobots submission deadline 20 Feb 2025 | Viewed by 26 | Submission Open
Keywords: magnetic microrobots; micro-scale robotics; biomimetic robotics; microfluidics; microassembly; targeted drug delivery; micro-manipulation; soft robotics
(This special issue belongs to the Section A:Physics)
Latest Advancements in Semiconductor Materials, Devices, and Systems, 2nd Edition
edited by , and Jun Cao
submission deadline 28 Feb 2025 | Viewed by 27 | Submission Open
Keywords: semiconductors; fabrication; simulation; circuits; systems; machine learning
(This special issue belongs to the Section D1: Semiconductor Devices)
Revolutionary Advances in 2D and 1D Material Based Electronics
edited by Xiyuan Feng and Yunlei Zhong
submission deadline 28 Feb 2025 | Viewed by 8 | Submission Open
Keywords: nanoelectronics; 2D Materials; 1D Materials; material synthesis and characterization; device architecture; transistors; sensors; energy storage; fundamental physics; electronic components
(This special issue belongs to the Section A:Physics)
Microelectronics Assembly and Packaging: Materials and Technologies, 2nd Edition
edited by and Youngwoo Kim
submission deadline 28 Feb 2025 | Viewed by 4 | Submission Open
Keywords: semiconductor packaging; advanced packaging; chip and wire bonding technology; mixed-assembly technology; multichip modules (MCM); package-on-package (PoP); system-in-package (SiP); heterogeneous integration; chiplet interconnection; hybrid bonding; 2.5D (interposer); 3D (TSV/TGV); packaging materials; materials qualification
(This special issue belongs to the Section E:Engineering and Technology)
Advanced Micromixing Technology
edited by
submission deadline 31 Mar 2025 | Viewed by 11 | Submission Open
Keywords: microfluidic mixing; mixing efficiency; passive micromixer; active micromixer; acoustic; electric; pressure; magnetic field; etc.; micromixing technology; obstacles; serpentine; lamination and spiral structures; etc.
(This special issue belongs to the Section A:Physics)
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