E：Engineering and Technology

Special Issues

Following special issues within this section are currently open for submissions:

• Wearable Bioelectronics: Technology, Challenges and Applications (Deadline: 30 May 2023)
• Analog and Mixed-Signal Electronics and Microsystems for Ubiquitous Sensing and Intelligence (Deadline: 31 May 2023)
• Recent Advancements in Flexible, Reconfigurable and Wearable Antennas for 5G and Beyond (Deadline: 31 May 2023)
• Network-on-Chip (NoC) and Related Technologies and Applications (Deadline: 31 May 2023)
• Three-Dimensional Display Technologies (Deadline: 31 May 2023)
• IoT-Based Smart Security Alarm Systems (Deadline: 31 May 2023)
• Design Trends in RF/Microwave Filtering and Memristive Devices (Deadline: 31 May 2023)
• Advance in Energy Conversion and Storage: Material, Design and Application (Deadline: 31 May 2023)
• Hybrid Printed Electronics (Deadline: 31 May 2023)
• Nano- and Microfluidic Materials and Systems (Deadline: 31 May 2023)
• 3D Printed Soft and Musculoskeletal Actuators, 2nd Edition (Deadline: 1 June 2023)
• Advanced Manufacturing Technology and Systems, Volume II (Deadline: 10 June 2023)
• Selected Papers from the 4th International Conference on the Challenges, Opportunities, Innovations and Applications in Electronic Textiles 2022 (Deadline: 15 June 2023)
• Beyond Moore’s Law: Hardware Specialization and Advanced System on Chip (Deadline: 16 June 2023)
• Advanced Antenna System: Structural Analysis, Design and Application (Deadline: 20 June 2023)
• Hardware-Friendly Machine Learning and Its Applications, 2nd Edition (Deadline: 25 June 2023)
• Embedded System for Smart Sensors/Actuators and IoT Applications (Deadline: 30 June 2023)
• Microwave Passive Components (Deadline: 30 June 2023)
• Micro and Smart Devices and Systems, 2nd Edition (Deadline: 30 June 2023)
• Kinetic Energy Harvesting at Low Frequency (Deadline: 30 June 2023)
• Embedded Artificial Intelligence for Energy and Sustainability Issues (Deadline: 30 June 2023)
• Functional Nanoparticles, from Single-Particle to Assembly (Deadline: 30 June 2023)
• Advanced Interconnect and Packaging, Volume II (Deadline: 30 June 2023)
• Passive and Active THz Components (Deadline: 30 June 2023)
• Advanced Biomanufacturing for Biomedical Engineering Applications (Deadline: 30 June 2023)
• Applications of Modern Artificial Intelligence and Antenna Technology: Design, Materials, Processing Techniques, Signal Processing and Sensing Methods (Deadline: 30 June 2023)
• Microfluidics for Food Science Applications (Deadline: 30 June 2023)
• Microelectronics Assembly and Packaging: Materials and Technologies (Deadline: 30 June 2023)
• Nonlinear Dynamics in MEMS/NEMS (Deadline: 30 June 2023)
• New Trends in Microwave/Millimeter Antennas/Filters: From Fundamental Research to Applications (Deadline: 30 June 2023)
• Medical Micro/Nanorobots (Deadline: 30 June 2023)
• Magnetic Microrobots for Biomedical Applications (Deadline: 10 July 2023)
• Microcontrollers and Microprocessors: The Advanced System on the Chip (Deadline: 10 July 2023)
• System-on-a-Chip (SoC): Design and Applications (Deadline: 10 July 2023)
• Piezoelectric MEMS/NEMS—Materials, Devices, and Applications, Volume II (Deadline: 15 July 2023)
• 3D Holographic Displays (Deadline: 15 July 2023)
• Micromachined Acoustic Transducers for Audio-Frequency Range (Deadline: 30 July 2023)
• New Advances in Ionic-Drift Resistive Switching Memory and Neuromorphic Applications, 2nd Edition (Deadline: 30 July 2023)
• Machine Learning in Bioengineering (Deadline: 31 July 2023)
• Novel Computing Architectures and Digital Circuit Designs Using Memristors and Memristive Systems, 2nd Edition (Deadline: 31 July 2023)
• MEMS Inertial Device (Deadline: 31 July 2023)
• Novel Developments in Waveguides and Antennas (Deadline: 31 July 2023)
• Small-Scale Thermoelectric Generators (Deadline: 31 July 2023)
• Recent Advances in Emerging Transistor Technologies and Their Applications (Deadline: 31 July 2023)
• Recent Advances in Soft Robotics and Flexible Electronics: From Materials to Applications (Deadline: 31 July 2023)
• Micro/Nano-Machining of Functional Structures and Surfaces (Deadline: 31 July 2023)
• Recent Advances in Integrated Non-reciprocal Devices (Deadline: 31 July 2023)
• Digital Microfluidics for Liquid Handling and Biochemical Analysis (Deadline: 31 July 2023)
• Advances in Microfluidic Techniques for Soft Matter Science (Deadline: 31 July 2023)
• Power Electronics and Power Conversion-Related Applications of Micro Energy Devices, Volume II (Deadline: 15 August 2023)
• Smart Sensing (Deadline: 15 August 2023)
• FPGA Applications and Future Trends (Deadline: 15 August 2023)
• Oxide and Carbon Materials Based Sensors (Deadline: 20 August 2023)
• Nonlinear Dynamics of MEMS/NEMS: Fundamentals and Applications (Deadline: 20 August 2023)
• Advanced Technology in Perovskite Optoelectronic Device (Deadline: 25 August 2023)
• Intelligent Approaches in Biosensing (Deadline: 30 August 2023)
• Emerging Micro Manufacturing Technologies and Applications, 2nd Edition (Deadline: 31 August 2023)
• Advances in Electrowetting Devices, Volume II (Deadline: 31 August 2023)
• Micro- and Nano-Systems for Manipulation, Actuation and Sensing (Deadline: 31 August 2023)
• Microfluidic Synthesis (Deadline: 31 August 2023)
• Piezoelectric Materials, Devices and Integrated Systems (Deadline: 31 August 2023)
• Emerging Packaging and Interconnection Technology (Deadline: 31 August 2023)
• Nanostructures for Application in Electronics and Renewable Energy Sources (Deadline: 31 August 2023)
• Advanced Technologies in Memristor Devices (Deadline: 31 August 2023)
• Next Generation of Power Electronics Components, Devices and Control Techniques (Deadline: 10 September 2023)
• Applications of Pulsed Laser in Synthesis, Nanostructured Materials, and Spectroscopic Measurements for Optoelectronics and Environmental Fields (Deadline: 20 September 2023)
• Wireless Transceiver Design for RF/mm Waves and THz Communication (Deadline: 25 September 2023)
• Energy Harvesting Antennas and Circuits for Flexible Electronics (Deadline: 30 September 2023)
• Flexible Micromanipulators and Micromanipulation, 2nd Edition (Deadline: 30 September 2023)
• Artificial Intelligence for Micro/Nano Materials and Devices (Deadline: 15 October 2023)
• Recent Development of Micro/Nanofluidic Devices (Deadline: 20 October 2023)
• Recent Advances in Microwave Components and Devices (Deadline: 20 October 2023)
• Fiber Lasers and Applications (Deadline: 30 October 2023)
• Integration and Fabrication of Plasmonic and Photonic Nanostructures (Deadline: 31 October 2023)
• Machine-Learning-Assisted Sensors (Deadline: 31 October 2023)
• Advanced Technology in Micro and Nano Sensors: Fundamentals and Applications (Deadline: 31 October 2023)
• Micro/Nano Printing Technology and Devices (Deadline: 31 October 2023)
• High Power Fiber Laser Technology (Deadline: 31 October 2023)
• Recent Advances in Nanofluidics: Devices, Technologies and Applications (Deadline: 31 October 2023)
• Future Prospects of Thin-Film Transistors and Their Applications (Deadline: 10 November 2023)
• Future Wearable and Implants, 2nd Edition (Deadline: 15 November 2023)
• Methodology, Microfabrication and Applications of Advanced Sensing and Smart Systems, 2nd Edition (Deadline: 15 November 2023)
• Recent Advances in Electromagnetic Devices (Deadline: 15 November 2023)
• MEMS Nano/Microfabrication (Deadline: 20 November 2023)
• Micro and Nanosensors: Fabrication, Applications and Performance Enhancements (Deadline: 25 November 2023)
• Recent Advances in Micro/Nano-Fabrication (Deadline: 30 November 2023)
• New Generation of MEMS/NEMS Sensors and Actuators (Deadline: 30 November 2023)
• Miniaturized Piezoelectric Devices: Design, Fabrication and Applications (Deadline: 30 November 2023)
• Advances in Sensors, Algorithms and Machines for Intelligent Micro- and Nano-Systems (Deadline: 30 November 2023)
• Recent Advances in Memory Materials and Devices (Deadline: 30 November 2023)
• Structural Analyses and Designs for Flexible/Stretchable Electronics, Volume II (Deadline: 30 November 2023)
• Active Colloidal and Micro Systems for Propulsion and Manipulation (Deadline: 30 November 2023)
• Carbon-Based Composite Electrodes for Supercapacitors and Electrochemical Biosensors (Deadline: 25 December 2023)
• Progress and Challenges of Large-Scale Neural Recording (Deadline: 31 December 2023)
• Computational Tools and AI in Design and Micro-Manufacturing (Deadline: 31 December 2023)
• Heat Transfer and Fluid Flow in Microstructures (Deadline: 31 December 2023)
• Wearable Organic Electronics and Applications (Deadline: 31 December 2023)
• Feature Papers of Micromachines in Engineering and Technology 2023 (Deadline: 31 December 2023)
• Fabrication and Application of Advanced Nanosensors (Deadline: 31 December 2023)
• Recent Advances in Micro/Nanofabrication and Optical Devices (Deadline: 31 December 2023)
• Fluid Manipulation: From Fundamentals to Applications (Deadline: 31 December 2023)
• MEMS/NEMS for Sensing: Array, Integration, Intelligence and Application (Deadline: 31 December 2023)
• Next-Generation Intelligent Optoelectronic Chips, Devices and Systems (Deadline: 31 December 2023)
• Microelectronics and Optoelectronic Devices: From Fundamental Research to Advanced Applications (Deadline: 31 December 2023)
• Advanced Technology for Quantum Photonics and Devices (Deadline: 31 December 2023)
• Selected Papers from the 20th SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC 2023) (Deadline: 10 March 2024)