Special Issue "CMOS Integrated Circuits for Sensor Applications"
Deadline for manuscript submissions: 31 July 2024 | Viewed by 2452
Interests: circuit theory; theory and technical applications of oscillations; analog microelectronic circuit design; circuits for sensor applications
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Special Issue in Electronics: Analog Microelectronic Circuit Design and Applications
The development of CMOS technology during past several decades has stimulated many efforts to fabricate sensors directly on CMOS substrates. The attractive features of this approach include the miniaturization of the devices, low power consumption, batch fabrication at industrial standards, and low cost. Drawbacks of using CMOS technology include the limited selection of materials and predefined fabrication processes. Yet, sensor-specific materials and additional fabrication steps may be introduced as post-processing after the CMOS fabrication. From the other side, the monolithic integration of a sensor with the necessary circuitry allows for implementing both signal amplification and signal conditioning on the same chip. This improves the signal-to-noise ratio characteristics, since the bond-wires between sensor structure and circuitry, which potentially introduce noise in the system, can be avoided. Hence, despite the limited number of IC compatible materials available to realize silicon integrated sensors, it is often possible using the interface circuitry to compensate all the limitations, such as low sensitivity, nonlinearities, and parasitic effects. This makes integrated sensors competitive with discrete sensors. The efforts to package a monolithic chip are lower in comparison to multichip solutions. Moreover, the quality and reliability standards of established industrial CMOS processes render single-chip systems very attractive for rapid commercialization. The goal of this Special Issue is to draw attention to both aspects of using CMOS technology for sensor integration.
Prof. Dr. Igor Filanovsky
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- CMOS technology
- sensor integration
- post-processing steps
- signal conditioning