Advanced Polyimides and Other High Performance Polymers

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".

Deadline for manuscript submissions: closed (30 May 2022) | Viewed by 28275

Special Issue Editors


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Guest Editor
Department of Industrial Chemistry, Graduate School of Engineering, Tokyo Polytechnic University, Atsugi, Kanagawa 243-0297, Japan
Interests: advanced polyimides for optoelectric devices; low-k and low dielectric loss polymer materials; polymers for energy and separation technologies; high performance polymers with controlled durability and degradability
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Guest Editor
Department of Chemical Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan
Interests: polymeric materials; recision polymerization
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
1. Key Laboratory of Science and Technology on High-Tech Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
2. School of Chemical Sciences, University of Chinese Academy of Sciences, Beijing 100190, China
Interests: high temperature resistant polyimide resin; carbon fiber reinforced composite material; functional epoxy resin; heat-resistant polymer insulation material

Special Issue Information

Dear Colleagues,

For the last three decades, the increasing need in the high-technology industries has been the driving force for the development of new polymeric systems and materials combining thermal, mechanical, and high-temperature resistance or other properties such as high transparency, dimensional stability, chemical stability, and processability. The features of advanced polyimides and other high-performance polymers are now well recognized and used with long-term durability under harsh conditions. New structures originating from the chemical modification of polymer backbones or from the creation of new architectures are under development for advanced technologies for the future. The scope of this Special Issue includes all aspects of the synthesis, fabrication, physico-chemical properties, ultimate properties, processing, and applications of advanced polyimides and other high-performance polymers needed in highly developed technologies. Applications of particular interest include films, membranes, fibers, coatings, adhesives, composite matrices, and active polymers for potential use in sectors such as optoelectronics, energy electronics, telecommunications, transportation, and aerospace. 

Prof. Dr. Toshihiko Matsumoto
Prof. Dr. Der-Jang Liaw
Prof. Dr. Shiyong Yang
Guest Editors

Manuscript Submission Information

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Keywords

  • advanced polyimides
  • colorless and thermally stable polymer films
  • high Tg and low CTE polymers
  • ultrahigh modulus and strength polymers
  • polymers for electronic/optoelectronic applications
  • polymer materials for energy electronics
  • polymer micro- and nano-composites
  • structure–property relationship

Published Papers (8 papers)

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Research

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30 pages, 2917 KiB  
Article
Solution-Processable Colorless Polyimides Derived from Hydrogenated Pyromellitic Dianhydride: Strategies to Reduce the Coefficients of Thermal Expansion by Maximizing the Spontaneous Chain Orientation Behavior during Solution Casting
by Masatoshi Hasegawa, Katsuki Ichikawa, Shuichi Takahashi and Junichi Ishii
Polymers 2022, 14(6), 1131; https://doi.org/10.3390/polym14061131 - 11 Mar 2022
Cited by 14 | Viewed by 2884
Abstract
In this study, practically useful colorless polyimides (PIs) with low coefficients of thermal expansion (CTEs) and other desirable properties were prepared from hydrogenated pyromellitic dianhydride (1-exo,2-exo,4-exo,5-exo-cyclohexanetetracarboxylic dianhydride, H-PMDA). A modified one-pot polymerization method afforded a [...] Read more.
In this study, practically useful colorless polyimides (PIs) with low coefficients of thermal expansion (CTEs) and other desirable properties were prepared from hydrogenated pyromellitic dianhydride (1-exo,2-exo,4-exo,5-exo-cyclohexanetetracarboxylic dianhydride, H-PMDA). A modified one-pot polymerization method afforded a high-molecular-weight PI with sufficient film-forming ability from 2,2′-bis(trifluoromethyl)benzidine (TFMB) with a rod-like structure and H-PMDA. However, the PI film cast from its homogeneous solution did not have low CTEs, similar to the analogous system using meta-tolidine. To solve this problem, a series of amide- and amide-imide-containing diamines were designed and synthesized. The modified one-pot polymerization of H-PMDA and the diamines in γ-butyrolactone produced homogeneous, viscous, and stable solutions of high-molecular-weight PIs with high solid contents. The cast films of certain systems examined in this study simultaneously achieved low CTEs, high optical transparency, considerably high glass transition temperatures (Tgs), and sufficient ductility. A possible mechanism for the generation of low CTEs, which is closely related to the spontaneous in-plane orientation behavior during solution casting, was proposed. Certain H-PMDA-based PIs developed in this study are promising colorless heat-resistant plastic substrates for use in image display devices and other optical applications. Full article
(This article belongs to the Special Issue Advanced Polyimides and Other High Performance Polymers)
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11 pages, 2979 KiB  
Article
Colorless Polyimides Derived from an Alicyclic Tetracarboxylic Dianhydride, CpODA
by Hiroki Ozawa, Eriko Ishiguro, Yuri Kyoya, Yasuaki Kikuchi and Toshihiko Matsumoto
Polymers 2021, 13(16), 2824; https://doi.org/10.3390/polym13162824 - 22 Aug 2021
Cited by 29 | Viewed by 4028
Abstract
An alicyclic tetracarboxylic dianhydride having cyclopentanone bis-spironorbornane structure (CpODA) was polycondensated with aromatic dianhydrides to form the corresponding poly(amic acid)s which possessed logarithmic viscosities in the range 1.47–0.54 dL/g. The poly(amic acid) was imidized by three methods: a chemical, a thermal, and a [...] Read more.
An alicyclic tetracarboxylic dianhydride having cyclopentanone bis-spironorbornane structure (CpODA) was polycondensated with aromatic dianhydrides to form the corresponding poly(amic acid)s which possessed logarithmic viscosities in the range 1.47–0.54 dL/g. The poly(amic acid) was imidized by three methods: a chemical, a thermal, and a combined chemical and thermal process. In a thermal method, imidization temperature markedly influenced the film quality and molecular weight of the polyimide. When the poly(amic acid) was cured over the Tg of the corresponding polyimide, the flexible polyimide films were obtained and the molecular weights increased several times, which means that the post-polymerization took place. In spite of low-temperature cure below Tg flexible films with the imidization ratio of 100% were fabricated by a combined chemical and thermal imidization technique. The films possessed the decomposition temperatures in a range of 475–501 °C and Tgs over 330 °C. The high Tg results from a dipole–dipole interaction between the keto groups of the polymer chains as well as development of the rigid polyalicyclic unit. The polyimide films exhibited CTE between 17 and 57 ppm/K. All the films fabricated were entirely colorless and possessed the λcut-offs shorter than 337 nm. Notably, the films prepared by a chemical method exhibited outstanding optical properties. Full article
(This article belongs to the Special Issue Advanced Polyimides and Other High Performance Polymers)
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14 pages, 7604 KiB  
Article
The Effect of Molecular Isomerism on the Barrier Properties of Polyimides: Perspectives from Experiments and Simulations
by Yiwu Liu, Fengyun Xie, Jie Huang, Jinghua Tan, Chengliang Chen, Linbing Jiang, Wei Sun and Hailiang Zhang
Polymers 2021, 13(11), 1749; https://doi.org/10.3390/polym13111749 - 27 May 2021
Cited by 7 | Viewed by 1824
Abstract
A novel carbazole-containing diamine (M-2,7-CPDA) isomer of our previously reported diamine 2,7-CPDA, has been synthesized using a two-step synthesis. Compared with 2,7-CPDA, the substituted position of amino is changed from para to meta for M-2,7-CPDA. The two diamines were polymerized with pyromellitic dianhydride [...] Read more.
A novel carbazole-containing diamine (M-2,7-CPDA) isomer of our previously reported diamine 2,7-CPDA, has been synthesized using a two-step synthesis. Compared with 2,7-CPDA, the substituted position of amino is changed from para to meta for M-2,7-CPDA. The two diamines were polymerized with pyromellitic dianhydride (PMDA) to prepare two isomeric polyimides (M-2,7-CPPI and 2,7-CPPI), respectively. The effects of para/meta isomerism on microstructures and gas barrier performances of the two isomeric polyimides were studied by positron annihilation test, X-ray diffraction and molecular simulation. The results display that meta-connected M-2,7-CPPI has less ordered chain structure and weaker hydrogen bonding than para-connected 2,7-CPPI, which leads to loose chain stacking and thereby increased free volumes of M-2,7-CPPI. The higher free volumes promote the solubility and diffusivity of gas in M-2,7-CPPI. As a result, the meta-linked M-2,7-CPPI shows a lower gas barrier than its para-linked analog. The work provides guidance for the design and synthesis of high-performance barrier polymers. Full article
(This article belongs to the Special Issue Advanced Polyimides and Other High Performance Polymers)
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20 pages, 5360 KiB  
Article
“All Polyimide” Mixed Matrix Membranes for High Performance Gas Separation
by Maijun Li, Zhibo Zheng, Zhiguang Zhang, Nanwen Li, Siwei Liu, Zhenguo Chi, Jiarui Xu and Yi Zhang
Polymers 2021, 13(8), 1329; https://doi.org/10.3390/polym13081329 - 19 Apr 2021
Cited by 3 | Viewed by 3279
Abstract
To improve the interfacial compatibility of mixed matrix membranes (MMMs) for gas separation, microporous polyimide particle (AP) was designed, synthesized, and introduced into intrinsic microporous polyimide matrix (6FDA-Durene) to form “all polyimide” MMMs. The AP fillers showed the feature of thermal stability, similar [...] Read more.
To improve the interfacial compatibility of mixed matrix membranes (MMMs) for gas separation, microporous polyimide particle (AP) was designed, synthesized, and introduced into intrinsic microporous polyimide matrix (6FDA-Durene) to form “all polyimide” MMMs. The AP fillers showed the feature of thermal stability, similar density with polyimide matrix, high porosity, high fractional free volume, large microporous dimension, and interpenetrating network architecture. As expected, the excellent interfacial compatibility between 6FDA-Durene and AP without obvious agglomeration even at a high AP loading of 10 wt.% was observed. As a result, the CO2 permeability coefficient of MMM with AP loading as low as 5 wt.% reaches up to 1291.13 Barrer, which is 2.58 times that of the pristine 6FDA-Durene membrane without the significant sacrificing of ideal selectivity of CO2/CH4. The improvement of permeability properties is much better than that of the previously reported MMMs, where high filler content is required to achieve a high permeability increase but usually leads to significant agglomeration or phase separation of fillers. It is believed that the excellent interfacial compatibility between the PI fillers and the PI matrix induce the effective utilization of porosity and free volume of AP fillers during gas transport. Thus, a higher diffusion coefficient of MMMs has been observed than that of the pristine PI membrane. Furthermore, the rigid polyimide fillers also result in the excellent anti-plasticization ability for CO2. The MMMs with a 10 wt.% AP loading shows a CO2 plasticization pressure of 300 psi. Full article
(This article belongs to the Special Issue Advanced Polyimides and Other High Performance Polymers)
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11 pages, 4737 KiB  
Article
Copolyamide-Imide Membrane with Low CTE and CME for Potential Space Optical Applications
by Jiajia Yin, Danbo Mao and Bin Fan
Polymers 2021, 13(7), 1001; https://doi.org/10.3390/polym13071001 - 24 Mar 2021
Cited by 9 | Viewed by 2017
Abstract
Polyimide diffractive membrane lens can be used in space optical telescope to reduce the size and mass of an imaging system. However, traditional commercial aromatic polyimide membrane is hard to meet the challenging requirements of dimensional stability and optical homogeneity for optical use. [...] Read more.
Polyimide diffractive membrane lens can be used in space optical telescope to reduce the size and mass of an imaging system. However, traditional commercial aromatic polyimide membrane is hard to meet the challenging requirements of dimensional stability and optical homogeneity for optical use. Based on molecular structure design and the optimization of fabrication process, the prepared copolyamide-imide membrane achieved the desired performance of membrane as an optical material. It showed a very low coefficient of thermal expansion (CTE), which is 0.95 ppm/°C over a temperature range of −150–100 °C and relatively low coefficient of moisture expansion (CME), which is only 13.30 ppm/% RH (0~90% RH). For the optical use, the prepared copolyamide-imide membrane (φ200 mm) achieved good thickness uniformity with wave-front error smaller than λ/30 (λ = 632 nm) in RMS (root mean square). Besides, it simultaneously meets the optical, thermal, and mechanical requirements for space telescope use. Copolyamide-imide membranes in this research with good comprehensive performance can be used as large aperture membrane optical system architectures. Full article
(This article belongs to the Special Issue Advanced Polyimides and Other High Performance Polymers)
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13 pages, 35751 KiB  
Article
Investigation of the Chemical Structure of Ultra-Thin Polyimide Substrate for the Xenon Flash Lamp Lift-off Technology
by Seong Hyun Jang, Young Joon Han, Sang Yoon Lee, Geonho Lee, Jae Woong Jung, Kwan Hyun Cho and Jun Choi
Polymers 2021, 13(4), 546; https://doi.org/10.3390/polym13040546 - 12 Feb 2021
Cited by 3 | Viewed by 3174
Abstract
Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe [...] Read more.
Lift-off is one of the last steps in the production of next-generation flexible electronics. It is important that this step is completed quickly to prevent damage to ultrathin manufactured electronics. This study investigated the chemical structure of polyimide most suitable for the Xe Flash lamp–Lift-Off process, a next-generation lift-off technology that will replace the current dominant laser lift-off process. Based on the characteristics of the peeled-off polyimide films, the Xe Flash lamp based lift-off mechanism was identified as photothermal decomposition. This occurs by thermal conduction via light-to-heat conversion. The synthesized polyimide films treated with the Xe Flash lamp–Lift-Off process exhibited various thermal, optical, dielectric, and surface characteristics depending on their chemical structures. The polyimide molecules with high concentrations of –CF3 functional groups and kinked chemical structures demonstrated the most promising peeling properties, optical transparencies, and dielectric constants. In particular, an ultra-thin polyimide substrate (6 μm) was successfully fabricated and showed potential for use in next-generation flexible electronics. Full article
(This article belongs to the Special Issue Advanced Polyimides and Other High Performance Polymers)
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Review

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17 pages, 4182 KiB  
Review
Templated Twist Structure Liquid Crystals and Photonic Applications
by Yao Gao, Weiping Ding and Jiangang Lu
Polymers 2022, 14(12), 2455; https://doi.org/10.3390/polym14122455 - 16 Jun 2022
Cited by 10 | Viewed by 1834
Abstract
Twist structure liquid crystals (TSLCs) have attracted increasing attention in photonic applications due to their distinct properties: Bragg reflection, scattering, and optical rotation. However, there exist some issues due to the defects of TSLCs: weak thermal stability, narrow bandwidth, and complicated fabrication. In [...] Read more.
Twist structure liquid crystals (TSLCs) have attracted increasing attention in photonic applications due to their distinct properties: Bragg reflection, scattering, and optical rotation. However, there exist some issues due to the defects of TSLCs: weak thermal stability, narrow bandwidth, and complicated fabrication. In this review, we introduce the templating technique which includes device structure, templating process, and photonic properties of templated TSLCs to improve the issues. Furthermore, a variety of photonic applications including lasing, optical filters and gratings based on TSLCs with polymer templates are presented. Additionally, other applications of TSLCs are briefly introduced. Finally, the remaining challenges and future perspectives of templated TSLCs are proposed. Full article
(This article belongs to the Special Issue Advanced Polyimides and Other High Performance Polymers)
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34 pages, 111731 KiB  
Review
Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties
by Ziyu Wu, Jianjun He, Haixia Yang and Shiyong Yang
Polymers 2022, 14(6), 1269; https://doi.org/10.3390/polym14061269 - 21 Mar 2022
Cited by 44 | Viewed by 7825
Abstract
Aromatic polyimides have excellent thermal stability, mechanical strength and toughness, high electric insulating properties, low dielectric constants and dissipation factors, and high radiation and wear resistance, among other properties, and can be processed into a variety of materials, including films, fibers, carbon fiber [...] Read more.
Aromatic polyimides have excellent thermal stability, mechanical strength and toughness, high electric insulating properties, low dielectric constants and dissipation factors, and high radiation and wear resistance, among other properties, and can be processed into a variety of materials, including films, fibers, carbon fiber composites, engineering plastics, foams, porous membranes, coatings, etc. Aromatic polyimide materials have found widespread use in a variety of high-tech domains, including electric insulating, microelectronics and optoelectronics, aerospace and aviation industries, and so on, due to their superior combination characteristics and variable processability. In recent years, there have been many publications on aromatic polyimide materials, including several books available to readers. In this review, the representative progress in aromatic polyimide films for electronic applications, especially in our laboratory, will be described. Full article
(This article belongs to the Special Issue Advanced Polyimides and Other High Performance Polymers)
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