Advanced Integrated Circuit Technology and Application
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".
Deadline for manuscript submissions: closed (20 February 2023) | Viewed by 5465
Special Issue Editor
Special Issue Information
Dear Colleagues,
This Special Issue offers scientists, engineers and researchers an excellent opportunity to present the latest research results, ideas, developments and applications. We are inviting contributions to a Special Issue of papers related to integrated circuit design, including theory, methods and applications in computing, consumers and control.
The success and popularity of integrated circuits (ICs) is related to the constant improvement of chip performance by IC manufacturers. With the continuous improvement of the complementary metal oxide semiconductor (CMOS) technology library and wafer fabrication technology, the CMOS process has reached its theoretical, practical and economic limits. Therefore, on the basis of maintaining the original chip functions, reducing the cost of integrated circuits has become an inevitable issue. IC designers and IC manufacturers are moving towards shrinking chip size, developing new chip materials, improving transistor structures, migrating integrated circuits to larger diameter silicon wafers, increasing wafer yield, increasing semiconductor factory automation, adopting 3D integrated circuits, using advanced IC packaging and improving system drivers.
In the last five years, IC design has seen exponential improvements in IC productivity and performance. Despite the increasing difficulty of improving chip performance, the IC design industry will continue to overcome the obstacles that lie ahead of it. Reducing chip size, increasing wafer diameter and increasing production yield have physical, statistical or economic constraints. As a result, the IC design industry will continue to advance technological advancements to address these limitations in order to continue to improve the performance and productivity of existing processes.
Potential topics include but are not limited to:
- Low power analog circuits;
- Power circuits;
- Energy harvesting circuits;
- Automotive integrated circuits;
- Biomedical integrated circuits;
- Wireless communication circuits;
- Sensor applications;
- AIoT networks;
- Artificial intelligence circuits;
- Embedded Systems;
Dr. Yitsen Ku
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
