Special Issue "Recent Advance in Ferroelectric Composites"
A special issue of Solids (ISSN 2673-6497).
Deadline for manuscript submissions: 30 September 2023 | Viewed by 1634
Interests: ferroelectric materials; thin films; nanocomposites; nanostructures; transmission electron microscopy; environmental sensing; shape memory alloys; networked matter; power electronic materials
Interests: composite sensors; magneto-plasmonic nanoparticles; chalkogenide thermoelectrics; energy materials, memristive devices; ferroelectric thin films; in operando TEM methods; solid state material analysis
Recent advances in the field of ferroelectric materials enable the introduction of new technological standards to address today’s societal needs for processing increasing amounts of energy and information. The latest research is dedicated to the materials themselves, thinking of environmentally friendly material compositions and new classes of ferroelectrics, e.g., wurtzite-type ferroelectrics such as AlScN. Their integration into composite structures offers advanced functionalities through the enhancement or coupling of properties, e.g., mechanoelectrical, for many kinds of applications.
This Special Issue aims to collect recent advances achieved in the field of ferroelectric composites and provide a comprehensive overview for all researchers, both new and well-established in the field.
In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following: energy conversion and storage, MEMS, non-volatile memory, and the next generation of power electronic devices.
We look forward to receiving your contributions.
Dr. Niklas Wolff
Prof. Dr. Lorenz Kienle
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Solids is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- power electronic devices
- non-volatile memory
- energy conversion and storage
- thin films
- advanced architectures
- nanostructure characterization
- coupling in composites
- simulation-based design