Tomographic and Multi-Dimensional Sensors
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".
Deadline for manuscript submissions: 30 April 2024 | Viewed by 1344
Special Issue Editors
Interests: electrical and electromagnetic tomography; X-ray CT; ultrasound tomography; multi-modality tomography, inverse problems and machine learning with applications in industrial tomography; robotic touch sensing and medical imaging
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Sensors typically provide key control information of critical parameters in manufacturing processes to meet environmental goals of maximum energy efficiency and minimised emissions, coupled with commercial goals of product quality and process plant utilisation. Many processes operate on bulk raw materials which are combined, perhaps over several stages, into the required intermediate or final form. To attain these general goals, it is often important to monitor a whole process space. In some processes, a single-point sensor may be located at a location assumed to represent a whole space, but variations in materials and process operations may invalidate this assumption. Current powerful process control systems have the potential to optimise process operations, but only when supplied with the most complete state data. Multi-dimensional sensors offer this major capability. The Special Issue presents papers which progress this key aim in novel proposals for appropriate multidimensional sensing configurations, typically in terms of spatial and material property values. Such sensor configurations will include data representations to suit on-line process control requirements. They may offer novel configurations of individual or hybrid sensing elements. A combination may offer a rolling time series for a specific spatial distribution, or an integrated view of a preferred composite representative parameter. SE papers should focus on novel sensor arrangement and methodology proposals, rather than whole application proposals, although they may include a wide range of specific materials, condition sensing (pressure, temperature, etc.), and states (gas, liquid, and solids).
Prof. Dr. Manuch Soleimani
Prof. Dr. Brian Hoyle
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- tomographic sensors
- multi-dimensional sensing
- process-sensing
