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Polymers
Special Issues
Polymer Composites: Design, Manufacture and Characterization
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Polymer Composites: Design, Manufacture and Characterization

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Composites and Nanocomposites".

Deadline for manuscript submissions: 31 May 2024 | Viewed by 1424

Special Issue Editor

Dr. Julfikar Haider

E-Mail Website
Guest Editor
Department of Engineering, Manchester Metropolitan University, Manchester, UK
Interests: surface engineering; thin film coating; metal machining; advanced welding; manufacturing; composite; dental materials; tribology; wear; machine learning; image processing; 3D printing
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Polymer composite materials have recently acquired a large range of applications in a number of areas, such as automotives, aerospace, biomedicine, sports, and even civil engineering. In this Special Issue, we are seeking both cutting-edge original research and review papers on the latest advancements in novel polymer composite/nanocomposite design, manufacturing, characterization, and modeling. Today, polymer composites encompass a large number of different synthetic and natural polymers as matrix material, and a wide variety of organic and inorganic filler materials in the form of fiber, macroparticles, microparticles, and nanoparticles. By optimizing the filler content, it is possible to customize the material properties of polymer composites for numerous applications as a structural or functional material (electrical, optical, thermal, and many more) with a lightweight construction. The recycling of conventional composite materials poses a significant challenge from an environmental point of view. More recently, polymers synthesized from biobased materials and with the addition of natural fiber have garnered significant attention among researchers for their ability to develop sustainable and biodegradable composite materials. The development of hybrid composite materials with multiple fillers and composite fabrication using 3D printing is of interest in this Special Issue.

Dr. Julfikar Haider
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • polymer
  • biobased polymer
  • composite
  • nanoparticle
  • natural fiber
  • biocomposites
  • physical characteristics
  • mechanical characteristics
  • composite design and characterization

Published Papers (2 papers)

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Research

23 pages, 14306 KiB  
Article
Improving the Accuracy of the Evaluation Method for the Interfacial Shear Strength of Fiber-Reinforced Thermoplastic Polymers through the Short Beam Shear Test
by Quan Jiang, Tetsuo Takayama and Akihiro Nishioka
Polymers 2024, 16(7), 883; https://doi.org/10.3390/polym16070883 - 23 Mar 2024
Viewed by 603
Abstract
Short fiber-reinforced thermoplastic polymers (SFRTPs) are commonly used in various molding methods due to their high specific elasticity and strength. To evaluate the interfacial strength, several determination methods have been proposed, including the interfacial shear strength (IFSS). In previous research, an IFSS evaluation [...] Read more.
Short fiber-reinforced thermoplastic polymers (SFRTPs) are commonly used in various molding methods due to their high specific elasticity and strength. To evaluate the interfacial strength, several determination methods have been proposed, including the interfacial shear strength (IFSS). In previous research, an IFSS evaluation method based on the short beam shear method was proposed. However, this method is only applicable to micrometer-sized fibers with high stiffness levels that are not easily bent. When utilizing cellulose fiber, the interfacial shear strength (IFSS) results frequently exhibit significant deviations. To tackle this issue, we suggest an enhanced experimental technique that employs beam-shaped specimens with welding points based on the short beam shear test. Furthermore, we conducted a three-dimensional analysis of the original method to determine the fiber orientation angle and IFSS. The outcomes were compared with previously reported determinations. The IFSS achieved through the novel method proposed in this paper exhibits high precision and reliability, rendering it suitable for use with soft and flexible fibers. Full article
(This article belongs to the Special Issue Polymer Composites: Design, Manufacture and Characterization)
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15 pages, 10737 KiB  
Article
Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components
by Pedro Morais, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy and Lucas F. M. da Silva
Polymers 2024, 16(4), 463; https://doi.org/10.3390/polym16040463 - 07 Feb 2024
Viewed by 573
Abstract
Semiconductor advancements demand greater integrated circuit density, structural miniaturization, and complex material combinations, resulting in stress concentrations from property mismatches. This study investigates the failure in two types of interfaces found in chip packages: silicon–epoxy mold compound (EMC) and polyimide–EMC. These interfaces were [...] Read more.
Semiconductor advancements demand greater integrated circuit density, structural miniaturization, and complex material combinations, resulting in stress concentrations from property mismatches. This study investigates the failure in two types of interfaces found in chip packages: silicon–epoxy mold compound (EMC) and polyimide–EMC. These interfaces were subjected to quasi-static and fatigue loading conditions. Employing a compliance-based beam method, the tests determined interfacial critical fracture energy values, (GIC), of 0.051 N/mm and 0.037 N/mm for the silicon–EMC and polyimide–EMC interfaces, respectively. Fatigue testing on the polyimide–epoxy interface revealed a fatigue threshold strain energy, (Gth), of 0.042 N/mm. We also observed diverse failure modes and discuss potential mechanical failures in multi-layer chip packages. The findings of this study can contribute to the prediction and mitigation of failure modes in the analyzed chip packaging. The obtained threshold energy and crack growth rate provide insights for designing safe lives for bi-material interfaces in chip packaging under cyclic loads. These insights can guide future research directions, emphasizing the improvement of material properties and exploration of the influence of manufacturing parameters on delamination in multilayer semiconductors. Full article
(This article belongs to the Special Issue Polymer Composites: Design, Manufacture and Characterization)
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