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Interfacial and Transport Phenomena between Liquid Metal and Solid Structural Materials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Physics".

Deadline for manuscript submissions: closed (30 June 2021) | Viewed by 20918

Special Issue Editors

Dr. Donatella Giuranno

E-Mail Website
Guest Editor
Institute of Condensed Matter Chemistry and Technologies for Energy (ICMATE), National Research Council of Italy (CNR), Via De Marini 6, 16149 Genoa, Italy
Interests: metals and alloys; metal–metal and metal–ceramic interactions; advanced materials and composites
Special Issues, Collections and Topics in MDPI journals
Dr. Wojciech Polkowski

E-Mail Website
Guest Editor
Łukasiewicz Research Network - Krakow Institute of Technology, Kraków, Poland
Interests: severe plastic deformation; plasticity; materials strengthening; solid/liquid interfacial phenomena; high temperature materials; intermetallics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Research activities in materials science typically range from basic and curiosity-motivated research to applications-oriented and the well known Materials Science paradigm is usually followed: Processing → Microstructure → Properties → Performance.

Nowadays, thanks to the use of computational models, an inversed trend is observing and the Material Designs approach is successfully taking off. Materials design basically focuses on the design and production of new materials exhibiting novel tailored-structures and properties meeting the requirements of specific applications. In order to succeed, the links with basic research cannot be disregarded. In particular, taking into account the influence of the process/working conditions on the final developed microstructures, investigations carried out by following the systematic approach of basic research still remain crucial. Such comprehensive and multidisciplinary investigations enable to optimize the manufacturing of advanced materials via vapour, solid and liquid-assisted processes such as PVD and CVD, solid state reactions, casting and solidification, metal infiltration, etc. In addition, post-production phenomena occurring within thermal treatments, or exposing in service the material to high temperatures and aggressive environments, can be predicted. In particular, the interaction phenomena occurring between dissimilar materials such as metals and ceramics are of particular relevance. 

The aim of this Special Issue is to stimulate worldwide researchers to share their most interesting experiences and know-how on the interaction observed when liquid metals are in contact with solid materials. For this purpose, original research articles, review articles, and significant preliminary communications are invited, with particular interest in articles describing current research trends and future perspectives in the manufacture of tailored advanced materials for highly demanding applications.

Potential topics include but are not limited to:

-Surfaces and Interfaces at high temperatures: theory versus experiment

-Surface and bulk properties of liquid metals and alloys.

-Oxidation of liquid metal surfaces

-Coatings

-Thermodynamic studies

-Wetting at high temperatures

-Soldering, Brazing and Joining processes

-Casting and solidification processes

-Reactive infiltration

-Corrosion of structural materials by liquid metals 

-Liquid-assisted processes

-Liquid and solid-state reactivity

-Improvements in the experimental investigation of liquid metal phases at high temperatures.

-Advanced composites materials

-Light-weight materials

Dr. Donatella Giuranno
Dr. Wojciech Polkowski
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Liquid metal/ceramic interfaces at high temperatures
  • Interfacial phenomena
  • Reactivity
  • Tailored structural materials
  • Advanced composites
  • Modelling
  • Transport phenomena

Published Papers (7 papers)

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Editorial

Jump to: Research, Review

3 pages, 183 KiB  
Editorial
Interfacial and Transport Phenomena between Liquid Metal and Solid Structural Materials
by Donatella Giuranno and Wojciech Polkowski
Materials 2022, 15(19), 6851; https://doi.org/10.3390/ma15196851 - 02 Oct 2022
Viewed by 782
Abstract
Research activities in materials science typically range from basic and curiosity-motivated research to that which is applications-oriented, and the well-known Materials Science paradigm is usually followed: Processing → Microstructure → Properties → Performance [...] Full article
(This article belongs to the Special Issue Interfacial and Transport Phenomena between Liquid Metal and Solid Structural Materials)

Research

Jump to: Editorial, Review

18 pages, 2883 KiB  
Article
Design of Composites by Infiltration Process: A Case Study of Liquid Ir-Si Alloy/SiC Systems
by Rada Novakovic, Simona Delsante and Donatella Giuranno
Materials 2021, 14(20), 6024; https://doi.org/10.3390/ma14206024 - 13 Oct 2021
Cited by 5 | Viewed by 1563
Abstract
The design of processing routes involving the presence of the liquid phase is mainly associated with the knowledge of its surface and transport properties. Despite this need, due to experimental difficulties related to high temperature measurements of metallic melts, for many alloy systems [...] Read more.
The design of processing routes involving the presence of the liquid phase is mainly associated with the knowledge of its surface and transport properties. Despite this need, due to experimental difficulties related to high temperature measurements of metallic melts, for many alloy systems neither thermodynamic nor thermophysical properties data are available. A good example of a system lacking these datasets is the Ir-Si system, although over the last fifty years, the structures and properties of its solid phases have been widely investigated. To compensate the missing data, the Gibbs free energy of mixing of the Ir-Si liquid phase was calculated combining the model predicted values for the enthalpy and entropy of mixing using Miedema’s model and the free volume theory, respectively. Subsequently, in the framework of statistical mechanics and thermodynamics, the surface properties were calculated using the quasi-chemical approximation (QCA) for the regular solution, while to obtain the viscosity, the Moelwyn-Hughes (MH) and Terzieff models were applied. Subsequently, the predicted values of the abovementioned thermophysical properties were used to model the non-reactive infiltration isotherm of Ir-Si (eutectic)/SiC system. Full article
(This article belongs to the Special Issue Interfacial and Transport Phenomena between Liquid Metal and Solid Structural Materials)
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16 pages, 6691 KiB  
Article
Enhancement of Mechanical Properties of Pure Aluminium through Contactless Melt Sonicating Treatment
by Agnieszka Dybalska, Adrian Caden, William D. Griffiths, Zakareya Nashwan, Valdis Bojarevics, Georgi Djambazov, Catherine E. H. Tonry and Koulis A. Pericleous
Materials 2021, 14(16), 4479; https://doi.org/10.3390/ma14164479 - 10 Aug 2021
Cited by 8 | Viewed by 2305
Abstract
A new contactless ultrasonic sonotrode method was previously designed to provide cavitation conditions inside liquid metal. The oscillation of entrapped gas bubbles followed by their final collapse causes extreme pressure changes leading to de-agglomeration and the dispersion of oxide films. The forced wetting [...] Read more.
A new contactless ultrasonic sonotrode method was previously designed to provide cavitation conditions inside liquid metal. The oscillation of entrapped gas bubbles followed by their final collapse causes extreme pressure changes leading to de-agglomeration and the dispersion of oxide films. The forced wetting of particle surfaces and degassing are other mechanisms that are considered to be involved. Previous publications showed a significant decrease in grain size using this technique. In this paper, the authors extend this research to strength measurements and demonstrate an improvement in cast quality. Degassing effects are also interpreted to illustrate the main mechanisms involved in alloy strengthening. The mean values and Weibull analysis are presented where appropriate to complete the data. The test results on cast Al demonstrated a maximum of 48% grain refinement, a 28% increase in elongation compared to 16% for untreated material and up to 17% increase in ultimate tensile strength (UTS). Under conditions promoting degassing, the hydrogen content was reduced by 0.1 cm3/100 g. Full article
(This article belongs to the Special Issue Interfacial and Transport Phenomena between Liquid Metal and Solid Structural Materials)
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16 pages, 7174 KiB  
Article
Interface Design in Lightweight SiC/TiSi2 Composites Fabricated by Reactive Infiltration Process: Interaction Phenomena between Liquid Si-Rich Si-Ti Alloys and Glassy Carbon
by Donatella Giuranno, Sofia Gambaro, Grzegorz Bruzda, Rafal Nowak, Wojciech Polkowski, Natalia Sobczak, Simona Delsante and Rada Novakovic
Materials 2021, 14(13), 3746; https://doi.org/10.3390/ma14133746 - 04 Jul 2021
Cited by 1 | Viewed by 2025
Abstract
To properly design and optimize liquid-assisted processes, such as reactive infiltration for fabricating lightweight and corrosion resistant SiC/TiSi2 composites, the extensive knowledge about the interfacial phenomena taking place when liquid Si-rich Si-Ti alloys are in contact with glassy carbon (GC) is of [...] Read more.
To properly design and optimize liquid-assisted processes, such as reactive infiltration for fabricating lightweight and corrosion resistant SiC/TiSi2 composites, the extensive knowledge about the interfacial phenomena taking place when liquid Si-rich Si-Ti alloys are in contact with glassy carbon (GC) is of primary importance. To this end, the wettability of GC by two different Si-rich Si-Ti alloys was investigated for the first time by both the sessile and pendant drop methods at T = 1450 °C. The results obtained, in terms of contact angle values, spreading kinetics, reactivity, and developed interface microstructures, were compared with experimental observations previously obtained for the liquid Si-rich Si-Ti eutectics processed under the same operating conditions. As the main outcome, a different Si content did not seem to affect the final contact angle values. Contrarily, the final developed microstructure at the interface and the spreading kinetics were observed as weakly dependent on the composition. From a practical point of view, Si-Ti alloy compositions with a Si content falling in the simple eutectic region of the Si-Ti phase diagram might be potentially used as infiltrating materials of C- and SiC-based composites. Full article
(This article belongs to the Special Issue Interfacial and Transport Phenomena between Liquid Metal and Solid Structural Materials)
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13 pages, 2977 KiB  
Article
Phase Diagram of Binary Alloy Nanoparticles under High Pressure
by Han Gyeol Kim, Joonho Lee and Guy Makov
Materials 2021, 14(11), 2929; https://doi.org/10.3390/ma14112929 - 29 May 2021
Cited by 3 | Viewed by 3281
Abstract
CALPHAD (CALculation of PHAse Diagram) is a useful tool to construct phase diagrams of various materials under different thermodynamic conditions. Researchers have extended the use of the CALPHAD method to nanophase diagrams and pressure phase diagrams. In this study, the phase diagram of [...] Read more.
CALPHAD (CALculation of PHAse Diagram) is a useful tool to construct phase diagrams of various materials under different thermodynamic conditions. Researchers have extended the use of the CALPHAD method to nanophase diagrams and pressure phase diagrams. In this study, the phase diagram of an arbitrary A–B nanoparticle system under pressure was investigated. The effects of the interaction parameter and excess volume were investigated with increasing pressure. The eutectic temperature was found to decrease in most cases, except when the interaction parameter in the liquid was zero and that in the solid was positive, while the excess volume parameter of the liquid was positive. Under these conditions, the eutectic temperature increased with increasing pressure. Full article
(This article belongs to the Special Issue Interfacial and Transport Phenomena between Liquid Metal and Solid Structural Materials)
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16 pages, 5913 KiB  
Article
Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite
by Yubin Zhang, Xinjiang Liao, Qiaoli Lin, Dekui Mu, Jing Lu, Hui Huang and Han Huang
Materials 2020, 13(7), 1532; https://doi.org/10.3390/ma13071532 - 27 Mar 2020
Cited by 5 | Viewed by 2326
Abstract
In this work, the reactive wetting and infiltration behaviors of a newly designed Sn-V binary alloy were comprehensively explored on porous graphite for the first time. It was discovered that 0.5 wt.% addition of V can obviously improve the wettability of liquid Sn [...] Read more.
In this work, the reactive wetting and infiltration behaviors of a newly designed Sn-V binary alloy were comprehensively explored on porous graphite for the first time. It was discovered that 0.5 wt.% addition of V can obviously improve the wettability of liquid Sn on porous graphite and the nominal V contents in Sn-V binary alloys has minor effects on the apparent contact angles wetted at 950 °C. Moreover, the V-containing Sn-V alloys were initiated to spread on porous graphite at ~650 °C and reached a quasi-equilibrium state at ~900 °C. Spreading kinetics of Sn-3V alloy on porous graphite well fitted in the classic product reaction controlled (PRC) model. However, our microstructural characterization demonstrated that, besides vanadium carbide formation, the adsorption of V element at the wetting three-phase contact line spontaneously contributed to the reactive spreading and infiltrating of Sn-V alloys on porous graphite. Meanwhile, the formation of continuous vanadium carbides could completely block the infiltration of Sn-V active solder alloy in porous graphite. Affected by the growth kinetics of vanadium carbides, the infiltration depth of Sn-V alloys in porous graphite decreased at increased isothermal wetting temperatures. This work is believed to provide implicative notions on the fabrication of graphite related materials and devices using novel V-containing bonding alloys. Full article
(This article belongs to the Special Issue Interfacial and Transport Phenomena between Liquid Metal and Solid Structural Materials)
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Review

Jump to: Editorial, Research

22 pages, 5484 KiB  
Review
Recent Advances in Barrier Layer of Cu Interconnects
by Zhi Li, Ye Tian, Chao Teng and Hai Cao
Materials 2020, 13(21), 5049; https://doi.org/10.3390/ma13215049 - 09 Nov 2020
Cited by 55 | Viewed by 7810
Abstract
The barrier layer in Cu technology is essential to prevent Cu from diffusing into the dielectric layer at high temperatures; therefore, it must have a high stability and good adhesion to both Cu and the dielectric layer. In the past three decades, tantalum/tantalum [...] Read more.
The barrier layer in Cu technology is essential to prevent Cu from diffusing into the dielectric layer at high temperatures; therefore, it must have a high stability and good adhesion to both Cu and the dielectric layer. In the past three decades, tantalum/tantalum nitride (Ta/TaN) has been widely used as an inter-layer to separate the dielectric layer and the Cu. However, to fulfill the demand for continuous down-scaling of the Cu technology node, traditional materials and technical processes are being challenged. Direct electrochemical deposition of Cu on top of Ta/TaN is not realistic, due to its high resistivity. Therefore, pre-deposition of a Cu seed layer by physical vapor deposition (PVD) or chemical vapor deposition (CVD) is necessary, but the non-uniformity of the Cu seed layer has a devastating effect on the defect-free fill of modern sub-20 or even sub-10 nm Cu technology nodes. New Cu diffusion barrier materials having ultra-thin size, high resistivity and stability are needed for the successful super-fill of trenches at the nanometer scale. In this review, we briefly summarize recent advances in the development of Cu diffusion-proof materials, including metals, metal alloys, self-assembled molecular layers (SAMs), two-dimensional (2D) materials and high-entropy alloys (HEAs). Also, challenges are highlighted and future research directions are suggested. Full article
(This article belongs to the Special Issue Interfacial and Transport Phenomena between Liquid Metal and Solid Structural Materials)
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