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Advanced Electronic Packaging Technology: From Hard to Soft
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Advanced Electronic Packaging Technology: From Hard to Soft

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Nanomaterials and Nanotechnology".

Deadline for manuscript submissions: 20 May 2024 | Viewed by 8195

Special Issue Editors

Dr. Yue Gu

E-Mail Website
Guest Editor
NanoEngineering Department, University of California San Diego, San Diego, CA, USA
Interests: soft electronic devices; electronic packaging; electrophysiology; flexible actuators and sensors; materials science
Dr. Yongjun Huo

E-Mail Website
Guest Editor
School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China
Interests: electronic packaging; heterogeneous integration; opto-electronics and photonic devices; flexible interconnection; materials science

Special Issue Information

Dear Colleagues,

This Special Issue, “Advanced Electronic Packaging Technology: From Hard to Soft”, will address advances in Electronic Packaging Technology, including design, structure, material, processing, and testing of electronic and photonic devices. A particular perspective of this Special Issue focuses on the technologies associated with soft design and engineering of electronic packaging, potentially used in soft electronic devices. Electronic devices have been rapidly developing with the growing necessities of high-computing, low-power consumption, miniaturization, and multi-function in computers and consumer electronics products. Advanced electronic packaging technologies bridge the design and use of the powerful functions of electronic devices, so it plays a significant role in their development.

Smart electronics permeate into human’s daily life and become the extension of the human body. Soft electronic packaging represents one of the most promising approaches to form imperceptive and comfortable interfaces of human and electronic devices. In this regard, the demonstration of advanced soft materials, structures, and design in advanced electronic packaging is strongly demanded to comply with the requirements of the developments of soft electronic devices.

Original papers are solicited on all types of advanced electronic packaging technologies involving designs, structures, materials, processing, and testing. Of particular interest are recent developments in soft materials, structures, processes, and devices. Articles and reviews dealing with electronic packaging technologies in wearable electronics and photonic devices are very welcome.

Dr. Yue Gu
Dr. Yongjun Huo
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electronic packing technology
  • soft electronic and photonic devices
  • solder alloys
  • thermal management
  • intrinsically soft materials
  • flexible and stretchable structures

Published Papers (7 papers)

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Editorial

Jump to: Research, Review

5 pages, 203 KiB  
Editorial
Advanced Electronic Packaging Technology: From Hard to Soft
by Yue Gu and Yongjun Huo
Materials 2023, 16(6), 2346; https://doi.org/10.3390/ma16062346 - 15 Mar 2023
Cited by 4 | Viewed by 1909
Abstract
Packaging is a pivotal step in electronic device manufacturing, determining the translational performance of bare chips [...] Full article
(This article belongs to the Special Issue Advanced Electronic Packaging Technology: From Hard to Soft)

Research

Jump to: Editorial, Review

17 pages, 6821 KiB  
Article
Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions
by Yexing Fang, Taiyu Wang, Yue Gu, Mingkun Yang, Hong Li, Sujun Shi, Xiuchen Zhao and Yongjun Huo
Materials 2024, 17(7), 1658; https://doi.org/10.3390/ma17071658 - 04 Apr 2024
Viewed by 437
Abstract
In soft electronics, anisotropic conductive adhesive films (ACFs) are the trending interconnecting approach due to their substantial softness and superior bondability to flexible substrates. However, low bonding pressure (≤1 MPa) and fine-pitch interconnections of ACFs become challenging while being extended in advanced device [...] Read more.
In soft electronics, anisotropic conductive adhesive films (ACFs) are the trending interconnecting approach due to their substantial softness and superior bondability to flexible substrates. However, low bonding pressure (≤1 MPa) and fine-pitch interconnections of ACFs become challenging while being extended in advanced device developments such as wafer-level packaging and three-dimensional multi-layer integrated circuit board assembly. To overcome these difficulties, we studied two types of ACFs with distinct conductive filler sizes (ACF-1: ~20 μm and ACF-2: ~5 μm). We demonstrated a low-pressure thermo-compression bonding technique and investigated the size effect of conductive particles on ACF’s mechanical properties in a customized testing device, which consists of flexible printing circuits and Flex on Flex assemblies. A consistency of low interconnection resistance (<1 Ω) after mechanical stress (cycling bending test up to 600 cycles) verifies the assembly’s outstanding electrical reliability and mechanical stability and thus validates the great effectiveness of the ACF bonding technique. Additionally, in numerical studies using the finite element method, we developed a generic model to disclose the size effect of Au/Ni-coated polymer fillers in ACF on device reliability under mechanical stress. For the first time, we confirmed that ACFs with smaller filler particles are more prone to coating fracture, leading to deteriorated electrical interconnections, and are more likely to peel off from substrate electrode pads resulting in electrical faults. This study provides guides for ACF design and manufacturing and would facilitate the advancement of soft wearable electronic devices. Full article
(This article belongs to the Special Issue Advanced Electronic Packaging Technology: From Hard to Soft)
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15 pages, 5277 KiB  
Article
Improvement of PbSn Solder Reliability with Ge Microalloying-Induced Optimization of Intermetallic Compounds Growth
by Zhibo Qu, Yilong Hao, Changhao Chen, Yong Wang, Shimeng Xu, Shuyuan Shi, Pengrong Lin and Xiaochen Xie
Materials 2024, 17(3), 724; https://doi.org/10.3390/ma17030724 - 02 Feb 2024
Viewed by 527
Abstract
PbSn solders are used in semiconductor devices for aerospace or military purposes with high levels of reliability requirements. Microalloying has been widely adopted to improve the reliability for Pb-free solders, but its application in PbSn solders is scarce. In this article, the optimization [...] Read more.
PbSn solders are used in semiconductor devices for aerospace or military purposes with high levels of reliability requirements. Microalloying has been widely adopted to improve the reliability for Pb-free solders, but its application in PbSn solders is scarce. In this article, the optimization of PbSn solder reliability with Ge microalloying was investigated using both experimental and calculation methods. Intermetallic compounds (IMC) growth and morphologies evolution during reliability tests were considered to be the main factors of device failure. Through first-principle calculation, the growth mechanism of interfacial Ni3Sn4 was discussed, including the formation of vacancies, the Ni-vacancies exchange diffusion and the dominant Ni diffusion along the [1 0 0] direction. The doping of Ge in the cell increased the exchange energy barrier and thus inhibited the IMC development and coarsening trend. In three reliability tests, only 0.013 wt% Ge microalloying in Pb60Sn40 was able to reduce IMC thickness by an increment of 22.6~38.7%. The proposed Ge microalloying method in traditional PbSn solder could yield a prospective candidate for highly reliable applications. Full article
(This article belongs to the Special Issue Advanced Electronic Packaging Technology: From Hard to Soft)
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13 pages, 4053 KiB  
Article
Synthesis of Cobalt Particles and Investigation of Their Electromagnetic Wave Absorption Characteristics
by Hong Li, Hongyang Li, Bo Sheng, Bing Zheng, Sujun Shi, Qing Cai, Wenqi Xu, Xiuchen Zhao and Ying Liu
Materials 2024, 17(1), 200; https://doi.org/10.3390/ma17010200 - 29 Dec 2023
Viewed by 530
Abstract
As the integration technology for integrated circuit (IC) packaging continues to advance, the issue of electromagnetic interference in IC packaging becomes increasingly prominent. Magnetic materials, acknowledged for their superior electromagnetic absorption capabilities, play a pivotal role in mitigating electromagnetic interference problems. In this [...] Read more.
As the integration technology for integrated circuit (IC) packaging continues to advance, the issue of electromagnetic interference in IC packaging becomes increasingly prominent. Magnetic materials, acknowledged for their superior electromagnetic absorption capabilities, play a pivotal role in mitigating electromagnetic interference problems. In this study, we employed a liquid-phase reduction method. We prepared three types of cobalt (Co) particles with distinct morphologies. Through variations in the synthesis process conditions, we were able to control the aspect ratio of protrusions on the surface of the Co particles. It was found that the sword-like Co particles exhibit superior electromagnetic wave absorption capabilities, showing a reflection loss value of up to −50.96 dB. Notably, when the coating thickness is only 1.6 mm, the effective absorption bandwidth is extended up to 7.6 GHz. The spatially expansive sword-like Co particles, with their unique structure featuring dipole polarization and interfacial polarization, demonstrated enhanced dielectric and magnetic loss capabilities, concurrently showcasing superior impedance-matching performance. Full article
(This article belongs to the Special Issue Advanced Electronic Packaging Technology: From Hard to Soft)
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15 pages, 9714 KiB  
Article
A Design Method for Rectangular Waveguide-Typed Microwave Devices Based on a Novel Origami Process
by Yipeng Sun, Chuyuan Gao, Lijun Chen and Lei Han
Materials 2023, 16(24), 7625; https://doi.org/10.3390/ma16247625 - 13 Dec 2023
Viewed by 696
Abstract
A novel design method based on a novel origami process that can create a solid structure swiftly and at a low cost is presented for rectangular waveguide-type microwave devices in this paper. A planar structure was fabricated by the lamination and laser cutting [...] Read more.
A novel design method based on a novel origami process that can create a solid structure swiftly and at a low cost is presented for rectangular waveguide-type microwave devices in this paper. A planar structure was fabricated by the lamination and laser cutting of polystyrene membranes and aluminum foils and was converted into a solid structure via origami in accordance with the selective absorption of infrared light. A rectangular waveguide, a rectangular waveguide-type coupler, and a power divider based on an origami structure with a multi-layer structure and a single-layer structure were fabricated and tested, demonstrating easy assembly and good microwave performance. The measured results of the rectangular waveguide indicated that the insertion loss was superior to −0.9 dB. Meanwhile, the results of the coupler showed that the coupling degree increased from −12.8 dB to −8.9 dB in the range of 11.0 GHz to 12.0 GHz. Correspondingly, the prepared power divider demonstrated that the return loss dwindled from −8.9 dB to −11.3 dB and that the insertion loss of one output port was approximate to that of the remaining one, varying between −3.5 dB and −5.2 dB in the range of 10.5 GHz to 11.5 GHz—verifying the effectiveness of the origami-based design method. Full article
(This article belongs to the Special Issue Advanced Electronic Packaging Technology: From Hard to Soft)
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15 pages, 5700 KiB  
Article
Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits
by Song Wang, Tianyu Hou, Rui Huo, Zhengtian Chen, Qinghua Zeng, Ying He, Yan Zhao and Xiao Liu
Materials 2023, 16(20), 6720; https://doi.org/10.3390/ma16206720 - 17 Oct 2023
Viewed by 696
Abstract
A microwave transmitter/receiver using the low-temperature co-fired ceramic substrate and ball grid array packaging demonstrates superior properties, including high integration, miniaturization, and high electromagnetic shielding. However, it holds limitations of inadequate hermeticity (that is, gas or moist impermeability), high cost, and low reproducibility. [...] Read more.
A microwave transmitter/receiver using the low-temperature co-fired ceramic substrate and ball grid array packaging demonstrates superior properties, including high integration, miniaturization, and high electromagnetic shielding. However, it holds limitations of inadequate hermeticity (that is, gas or moist impermeability), high cost, and low reproducibility. In this work, we aim to overcome these difficulties by introducing a new packing technique. The packaging utilizes an electroless plated Ni/Pd/Au surface, resulting in a significant enhancement of the packaging hermeticity by orders of magnitude, approaching the level of <5 × 10−9 Pa·m3/s. Both Sn63Pb37 and Au80Sn20 solder alloys demonstrate exceptional solderability, attributed to Pd atoms diffusing to the Au layer during soldering at 310 °C. A reliability test of the packaging shows that the shear strength of the solder balls drops after thermal shocks but negligibly affects the hermeticity of the packaging. Furthermore, a meticulously designed internal vertical interconnect structure and I/O interconnections were engineered in the ball grid array packaging, showcasing excellent transmission characteristics within the 10–40 GHz frequency range while ensuring effective isolation between ports. Full article
(This article belongs to the Special Issue Advanced Electronic Packaging Technology: From Hard to Soft)
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Review

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40 pages, 5035 KiB  
Review
Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review
by Ye Jin Jang, Ashutosh Sharma and Jae Pil Jung
Materials 2023, 16(24), 7652; https://doi.org/10.3390/ma16247652 - 14 Dec 2023
Cited by 1 | Viewed by 2076
Abstract
Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have [...] Read more.
Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency. Full article
(This article belongs to the Special Issue Advanced Electronic Packaging Technology: From Hard to Soft)
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