Materials for Nano- and Micro-Electro-Mechanical-Systems
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Nanomaterials and Nanotechnology".
Deadline for manuscript submissions: 20 September 2024 | Viewed by 3059
Special Issue Editor
Interests: nano- and micro-electro-mechanical-systems (N/MEMS); nano-joining and in-built-electronic-packaging; nano- and micro-assembly and integration; quantum electronic solids: superconductors; graphene/graphene-like materials; transition metal chalcogenides (TMD); nanoplasmonic sensors; photo-electro-chemical oxygen demand (PECOD) sensors; field-effect-transistor (FET)-based biosensors; autonomous and embedded sensors (Fit and Forget) and sensor nodes; energy harvesting; nanorobotics; digital design and fabrication technologies (digital factories); metal-insulator-metal tunneling diodes
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The materials selection, design, tuning and functionalization/passivation with these tuned materials are requirements for ultra-precision and possible shortest response and detection time for dynamic and accurate sensing in nano- and micro-system devices.
Moreover, cost reduction, scale-up, compatibility, and simplicity are major value additions and breakthroughs, in addition to high-responsivity, -sensitivity, and -precision.
Furthermore, the integration of nano- and micro-electro-mechanical devices, which are functionalized with emerging materials, to CMOS systems and their electronic packing are very challenging since it requires the multiple deposition of layers of dielectrics and metals, and results in an atomic mismatch that increases ohmic resistance, creating noise and reducing sensitivity, selectivity and responsivity.
This Special Issue aims to introduce materials and device design for “Nano- and Micro-Electro-Mechanical-Systems”. Topics include, but are not limited to, the following:
- Graphene/graphene-like and TMD materials based field-effect-transistors (FET)-sensors;
- Nanoplasmonic/ Photo-electro-chemical sensors;
- Thin -Film-Transistor (TFT)-based flexible sensors;
- DNA probe-sensors;
- Terahertz Resonant-Tunneling Diodes for sensing/detection/energy harvesting/wireless applications;
- Electrical, mechanical and optical testing of nano/micro-devices: sensors, actuators and harvesters;
- Dynamic electrical characterization of nano/micro-devices;
- Electro-mechanical packaging of nano/micro-devices and their nano/micro-assembly.
Prof. Dr. Mustafa Yavuz
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- nano- and micro-electro-mechanical-systems (N/MEMS)
- nano-joining and in-built-electronic-packaging
- nano- and micro-assembly and integration
- quantum electronic solids: superconductors, graphene/graphene-like materials, transition metal chalcogenides (TMD)
- nanoplasmonic sensors
- photo-electro-chemical oxygen demand (PECOD) sensors, field-effect-transistor (FET)-based biosensors
- autonomous and embedded sensors (fit and forget) and sensor nodes
- energy harvesting
- nanorobotics, digital design and fabrication technologies (Digital Factories)
- terahertz resonant-tunneling diodes
