Special Issue "Reliability Modeling of Complex Systems in Materials and Devices"
Deadline for manuscript submissions: 10 January 2024 | Viewed by 6596
Interests: reliability simulation; physics of failure modeling; multi-physics simulation; system reliability modeling and analysis; lifetime prediction; uncertainty modeling and analysis; accelerated degradation method; SOC estimation of lithium-ion batteries; RUL and SOH prediction of lithium-ion batteries
Interests: LED packaging and system integration; prognostics and health management; wide bandgap power electronics packaging and reliability modeling
Special Issues, Collections and Topics in MDPI journals
As its name implies, “Complex Systems” are the systems consisting of multifold materials and components interacting with each other in complicated ways. They exist widely in all kinds of vital industries, including aerospace, civil, transport, energy, intelligent manufacturing and semiconductors. Driven by modern technologies, the complexity of those systems has increased dramatically, making reliability design and their optimization a great challenge in practical situations. On the other hand, numerous fantastic solutions on reliability analysis and evaluation have also emerged with the rapid advancement of technologies such as numerical simulations, big data, intelligence design, physics-of-failure modeling, and the multi-integration of these above technologies. By virtue of these methods, the reliability problems of complex systems could be tackled with great opportunities.
To extend the understanding of complex system reliability, reliability studies worldwide on advanced theory, models and algorithms for products at material, and component and system levels are particularly welcome in this Special Issue. The topics of interest include, but are not limited to:
- Artificial intelligence based reliability modeling;
- Physics-informed neural network for physics of failure;
- Multi-physics and multi-scale simulation;
- Reliability modeling, assessment and validation;
- Design for reliability;
- Prognostics and health management;
- Digital twins;
- Energy storage materials, devices, modules and systems;
- Electronic packaging materials, devices and modules;
- Wide bandgap semiconductor devices, modules and systems;
- Electric products and systems;
- Mechanical products and systems;
- AI systems.
Dr. Cheng Qian
Dr. Jiajie Fan
Dr. Dezhen Yang
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- complex system
- numerical simulations
- lifetime prediction
- prognostics and health management
- artificial intelligence
- digital twins