Smart Packaging Sensors for Food Quality Monitoring
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".
Deadline for manuscript submissions: 31 July 2024 | Viewed by 2465
Special Issue Editors
Interests: microelectronics; nanoelectronics; opto-electronics
Special Issues, Collections and Topics in MDPI journals
Interests: sensors; functional materials; printed electronics; micro-/nanofabrication
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Current food packaging practices and technologies result in tremendous food waste due to a lack of appropriate packaging conditions and poor or no monitoring in the supply chain. Smart food packaging sensor systems are viable solutions for reducing inefficiencies and waste, and improving public health and consumer confidence. A major source of premature spoilage in perishable foods is poor handling and packaging practices during transport and storage, and inappropriate environments. Given the importance of access to good-quality produce and the health and safety of the consumers, retailers take precautionary measures such as disposing of food that has passed its “best before” date, which is not a true indicator of spoiled food. Products are often still viable after this date, meaning that large amounts of unsold food are unnecessarily discarded. Conventional food packaging cannot efficiently monitor declines in food quality, so there is a need for smart food packaging sensor systems that are low cost, biocompatible and easy to implement.
This Special Issue will focus on state-of-the-art advances in materials, structural design, sensing concepts, fabrication techniques, and methodologies for the development of smart freshness sensors and indicators. The food quality parameters to be monitored include freshness, ripeness, leakage, microbial pathogens, and emitted gases, which are correlated with food safety. These smart packaging sensors will allow for the monitoring of the quality and safety of food throughout the food chain, from the source of production to customers. Smart packaging systems with both passive and active packaging solutions will be included as well. We invite contributors to submit their original and high-quality research articles as well as review papers related to smart food packaging sensors and their applications to food quality monitoring.
The potential topics include but are not limited to the following:
- Physical, chemical, electrochemical, and biochemical sensors for food quality;
- Functional materials for smart food packaging sensor applications;
- Active and passive food quality sensors;
- Printed sensors and electronics for food quality;
- The real-time monitoring of food quality;
- Flexible sensors for smart packaging;
- Intelligent packaging systems for food quality monitoring;
- Optical-based sensors for food monitoring;
- Wireless and/or RFID-based sensor systems for food quality monitoring.
Prof. Dr. M. Jamal Deen
Dr. Arif Ul Alam
Guest Editors
Manuscript Submission Information
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Keywords
- smart packaging
- intelligent packaging
- active packaging
- food quality monitoring
- RFID
- IoT
- sensors for food quality monitoring
- food safety
