Advances in 3D Imaging and Multimodal Sensing Applications
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Sensing and Imaging".
Deadline for manuscript submissions: 30 April 2024 | Viewed by 4058
Special Issue Editors
Interests: computer vision; image processing; pattern recognition; machine learning; deep learning
Special Issues, Collections and Topics in MDPI journals
Interests: machine learning; deep learning; signal processing; artificial intelligence and machine learning
Interests: computer vision; deep learning; signal processing; image processing and analysis; artificial intelligence and machine learning; 3D laser scanning
Special Issue Information
Dear Colleagues,
Continuous advances in science and technology have wide implications in several fields, such as Industry 4.0, space development, marine biology, environmental protection, healthcare, biological applications, civil engineering, and cultural and heritage protection. Data is the basis for these advancements: thanks to data, machine and deep learning algorithms can be trained to overcome issues that would otherwise be infeasible using traditional methods. However, this raises the problem of gathering such amounts of data: this is where sensors play a key role. Sensors are the basis of data acquisition and, as a consequence, modern technological applications: almost every system, from the exploration of our universe to the development of complex nanomachinery, relies heavily on measurements performed by a variety of sensors, which are then used to improve the experiences in almost every IoT field.
Still, real-world processes are often complex and not limited to a single data source: as an example, modern biometric applications rely on multiple sources, such as the user’s voice and face, while smart monitoring systems in Industry 4.0 may detect process anomalies from an artifact by using data coming from both its reconstruction and its physical properties. Consequently, multimodal sensing applications widen the perspective of possible advancements, allowing for properly modeling complex systems via data fusion. In that sense, 3D imagery can further enrich the data provided by physical sensors, allowing for an even more complete representation of underlying processes and phenomena.
Apart from the specific application scenario, the common focus of such advancements, that is, employing advanced data acquisition techniques via multimodal sensors and 3D imagery, requires a strong multidisciplinary research effort.
The main purpose of this Special Issue is to collect innovative contributions in 3D Imaging and Multimodal Sensing Applications (e.g., data reconstruction, data fusion, anomaly detection), ranging from new methodologies to innovative approaches in different domains. Particular emphasis should be given to processing data gathered by multimodal sensor systems to solve common issues known in the literature and present innovative best practices.
Topics of interest include, but are not limited to:
- Industry 4.0;
- Smart agriculture;
- Aerospace robotics and automation;
- Digital;
- Cultural Heritage;
- Healthcare.
Dr. Vito Renò
Dr. Angelo Cardellicchio
Dr. Cosimo Patruno
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- deep learning
- machine learning
- intelligent systems
- machine perception
- signal, 3D, and image processing
- multimodal sensing
