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Multi-Platform Collaborative for City 3D Modelling: Photogrammetric and Remote Sensing Satellite, Aerial, Terrestrial, and UAV Data

A special issue of Remote Sensing (ISSN 2072-4292). This special issue belongs to the section "Urban Remote Sensing".

Deadline for manuscript submissions: 31 July 2024 | Viewed by 124

Special Issue Editors

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Guest Editor
Department of Land Surveying, University of Agriculture in Kracow, ul. Balicka 253A, 30-198 Krakow, Poland
Interests: geospatial data; 3D modelling; data integration; UAV; LiDAR; TLS; MLS; photogrammetry; BIM

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Guest Editor
Department of Engineering and Geology, University “G. D’Annunzio” of Chieti-Pescara, 65127 Pescara, Italy
Interests: geomatics engineering; 3D survey; spatial analysis; remote sensing; photogrammetry; GIS; BIM; 3D modeling; cartography; aerial survey
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Department of Land Surveying, University of Agriculture in Kracow, ul. Balicka 253A, 30-198 Krakow, Poland
Interests: engineering surveying; geospatial data; displacement and deformation; 3D modelling; TLS; BIM
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Research Institute of Geodesy and Cartography in Bratislava, Chlumeckého 4, 826 62 Bratislava, Slovakia,
Interests: UAV; LiDAR; photogrammetry; cadastre of real estate; land management; geospatial data; 3D modelling

Special Issue Information

Dear Colleagues,

In light of dynamic urbanisation, multi-dimensional modelling of cities is becoming an essential tool for urban space analysis, especially considering the growing popularity of the smart city concept. Photogrammetric and remote-sensing data that provide digital and spatial information are a reliable source of input for 3D models. Furthermore, by integrating spatial data from various sources, researchers can generate accurate and complete 3D projects not only of individual objects and buildings but also entire estates, districts, cities, and regions. Multi-platform measurements can yield comprehensive and coherent object information, from generalised (but extensive) satellite data to aerial and UAV information to precise (but small-scale) in situ surveys. Multifaceted integration of data from multi-platform collaborated measurements, spatial databases, maps, and photogrammetric and remote-sensing satellite, aerial, and UAV data aims to yield a comprehensive image of the spatial structure of places and objects. The expected accuracy and quality of 3D models necessitate the right measuring tool, input data type, processing, and methods and tools for generating the results. Three-dimensional building models are generated for purposes of smart city planning, BIM, or multi-dimensional cartography. Such models of buildings or even entire cities facilitate numerous spatial analyses necessary in civil engineering, spatial planning, city planning, architecture, or construction.

This Special Issue aims to collect and systematise knowledge, experience, and insights concerning 3D city modelling and multi-platform data integration. Satellite, aerial, UAV, and terrestrial surveying platforms are sources of photogrammetric and remote-sensing data. The information is the underpinning for generating high-accuracy and high-quality 3D models.

This Special Issue of Remote Sensing also aims to present research and developmental studies on 3D modelling, Earth sciences, civil engineering, and city and spatial planning that employ photogrammetric and remote-sensing data.

Articles for this Special Issue should focus on (geo)spatial data in general: their acquisition with various methods, techniques, and tools, processing, and use in 3D modelling, maps, and multi-dimensional projects concerning city modelling and smart city. The suggested themes can include the synergy of data from various sensors, databases, and photogrammetric, remote-sensing, engineering cartographic, and GIS inputs.

The suggested article types for this Special Issue include Article (original research manuscripts), Review (a comprehensive analysis of the existing literature within a field of study, identifying current gaps or problems), and Technical Note (brief articles focused on a new technique, method, or procedure).

Prof. Dr. Przemysław Klapa
Prof. Dr. Massimiliano Pepe
Dr. Pelagia Gawronek
Dr. Peter Kyseľ
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Remote Sensing is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • 3D modelling
  • smart cities
  • integration of geospatial data
  • UAV
  • laser scanning (SLS, ALS, MLS, TLS)
  • photogrammetry and remote sensing
  • land management
  • land surveying
  • civil engineering
  • multi-dimensional cartography

Published Papers

This special issue is now open for submission.
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