Polyimide: Preparation, Characteristics, Properties, Processing, and Applications
A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Processing and Engineering".
Deadline for manuscript submissions: closed (15 November 2023) | Viewed by 3249
Special Issue Editor
Special Issue Information
Dear Colleagues,
Polyimide is widely used in motor and electric appliances, electronic devices, aerospace, new energy, and other fields due to its superior all-around performance, which includes high temperature resistance, high strength, high modulus, electrical insulation, radiation resistance, corrosion resistance, and resistance to heat and humidity. As a result of improvements in modern technology and industry, as well as the expanding application area of polyimide films, there has been an ever-increasing need for polyimide films. Currently, the use of polyimide films in electrical insulation, electronic devices, flexible displays, and 5G communication is growing toward greater differentiation, variety, and customization. It is vital to create polyimide films that are highly insulating, have a low expansion coefficient, are transparent, have a low/high dielectric constant, and exhibit high thermal conductivity. Over the last several decades, the world has made significant advances in polyimide research, but its technical capability remains relatively sluggish, and there is still a long way to go in high-tech areas such as high-speed variable frequency motors, flexible copper clad laminate, and new displays. Special emphasis will be placed on but not limited to the following:
- PI membranes low contractility;
- PI membranes with low dielectricity;
- Transparent PI membranes;
- BMI adhesive and composite materials;
- TPI engineering plastics;
- Polyimide enameled wire paint.
Dr. Xiaorui Zhang
Guest Editor
Manuscript Submission Information
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