Recent Advances in Optical Metrology

A special issue of Photonics (ISSN 2304-6732).

Deadline for manuscript submissions: closed (30 December 2023) | Viewed by 3772

Special Issue Editors


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Guest Editor
College of Electronics and Information Engineering, Sichuan University, Chengdu 610065, China
Interests: optical metrology; 3D imaging; computer vision; structured light; phase retrieval
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
School of Mechanical Engineering, Yonsei University, Seoul 03722, Republic of Korea
Interests: optical metrology; digital fringe projection; structured light; 3D reconstruction; machine vision; extended reality
College of Engineering, Anhui Agricultural University, Hefei 230036, China
Interests: machine vision; optical measurement; smart agriculture
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

With the advances in scientific and technological development, optical metrology has been widely applied in various applications such as industrial inspection, biomedical imaging, experimental mechanics, smart agriculture, and consumer entertainment. Based on the hardware devices and working principles, optical metrology can be divided into numerous different types: structure light, laser interferometry, holographic interferometry, digital holography, stereo vision, time of flight, etc. In recent years, many scholars have developed various advanced techniques for optical metrology and applied these advanced techniques into new application scenarios. This Special Issue focuses on, but is not limited to, the most up-to-date optical metrology and their applications.

Prof. Dr. Yajun Wang
Dr. Jae-sang Hyun
Dr. Yuwei Wang
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access monthly journal published by MDPI.

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Keywords

  • optical metrology
  • 3D measurement
  • structured light
  • interferometry
  • stereovision
  • digital holography
  • camera calibration
  • machine vision
  • deep learning
  • computational imaging

Published Papers (2 papers)

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Research

15 pages, 2494 KiB  
Article
Multi-Scale Cyclic Image Deblurring Based on PVC-Resnet
by Kai Zhang, Minhui Chen, Dequan Zhu, Kaixuan Liu, Haonan Zhao and Juan Liao
Photonics 2023, 10(8), 862; https://doi.org/10.3390/photonics10080862 - 25 Jul 2023
Cited by 1 | Viewed by 735
Abstract
Aiming at the non-uniform blurring of image caused by optical system defects or external interference factors, such as camera shake, out-of-focus, and fast movement of object, a multi-scale cyclic image deblurring model based on a parallel void convolution-Resnet (PVC-Resnet) is proposed in this [...] Read more.
Aiming at the non-uniform blurring of image caused by optical system defects or external interference factors, such as camera shake, out-of-focus, and fast movement of object, a multi-scale cyclic image deblurring model based on a parallel void convolution-Resnet (PVC-Resnet) is proposed in this paper, in which a multi-scale recurrent network architecture and a coarse-to-fine strategy are used to restore blurred images. The backbone network is built based on Unet codec architecture, where a PVC-Resnet module designed by combinations of parallel dilated convolution and residual network is constructed in the encoder of the backbone network. The convolution receptive field is expanded with parallel dilated convolution to extract richer global features. Besides, a multi-scale feature extraction module is designed to extract the shallow features of different scale targets in blurred images, and then the extracted features are sent to the backbone network for feature refinement. The SSIM loss function and the L1 loss function are combined to construct the SSIM-L1 joint loss function for the optimization of the overall network to ensure that the image restoration at different stages can be optimized. The experimental results show that the average peak signal-to-noise ratio (PSNR) of the proposed model on different data sets is as high as 32.84 dB, and the structural similarity (SSIM) reaches 0.9235. and statistical structural similarity (Stat-SSIM) of 0.9249 on different datasets. Compared with other methods, the deblurred images generated by this method are superior to the methods proposed by Nah et al., Kupyn et al. and Cho S J et al., especially on the calibration board data set. The model proposed in this paper applies parallel dilated convolution and SSIM-L1 joint loss function to improve the performance of the network so that the edge and texture details of the restored image are clearer. Full article
(This article belongs to the Special Issue Recent Advances in Optical Metrology)
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14 pages, 4746 KiB  
Article
Wafer Eccentricity Deviation Measurement Method Based on Line-Scanning Chromatic Confocal 3D Profiler
by Dingjun Qu, Zuoda Zhou, Zhiwei Li, Ruizhe Ding, Wei Jin, Haiyan Luo and Wei Xiong
Photonics 2023, 10(4), 398; https://doi.org/10.3390/photonics10040398 - 03 Apr 2023
Cited by 1 | Viewed by 2336
Abstract
The wafer eccentricity deviation caused by misalignment between the center of the wafer and rotary table will lead to edge image distortion and quality degradation of the defect signals during automated inspection. However, wafer end jump and edge topography change will bring great [...] Read more.
The wafer eccentricity deviation caused by misalignment between the center of the wafer and rotary table will lead to edge image distortion and quality degradation of the defect signals during automated inspection. However, wafer end jump and edge topography change will bring great challenges to the accurate measurement of micrometer deviations. A new wafer eccentricity deviation measurement method based on line-scanning chromatic confocal sensors (LSCCSs) is proposed. Firstly, the LSCCS with Z-axis submicron resolution used in the experiment acquires the 3D profile height of the wafer edge as the turntable rotates, and the edge distance is calculated at each rotation angle. Secondly, a robust Fourier-LAR fitting method is used to fit edge distance serial to reduce sensitivity to outliers. Finally, the wafer eccentricity deviation that is equal to the wafer center coordinate can be calculated using the wafer eccentricity deviation model. In the simulated experiment, the results show that the eccentricity deviation measurement accuracy was insensitivity to noise and reached the micron level. Additionally, the measurement uncertainty of eccentricity deviation coordinate Xw,Yw was (0.53 µm, 1.4 µm) in the actual data of the 12-inch wafers. Full article
(This article belongs to the Special Issue Recent Advances in Optical Metrology)
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