Highly Thermal Conductive Nanocomposites
A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Nanocomposite Materials".
Deadline for manuscript submissions: closed (1 February 2023) | Viewed by 21603
Special Issue Editor
Interests: polymer nanocomposites; thermal conduction; elastomer nanocomposites
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
As transistors continue to decrease in size and packing densities increase, thermal management is becoming the critical bottleneck for the development of the next generation of compact and flexible electronics. The increase in computer usage and ever-growing dependence on cloud systems highlight the need for better methods of dissipating heat away from electronic components. The most important components in thermal management are highly thermally conductive nanocomposites.
This Special Issue aims to cover current experimental and/or computational studies in the field of nanocomposites with high thermal conductivity. Submissions which cover advanced preparation methods, characterizations, micro/nanoscale heat transfer and a fundamental understanding of structure–thermal conductivity relationships are particularly welcome.
Prof. Dr. Xiaoliang Zeng
Guest Editor
Manuscript Submission Information
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Keywords
- thermal conductivity
- interface
- polymer composites
- phonon
- electronic