Advances in Computational Materials Science on Functional Interfaces and Surfaces, Volume II

A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Theory and Simulation of Nanostructures".

Deadline for manuscript submissions: closed (30 November 2023) | Viewed by 1416

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Department of Organic Material Science and Engineering, Pusan National University, Busan 46241, Republic of Korea
Interests: battery/super capacitor/fuel-cell; CCS (carbon dioxide capture & sequestration); super absorbent polymer; hybrid interface design for composites
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Special Issue Information

Dear Colleagues,

Based on the successful Special Issue “Advances in Computational Materials Science on Functional Interfaces and Surfaces”, we have set up a second volume.

In the future, research on high-value-added products with new functions, using materials created by the fusion of science and technology, will be widely and actively conducted. Related industrial fields are expected to be reorganized in accordance with the appearance of new industries. Although nanomaterials have been researched and their activated surfaces show more unique attributes than existing materials, there are constraints to applying them to the industry due to the difficulty in materializing other complex functions with them and their small volumes. The hybridization of heterogeneous materials or heterogeneous scales is a new materials technology that has been assessed as a new technology with which to create various functional materials. Computational materials science enables a functional interface and surface in order to design, invent, and forecast nanomaterials’ properties by using computer simulation techniques such as density functional theory (DFT), molecular dynamics (MD), the Monte Carlo (MC) method, finite element methods (FEMs), and machine learning (ML) approaches. All topics potentially falling into the category of computational materials science will be considered, including inorganic materials (metals, ceramics, composites, semiconductors, nanostructures, 2D materials, metamaterials, etc.), organic materials (polymers, liquid crystals, surfactants, emulsions, etc.), and hybrid materials of inorganic as well as organic components. Original research articles, in the form of full papers or communications, and reviews are both welcome.

Prof. Dr. Seung Geol Lee
Guest Editor

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Keywords

  • functional materials
  • functional interfaces and surfaces
  • computational materials science
  • first principle calculations
  • density functional theory (DFT)
  • molecular dynamics (MD)
  • Monte Carlo (MC) method
  • mesoscale simulations
  • finite element methods (FEM)
  • multiscale simulations
  • machine learning (ML)

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Published Papers (1 paper)

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Research

16 pages, 11422 KiB  
Article
Mechanism Exploration of the Effect of Polyamines on the Polishing Rate of Silicon Chemical Mechanical Polishing: A Study Combining Simulations and Experiments
by Ziwei Lin, Junli Zhu, Qi Huang, Lei Zhu, Weimin Li and Wenjie Yu
Nanomaterials 2024, 14(1), 127; https://doi.org/10.3390/nano14010127 - 04 Jan 2024
Viewed by 1078
Abstract
Polyamines have become important chemical components used in several integrated circuit manufacturing processes, such as etching, chemical mechanical polishing (CMP), and cleaning. Recently, researchers pointed out that polyamines can be excellent enhancers in promoting the material removal rate (MRR) of Si CMP, but [...] Read more.
Polyamines have become important chemical components used in several integrated circuit manufacturing processes, such as etching, chemical mechanical polishing (CMP), and cleaning. Recently, researchers pointed out that polyamines can be excellent enhancers in promoting the material removal rate (MRR) of Si CMP, but the interaction mechanism between the polyamines and the silicon surface has not been clarified. Here, the micro-interaction mechanisms of polyamines, including ethylenediamine (EDA), diethylenetriamine (DETA), triethylenetetramine (TETA), tetraethylenepentamine (TEPA), and pentaethylenehexamine (PEHA), with the Si(1, 0, 0) surface were investigated through molecular dynamics (MD) simulations using the ReaxFF reactive force field. Polyamines can adsorb onto the Si(1, 0, 0) surface, and the adsorption rate first accelerates and then tends to stabilize with the increase in the quantity of -CH2CH2NH-. The close connection between the adsorption properties of polyamines and the polishing rate has been confirmed by CMP experiments on silicon wafers. A comprehensive bond analysis indicates that the adsorption of polyamines can stretch surface Si–Si bonds, which facilitates subsequent material removal by abrasive mechanical wear. This work reveals the adsorption mechanism of polyamines onto the silicon substrate and the understanding of the MRR enhancement in silicon CMP, which provides guidance for the design of CMP slurry. Full article
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