Micro/Nano Structures and Systems: Analysis, Design, Manufacturing, and Reliability, 2nd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: closed (31 December 2023) | Viewed by 3006

Special Issue Editor

Special Issue Information

Dear Colleagues,

Over the last few decades, fundamental sciences have expanded their scope by many orders of magnitude and one of the primary goals of science and technology, nowadays, seems to be the quest to develop reliable methods for the prediction of phenomena that occur over multiple scales, particularly the nano/micro scale.

Ultra-small structures on the scale of micro/nanometers are used in various applications, including, but not limited to, aerospace, automobiles, etc. Micro/nanostructures are widely used in nano- and micro-sized systems and devices, such as biosensors, nanoactuators, nanoprobes, and micro/nano-electromechanical systems, with their design relying on the complete understanding of the physical and mechanical behavior of micro/nanostructures. Mechanics plays a forefront role at the micro/nano scale, from the generation of nanostructures through growth instabilities to the properties of nanocomposite materials and the manufacturing and design of machines, structures, sensors, actuators, fluidics, MEMS, NEMS, etc.

The aim of this Special Issue is to assemble high-quality papers that advance the field of micro/nanostructures and systems through the development and application of any modern computational and/or analytical methods alone or in conjunction with experimental techniques for their analysis, design, manufacture, maintenance, quality and reliability.

It is my pleasure to invite you to submit a manuscript for this Special Issue and we welcome full papers, communications and reviews.

Dr. Stelios K. Georgantzinos
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • microstructures
  • nanostructures
  • MEMS
  • NEMS
  • nanomechanics
  • micromechanics
  • additive manufacturing
  • devices
  • computational techniques
  • analytical methods analysis
  • experimental techniques
  • simulation
  • quality
  • maintenance
  • reliability

Related Special Issue

Published Papers (2 papers)

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Research

16 pages, 6874 KiB  
Article
Surface Quality and Material Removal Rate in Fabricating Microtexture on Tungsten Carbide via Femtosecond Laser
by Guangxian Li, Xuanang Li, Guichao He, Ruiguang Fan, Feiyuan Li and Songlin Ding
Micromachines 2023, 14(6), 1143; https://doi.org/10.3390/mi14061143 - 28 May 2023
Cited by 1 | Viewed by 1369
Abstract
Tungsten carbide is currently the most widely used tool material for machining difficult-to-machine materials, such as titanium alloys and nickel-based super alloys. In order to improve the performance of tungsten carbide tools, surface microtexturing, a novel technology that can effectively reduce cutting forces [...] Read more.
Tungsten carbide is currently the most widely used tool material for machining difficult-to-machine materials, such as titanium alloys and nickel-based super alloys. In order to improve the performance of tungsten carbide tools, surface microtexturing, a novel technology that can effectively reduce cutting forces and cutting temperatures and improve wear resistance, has been applied in metalworking processes. However, when fabricating the micro-textures such as micro-grooves or micro-holes on tool surfaces, the significant decrease in material removal rate is a major obstacle. In this study, a straight-groove-array microtexture was fabricated on the surface of tungsten carbide tools via a femtosecond laser with different machining parameters including laser power, laser frequency, and scanning speed. The material removal rate, surface roughness, and the laser-induced periodic surface structure were analyzed. It was found that the increase in the scanning speed decreased the material removal rate, whereas increasing the laser power and laser frequency had the opposite effects on the material removal rate. The laser-induced periodic surface structure was found to have a significant influence on the material removal rate, and the destruction of the laser-induced periodic surface structure was the reason for the reduction in the material removal rate. The results of the study revealed the fundamental mechanisms of the efficient machining method for the fabrication of microtextures on ultrahard materials with an ultrashort laser. Full article
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8 pages, 5610 KiB  
Article
Investigating the Failure Mechanism of p-GaN Gate HEMTs under High Power Stress with a Transparent ITO Gate
by Zhanfei Han, Xiangdong Li, Hongyue Wang, Jiahui Yuan, Junbo Wang, Meng Wang, Weitao Yang, Shuzhen You, Jingjing Chang, Jincheng Zhang and Yue Hao
Micromachines 2023, 14(5), 940; https://doi.org/10.3390/mi14050940 - 26 Apr 2023
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Abstract
The channel temperature distribution and breakdown points are difficult to monitor for the traditional p-GaN gate HEMTs under high power stress, because the metal gate blocks the light. To solve this problem, we processed p-GaN gate HEMTs with transparent indium tin oxide (ITO) [...] Read more.
The channel temperature distribution and breakdown points are difficult to monitor for the traditional p-GaN gate HEMTs under high power stress, because the metal gate blocks the light. To solve this problem, we processed p-GaN gate HEMTs with transparent indium tin oxide (ITO) as the gate terminal and successfully captured the information mentioned above, utilizing ultraviolet reflectivity thermal imaging equipment. The fabricated ITO-gated HEMTs exhibited a saturation drain current of 276 mA/mm and an on-resistance of 16.6 Ω·mm. During the test, the heat was found to concentrate in the vicinity of the gate field in the access area, under the stress of VGS = 6 V and VDS = 10/20/30 V. After 691 s high power stress, the device failed, and a hot spot appeared on the p-GaN. After failure, luminescence was observed on the sidewall of the p-GaN while positively biasing the gate, revealing the side wall is the weakest spot under high power stress. The findings of this study provide a powerful tool for reliability analysis and also point to a way for improving the reliability of the p-GaN gate HEMTs in the future. Full article
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