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Micromachines
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Advanced MEMS/NEMS Technology, Volume II
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Advanced MEMS/NEMS Technology, Volume II

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: closed (15 July 2019) | Viewed by 55397

Special Issue Editors

Dr. Cheng-Hsin Chuang

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Guest Editor
Institute of Medical Science and Technology, National Sun Yat-sen University, Kaohsiung 80424, Taiwan
Interests: impedance-based biosensor; printed electronics; tactile sensor; wire-based metal 3D printing
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Yufeng Jin

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Guest Editor
School of Electronic and Computer Engineering, Peking University Shenzhen Graduate School, Shenzhen 518055, China
Interests: micro/nano fabrication; MEMS (micro-electromechanical systems) sensors; TSV; three-dimensional integration
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Wen-Jung Li

E-Mail Website
Guest Editor
Department of Mechanical Engineering, City University of Hong Kong, Kowloon, Hong Kong
Interests: micro/nano/bio sensors; MEMS/nano-based biotechnology; electrokinetics-based cancer/stem; cell separation and identification
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Da-Jeng Yao

E-Mail Website
Guest Editor
1. Institute of Nano Engineering and MicroSystems, National Tsing Hua University, Hsinchu 30013, Taiwan
2. Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
3. Department of Engineering and System Science, National Tsing Hua University, Hsinchu 30013, Taiwan
Interests: digital microfluidics; intelligent gas sensing system; in vitro fertilization on a chip, and tera hertz system and its applications
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The 14th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS, https://ieee-nems.org/2019) will be held from 11-14, April 2019 in Bangkok, at Marriott Marquis Queen’s Park, Thailand.

The IEEE-NEMS is a premier conference series sponsored by the IEEE Nanotechnology Council focusing on the promotion of advanced research areas related to MEMS, nanotechnology, and molecular technology. Prior conferences were held in Singapore (2018), Los Angeles (USA, 2017), Matsushima Bay and Sendai (Japan, 2016), Xi’an (China, 2015), Hawaii (USA, 2014), Suzhou (China, 2013), Kyoto (Japan, 2012), Kaohsiung (Taiwan, 2011), Xiamen (China, 2010), Shenzhen (China, 2009), Hainan Island (China, 2008), Bangkok (Thailand, 2007), and Zhuhai (China, 2006). The IEEE-NEMS Conference typically attracts over 600 attendees with participants from more than 20 countries and regions worldwide.

Micromachines is the leading journal in the MEMS and NENS fields from MDPI. We want to consolidate original research papers and comprehensive review articles in this Special Issue. We welcome manuscripts on the following topics:

  • Micro/nanomachines;
  • Optical MEMS and nanophotonics;
  • RF MEMS, resonators and oscillators;
  • Ultrasound MEMS (pMUT and cMUT);
  • Energy harvesting technology;
  • BioMEMS and biomedical devices;
  • Neuroprosthetics and implanted devices;
  • Micro/nanofluidics;
  • Soft materials and robotics;
  • Chemical sensors/gas sensors/sensors for environmental monitoring;
  • Sensor networks/IoT.

Prof. Cheng-Hsin Chuang
Prof. Dr. Yufeng Jin
Prof. Dr. Wen-Jung Li
Prof. Dr. Da-Jeng Yao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Published Papers (15 papers)

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Research

11 pages, 2031 KiB  
Article
Design Optimization of a Compact Double-Ended-Tuning-Fork-Based Resonant Accelerometer for Smart Spindle Applications
by Yu-Hsuan Chen, Wei-Chang Li, Xi-Wen Xiao, Chieh-Cheng Yang and Chien-Hao Liu
Micromachines 2020, 11(1), 42; https://doi.org/10.3390/mi11010042 - 30 Dec 2019
Cited by 5 | Viewed by 3216
Abstract
With the rapid developments of the Industrial Era 4.0, numerous sensors have been employed to facilitate and monitor the quality of machining processes. Among them, accelerometers play an important role in chatter detection and suppression for reducing the tool down-time and increasing manufacturing [...] Read more.
With the rapid developments of the Industrial Era 4.0, numerous sensors have been employed to facilitate and monitor the quality of machining processes. Among them, accelerometers play an important role in chatter detection and suppression for reducing the tool down-time and increasing manufacturing efficiency. To date, most commonly seen accelerometers have relatively large sizes such that they can be installed only on the housing of spindles or the surfaces of workpieces that may not be able to directly capture actual vibration signals or obstruct the cutting process. To address this challenge, this research proposed a compact, wide-bandwidth resonant accelerometer that could be embedded inside high-speed spindles for real-time chatter monitoring and prediction. Composed of a double-ended tuning fork (DETF), a proof mass, and a support beam, the resonant accelerometer utilizes the resonance frequency shift of the DETF due to the bending motions of the structure during out-of-plane accelerations as the sensing mechanism. The entire structure based on commercially available quartz tuning forks (QTFs) with electrodes for symmetric-mode excitations. The advantages of this structure include low noise and wide operation bandwidth thanks to the frequency modulation scheme. A theoretical model and finite element analysis were conducted for designs and optimizations. Simulated results demonstrated that the proposed accelerometer has a size of 9.76 mm × 4.8 mm × 5.5 mm, a simulated sensitivity of 0.94 Hz/g, and a simulated working bandwidth of 3.5 kHz. The research results are expected to be beneficial for chatter detection and intelligent manufacturing. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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12 pages, 7309 KiB  
Article
A Robust Fully-Integrated Digital-Output Inductive CMOS-MEMS Accelerometer with Improved Inductor Quality Factor
by Yi Chiu, Hsuan-Wu Liu and Hao-Chiao Hong
Micromachines 2019, 10(11), 792; https://doi.org/10.3390/mi10110792 - 18 Nov 2019
Cited by 1 | Viewed by 3323
Abstract
This paper presents the design, fabrication, and characterization of an inductive complementary metal oxide semiconductor micro-electromechanical systems (CMOS-MEMS) accelerometer with on-chip digital output based on LC oscillators. While most MEMS accelerometers employ capacitive detection schemes, the proposed inductive detection scheme is less susceptible [...] Read more.
This paper presents the design, fabrication, and characterization of an inductive complementary metal oxide semiconductor micro-electromechanical systems (CMOS-MEMS) accelerometer with on-chip digital output based on LC oscillators. While most MEMS accelerometers employ capacitive detection schemes, the proposed inductive detection scheme is less susceptible to the stress-induced structural curling and deformation that are commonly seen in CMOS-MEMS devices. Oscillator-based frequency readout does not need analog to digital conversion and thus can simplify the overall system design. In this paper, a high-Q CMOS inductor was connected in series with the low-Q MEMS sensing inductor to improve its quality factor. Measurement results showed the proposed device had an offset frequency of 85.5 MHz, sensitivity of 41.6 kHz/g, noise floor of 8.2 mg/√Hz, bias instability of 0.94 kHz (11 ppm) at an average time of 2.16 s, and nonlinearity of 1.5% full-scale. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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15 pages, 8003 KiB  
Article
A Novel Three-Axial Magnetic-Piezoelectric MEMS AC Magnetic Field Sensor
by Po-Chen Yeh, Hao Duan and Tien-Kan Chung
Micromachines 2019, 10(10), 710; https://doi.org/10.3390/mi10100710 - 20 Oct 2019
Cited by 10 | Viewed by 4764
Abstract
We report a novel three-axial magnetic-piezoelectric microelectromechanical systems (MEMS) magnetic field sensor. The sensor mainly consists of two sensing elements. Each of the sensing elements consists of a magnetic Ni thick film, a Pt/Ti top electrode, a piezoelectric lead zirconate titanate (PZT) thin [...] Read more.
We report a novel three-axial magnetic-piezoelectric microelectromechanical systems (MEMS) magnetic field sensor. The sensor mainly consists of two sensing elements. Each of the sensing elements consists of a magnetic Ni thick film, a Pt/Ti top electrode, a piezoelectric lead zirconate titanate (PZT) thin film, a Pt/Ti bottom electrode, a SiO2 insulation layer, and a moveable Si MEMS diaphragm. When the sensor is subjected to an AC magnetic field oscillating at 7.5 kHz, a magnetic force interaction between the magnetic field and Ni thick film is produced. Subsequently, the force deforms and deflects the diaphragms as well as the PZT thin film deposited on the diaphragms. The deformation and deflection produce corresponding voltage outputs due to the piezoelectric effect. By analyzing the voltage outputs through our criterion, we can obtain details of the unknown magnetic fields to which the sensor is subjected. This achieves sensing of three-axial magnetic fields. The experimental results show that the sensor is able to sense three-axial magnetic fields ranging from 1 to 20 Oe, with X-axial, Y-axial, and Z-axial sensitivities of 0.156 mVrms/Oe, 0.156 mVrms/Oe, and 0.035 mVrms/Oe, respectively, for sensing element A and 0.033 mVrms/Oe, 0.044 mVrms/Oe, and 0.130 mVrms/Oe, respectively, for sensing element B. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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22 pages, 19764 KiB  
Article
A Misalignment Optical Guiding Module for Power Generation Enhancement of Fixed-Type Photovoltaic Systems
by Cheng-Tang Pan, Chung-Kun Yen, Shao-Yu Wang, Pei-Yuan Sun, Sin-Yu Huang, Yeong-Maw Hwang, Zong-Hsin Liu, Li-Ming Chu and Zheng-Yu Hoe
Micromachines 2019, 10(10), 687; https://doi.org/10.3390/mi10100687 - 11 Oct 2019
Viewed by 2154
Abstract
This study presents a misalignment light-guiding module to increase the effectiveness of absorbing light. For a general fixed-type photovoltaic (PV) panel, the misalignment light decreases the efficiency of the system. A solar tracking system was installed for obtaining higher power generation. However, the [...] Read more.
This study presents a misalignment light-guiding module to increase the effectiveness of absorbing light. For a general fixed-type photovoltaic (PV) panel, the misalignment light decreases the efficiency of the system. A solar tracking system was installed for obtaining higher power generation. However, the cost of the PV system and maintenance was 5–10 times higher than the general type. In this study, this module is composed of an array of misalignment light-guiding units that consist of a non-axisymmetric compound parabolic curve (NACPC) and a freeform surface collimator. The NACPC efficiently collects the misalignment light within ±30° and guides the light to the collimator. The light has a better uniformity and smaller angle at the exit aperture. The simulation results show that the optical efficiency of the unit was above 70% when the misalignment angle was smaller than 20°. The experimental results show that the power generation of the light-guiding unit was 1.8 times higher than the naked PV panel. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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10 pages, 3820 KiB  
Article
Microfluidic-Based Mechanical Phenotyping of Androgen-Sensitive and Non-sensitive Prostate Cancer Cells Lines
by Na Liu, Panpan Du, Xiaoxiao Xiao, Yuanyuan Liu, Yan Peng, Chen Yang and Tao Yue
Micromachines 2019, 10(9), 602; https://doi.org/10.3390/mi10090602 - 12 Sep 2019
Cited by 14 | Viewed by 3057
Abstract
Cell mechanical properties have been identified to characterize cells pathologic states. Here, we report our work on high-throughput mechanical phenotyping of androgen-sensitive and non-sensitive human prostate cancer cell lines based on a morphological rheological microfluidic method. The theory for extracting cells’ elastic modulus [...] Read more.
Cell mechanical properties have been identified to characterize cells pathologic states. Here, we report our work on high-throughput mechanical phenotyping of androgen-sensitive and non-sensitive human prostate cancer cell lines based on a morphological rheological microfluidic method. The theory for extracting cells’ elastic modulus from their deformation and area, and the used experimental parameters were analyzed. The mechanical properties of three types of prostate cancer cells lines with different sensitivity to androgen including LNCaP, DU145, and PC3 were quantified. The result shows that LNCaP cell was the softest, DU145 was the second softest, and PC3 was the stiffest. Furthermore, atomic force microscopy (AFM) was used to verify the effectiveness of this high-throughput morphological rheological method. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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11 pages, 3934 KiB  
Article
A Gas Mixture Prediction Model Based on the Dynamic Response of a Metal-Oxide Sensor
by Wei-Chih Wen, Ting-I Chou and Kea-Tiong Tang
Micromachines 2019, 10(9), 598; https://doi.org/10.3390/mi10090598 - 11 Sep 2019
Cited by 11 | Viewed by 2698
Abstract
Metal-oxide (MOX) gas sensors are widely used for gas concentration estimation and gas identification due to their low cost, high sensitivity, and stability. However, MOX sensors have low selectivity to different gases, which leads to the problem of classification for mixtures and pure [...] Read more.
Metal-oxide (MOX) gas sensors are widely used for gas concentration estimation and gas identification due to their low cost, high sensitivity, and stability. However, MOX sensors have low selectivity to different gases, which leads to the problem of classification for mixtures and pure gases. In this study, a square wave was applied as the heater waveform to generate a dynamic response on the sensor. The information of the dynamic response, which includes different characteristics for different gases due to temperature changes, enhanced the selectivity of the MOX sensor. Moreover, a polynomial interaction term mixture model with a dynamic response is proposed to predict the concentration of the binary mixtures and pure gases. The proposed method improved the classification accuracy to 100%. Moreover, the relative error of quantification decreased to 1.4% for pure gases and 13.0% for mixtures. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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12 pages, 3121 KiB  
Article
Using Micromachined Molds, Partial-curing PDMS Bonding Technique, and Multiple Casting to Create Hybrid Microfluidic Chip for Microlens Array
by Pin-Chuan Chen, Ren-Hao Zhang and Liang-Ta Chen
Micromachines 2019, 10(9), 572; https://doi.org/10.3390/mi10090572 - 29 Aug 2019
Cited by 12 | Viewed by 4818
Abstract
In a previous study, we presented a novel manufacturing process for the creation of 6 × 6 and 8 × 8 microlens arrays (MLAs) comprising lenses with diameters of 1000 μm, 500 μm, and 200 μm within an area that covers 10 mm [...] Read more.
In a previous study, we presented a novel manufacturing process for the creation of 6 × 6 and 8 × 8 microlens arrays (MLAs) comprising lenses with diameters of 1000 μm, 500 μm, and 200 μm within an area that covers 10 mm × 10 mm. In the current study, we revised the manufacturing process to allow for the fabrication of MLAs of far higher density (15 × 15 and 29 × 29 within the same area). In this paper, we detail the revised manufacturing scheme, including the micromachining of molds, the partial-curing polydimethylsiloxane (PDMS) bonding used to fuse the glass substrate and PDMS, and the multi-step casting process. The primary challenges that are involved in creating MLAs of this density were ensuring uniform membrane thickness and preventing leakage between the PDMS and glass substrate. The experiment results demonstrated that the revised fabrication process is capable of producing high density arrays: Design I produced 15 × 15 MLAs with lens diameter of 0.5 mm and fill factor of 47.94%, while Design II produced 29 × 29 MLAs with lens diameter of 0.25 mm and fill factor of 40.87%. The partial-curing PDMS bonding system also proved to be effective in fusing PDMS with glass (maximum bonding strength of approximately six bars). Finally, the redesigned mold was used to create PDMS membranes of high thickness uniformity (coefficient of variance <0.07) and microlenses of high lens height uniformity (coefficient of variance <0.15). Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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14 pages, 15237 KiB  
Article
A Silicon Resonant Accelerometer Embedded in An Isolation Frame with Stress Relief Anchor
by Jian Cui, Haibing Yang, Dong Li, Ziyang Song and Qiancheng Zhao
Micromachines 2019, 10(9), 571; https://doi.org/10.3390/mi10090571 - 29 Aug 2019
Cited by 19 | Viewed by 2689
Abstract
Bias thermal sensitivity is a significant performance parameter of a silicon resonant accelerometer (SRA) and is normally used to evaluate the degree of engineering practicability. Theoretical analysis demonstrates that temperature-induced stress is the dominant factor that determines the bias temperature drift of the [...] Read more.
Bias thermal sensitivity is a significant performance parameter of a silicon resonant accelerometer (SRA) and is normally used to evaluate the degree of engineering practicability. Theoretical analysis demonstrates that temperature-induced stress is the dominant factor that determines the bias temperature drift of the custom-designed SRA. To solve this issue, this paper presents an SRA embedded in an isolation frame with stress insensitive anchor that prevents the resonant beams suffering from the thermal stress along the sense axis and thus improving the bias stability. Moreover, a high sensitivity device is achieved by integrating the vibrating beams with the comb fingers without conventional additional mass design. The experimental results show that the nominal resonant frequency of the SRA is around 93 kHz with the sensitivity and nonlinearity of 223.7 Hz/g and 5.1‰. The thermal sensitivities of the two resonant beams are −27.6 ppm/°C and −28.8 ppm/°C, respectively, which can be considered as the results owing to temperature change of the Young’s modulus without the thermal stress effect. The bias thermal sensitivity and the stability (1σ) after compensation are tested to be approximately 0.7 mg/°C and 1 mg over the temperature range from −40 °C to 60 °C with ±80 g measurement range. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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11 pages, 3175 KiB  
Article
Resonant Pressure Micro Sensors Based on Dual Double Ended Tuning Fork Resonators
by Yulan Lu, Sen Zhang, Pengcheng Yan, Yadong Li, Jie Yu, Deyong Chen, Junbo Wang, Bo Xie and Jian Chen
Micromachines 2019, 10(9), 560; https://doi.org/10.3390/mi10090560 - 23 Aug 2019
Cited by 4 | Viewed by 2265
Abstract
This paper presents resonant pressure micro sensors based on dual double ended tuning fork (DETF) resonators, which are electrostatically excited and piezoresistively detected. In operation, the barometric pressure under measurement bends the pressure sensitive diaphragm functioning as the anchor of DETF resonators and [...] Read more.
This paper presents resonant pressure micro sensors based on dual double ended tuning fork (DETF) resonators, which are electrostatically excited and piezoresistively detected. In operation, the barometric pressure under measurement bends the pressure sensitive diaphragm functioning as the anchor of DETF resonators and therefore produces eigenfrequency shifts of the resonators. Theoretical analyses and finite element analyses (FEA) were conducted to optimize the key geometries of the DETF resonators with enhanced signal to noise ratios (SNRs). In fabrications, key steps including deep reactive ion etching (DRIE) and anodic bonding were used, where sleeve holes were adopted to form electrical connections, leading to high-efficiency structure layout. Experimental results indicate that the presented micro sensors produced SNRs of 63.70 ± 3.46 dB in the open-loop characterizations and differential sensitivities of 101.3 ± 1.2 Hz/kPa, in the closed-loop characterizations. In addition, pressure cycling tests with a pressure range of 5 to 155 kPa were conducted, revealing that the developed micro sensors demonstrated pressure shifts of 83 ± 2 ppm, pressure hysteresis of 67 ± 3 ppm, and repeatability errors of 39 ± 2 ppm. Thus, the developed resonant pressure micro sensors may potentially function as an enabling tool for barometric pressure measurements. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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7 pages, 1666 KiB  
Article
Contact Photolithography at Sub-Micrometer Scale Using a Soft Photomask
by Chun-Ying Wu, Heng Hsieh and Yung-Chun Lee
Micromachines 2019, 10(8), 547; https://doi.org/10.3390/mi10080547 - 18 Aug 2019
Cited by 15 | Viewed by 7074
Abstract
This paper proposes a method for improving the patterning resolution of conventional contact photolithography from the micrometer, down to the sub-micrometer scale. The key element is a soft polydimethylsiloxane (PDMS) photomask, which is first replicated from a silicon mold and then patterned with [...] Read more.
This paper proposes a method for improving the patterning resolution of conventional contact photolithography from the micrometer, down to the sub-micrometer scale. The key element is a soft polydimethylsiloxane (PDMS) photomask, which is first replicated from a silicon mold and then patterned with a black photoresist (PR) layer to selectively block ultraviolet (UV) light. This soft PDMS photomask can easily form an intimate and conformable contact with a PR-coated substrate and hence can perform contact photolithography with high pattern resolution. The fabrication processes of this black-PR/PDMS soft photomask are experimentally carried out. Using the fabricated soft photomask, UV patterning by contact photolithography with the smallest line-width of 170 nm over a 4” wafer area was successfully achieved. The advantages and potentials of this new type of contact photolithography will be addressed. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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10 pages, 2457 KiB  
Article
Determination of Mercury(II) on A Centrifugal Microfluidic Device Using Ionic Liquid Dispersive Liquid−Liquid Microextraction
by Yun Hui, Yujia Liu, William C. Tang, Dian Song, Marc Madou, Shanhong Xia and Tianzhun Wu
Micromachines 2019, 10(8), 523; https://doi.org/10.3390/mi10080523 - 08 Aug 2019
Cited by 11 | Viewed by 3702
Abstract
An integrated centrifugal microfluidic device was developed to preconcentrate and detect hazardous mercury (II) in water with ionic liquid as environmentally friendly extractant. An automatically salt-controlled ionic liquid dispersive liquid–liquid microextraction on a centrifugal microfluidic device was designed, fabricated, and characterized. The entire [...] Read more.
An integrated centrifugal microfluidic device was developed to preconcentrate and detect hazardous mercury (II) in water with ionic liquid as environmentally friendly extractant. An automatically salt-controlled ionic liquid dispersive liquid–liquid microextraction on a centrifugal microfluidic device was designed, fabricated, and characterized. The entire liquid transport mixing and separation process was controlled by rotation speed, siphon valves, and capillary valves. Still frame images on the rotating device showed the process in detail, revealing the sequential steps of mixing, siphon priming, transportation between chambers, and phase separation. The preconcentration of red dye could be clearly observed with the naked eye. By combining fluorescence probe and microscopy techniques, the device was tested to determine ppb-level mercury (II) in water, and was found to exhibit good linearity and low detection limit. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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15 pages, 4028 KiB  
Article
Investigation of Plasma Activated Si-Si Bonded Interface by Infrared Image Based on Combination of Spatial Domain and Morphology
by Mao Du, Dongling Li and Yufei Liu
Micromachines 2019, 10(7), 445; https://doi.org/10.3390/mi10070445 - 02 Jul 2019
Cited by 4 | Viewed by 3319
Abstract
This paper presents a detection method for characterizing the bonded interface of O2 plasma activated silicon wafer direct bonding. The images, obtained by infrared imaging system, were analyzed by the software based on spatial domain and morphology methods. The spatial domain processing [...] Read more.
This paper presents a detection method for characterizing the bonded interface of O2 plasma activated silicon wafer direct bonding. The images, obtained by infrared imaging system, were analyzed by the software based on spatial domain and morphology methods. The spatial domain processing methods, including median filtering and Laplace operator, were applied to achieve de-noising and contrast enhancement. With optimized parameters of sharpening operator patterns, disk size, binarization threshold, morphological parameter A and B, the void contours were clear and convenient for segmentation, and the bonding rate was accurately calculated. Furthermore, the void characteristics with different sizes and distributions were also analyzed, and the detailed statistics of the void’s number and size are given. Moreover, the orthogonal experiment was designed and analyzed, indicating that O2 flow has the greatest influence on the bonding rate in comparison with activated time and power. With the optimized process parameters of activated power of 150 W, O2 flow of 100 sccm and time of 120 s, the testing results show that the bonding rate can reach 94.51% and the bonding strength is 12.32 MPa. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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13 pages, 3956 KiB  
Article
Wearable Woven Triboelectric Nanogenerator Utilizing Electrospun PVDF Nanofibers for Mechanical Energy Harvesting
by Muhammad Omar Shaikh, Yu-Bin Huang, Cheng-Chien Wang and Cheng-Hsin Chuang
Micromachines 2019, 10(7), 438; https://doi.org/10.3390/mi10070438 - 30 Jun 2019
Cited by 57 | Viewed by 5634
Abstract
Several wearable devices have already been commercialized and are likely to open up a new life pattern for consumers. However, the limited energy capacity and lifetime have made batteries the bottleneck in wearable technology. Thus, there have been growing efforts in the area [...] Read more.
Several wearable devices have already been commercialized and are likely to open up a new life pattern for consumers. However, the limited energy capacity and lifetime have made batteries the bottleneck in wearable technology. Thus, there have been growing efforts in the area of self-powered wearables that harvest ambient mechanical energy directly from surroundings. Herein, we demonstrate a woven triboelectric nanogenerator (WTENG) utilizing electrospun Polyvinylidene fluoride (PVDF) nanofibers and commercial nylon cloth to effectively harvest mechanical energy from human motion. The PVDF nanofibers were fabricated using a highly scalable multi-nozzle far-field centrifugal electrospinning protocol. We have also doped the PVDF nanofibers with small amounts of multi-walled carbon nanotubes (MWCNT) to improve their triboelectric performance by facilitating the growth of crystalline β-phase with a high net dipole moment that results in enhanced surface charge density during contact electrification. The electrical output of the WTENG was characterized under a range of applied forces and frequencies. The WTENG can be triggered by various free-standing triboelectric layers and reaches a high output voltage and current of about 14 V and 0.7 µA, respectively, for the size dimensions 6 × 6 cm. To demonstrate the potential applications and feasibility for harvesting energy from human motion, we have integrated the WTENG into human clothing and as a floor mat (or potential energy generating shoe). The proposed triboelectric nanogenerator (TENG) shows promise for a range of power generation applications and self-powered wearable devices. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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15 pages, 6456 KiB  
Article
Concentric Split Aluminum with Silicon-Aluminum Nitride Annular Rings Resonators
by Muhammad Ammar Khan, Jing-Fu Bao, Fei-Hong Bao and Xin Zhou
Micromachines 2019, 10(5), 296; https://doi.org/10.3390/mi10050296 - 30 Apr 2019
Cited by 13 | Viewed by 3274
Abstract
This paper presents a novel approach of annular concentric split rings microelectromechanical resonators with tether configuration to reduce anchor loss and gives very high-quality factor (Q) 2.97 Million based on FEA (Finite Element Analysis) simulation. The operating frequencies of these resonators [...] Read more.
This paper presents a novel approach of annular concentric split rings microelectromechanical resonators with tether configuration to reduce anchor loss and gives very high-quality factor (Q) 2.97 Million based on FEA (Finite Element Analysis) simulation. The operating frequencies of these resonators are 188.55 MHz to 188.62 MHz. When the proposed SR (square rectangle) hole shaped one dimensional phononic crystal (1D PnC), and two dimensional phononic crystal (2D PnC) structure consist of very wide and complete band gaps is applied to novel design rings MEMS resonators, the quality factor (Q) further improved to 19.7 Million and 1750 Million, respectively, by using the finite element method. It is also observed that band gaps become closer by reducing the value of filling fraction, and proposed SR PnC gives extensive peak attenuation. Moreover, harmonic response of ring resonator is verified by the perfect match layers (PML) technique surrounded by resonators with varying width 1.5λ, and 3λ effectively reduce the vibration displacement. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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12 pages, 2780 KiB  
Article
A Measurement-Data-Driven Control Approach towards Variance Reduction of Micromachined Resonant Accelerometer under Multi Unknown Disturbances
by Qiang Shen, Dengfeng Yang, Jie Zhou, Yixuan Wu, Yinan Zhang and Weizheng Yuan
Micromachines 2019, 10(5), 294; https://doi.org/10.3390/mi10050294 - 30 Apr 2019
Cited by 5 | Viewed by 2390
Abstract
This paper first presents an adaptive expectation-maximization (AEM) control algorithm based on a measurement-data-driven model to reduce the variance of microelectromechanical system (MEMS) accelerometer sensor under multi disturbances. Significantly different characteristics of the disturbances, consisting of drastic-magnitude, short-duration vibration in the external environment, [...] Read more.
This paper first presents an adaptive expectation-maximization (AEM) control algorithm based on a measurement-data-driven model to reduce the variance of microelectromechanical system (MEMS) accelerometer sensor under multi disturbances. Significantly different characteristics of the disturbances, consisting of drastic-magnitude, short-duration vibration in the external environment, and slowly-varying, long-duration fluctuation inside the sensor are first constructed together with the measurement model of the accelerometer. Next, through establishing a data-driven model based on a historical small measurement sample, the window length of filter of the presented algorithm is adaptively chosen to estimate the sensor state and identify these disturbances simultaneously. Simulation results of the proposed AEM algorithm based on experimental test are compared with the Kalman filter (KF), least mean square (LMS), and regular EM (REM) methods. Variances of the estimated equivalent input under static condition are 0.212 mV, 0.149 mV, 0.015 mV, and 0.004 mV by the KF, LMS, REM, and AEM, respectively. Under dynamic conditions, the corresponding variances are 35.5 mV, 2.07 mV, 2.0 mV, and 1.45 mV, respectively. The variances under static condition based on the proposed method are reduced to 1.9%, 2.8%, and 27.3%, compared with the KF, LMS, and REM methods, respectively. The corresponding variances under dynamic condition are reduced to 4.1%, 70.1%, and 72.5%, respectively. The effectiveness of the proposed method is verified to reduce the variance of the MEMS resonant accelerometer sensor. Full article
(This article belongs to the Special Issue Advanced MEMS/NEMS Technology, Volume II)
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