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Micromachines
Special Issues
Silicon-Based Integrated Photonic Devices
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Silicon-Based Integrated Photonic Devices

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: closed (25 September 2023) | Viewed by 3048

Special Issue Editors

Prof. Dr. Binhao Wang

E-Mail Website
Guest Editor
Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi’an 710119, China
Interests: optical interconnects; silicon photonics; semiconductor lasers; avalanche photodiodes; microwave photonics
Special Issues, Collections and Topics in MDPI journals
Dr. Zhiyuan Yu

E-Mail Website
Guest Editor
State Key Laboratory of Transient Optics and Photonics, Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi’an 710119, China
Interests: optical interconnects; silicon photonics; semiconductor lasers
Dr. Yangming Ren

E-Mail Website
Guest Editor
State Key Laboratory of Transient Optics and Photonics, Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi’an 710119, China
Interests: optical interconnects; silicon photonics

Special Issue Information

Dear Colleagues,

With the rapid development of 5G, big data, Internet of Things, driverless, AR/VR and other technologies, the demand to increase data processing and transmission capacities becomes increasingly more urgent. At the same time, the development of Moore’s law in microelectronics is also close to the limit. In recent years, the hybrid integration technology of microelectronics and optoelectronics has developed rapidly by taking advantage of both photon high-bandwidth information transmission and advanced manufacturing and processing technology of microelectronics. Silicon photonic devices, such as optical waveguides, modulators, detectors, and optical switches, have shown promising performance, developing towards smaller sizes, better performance, and higher integration. 

The Special Issue aims to reflect the latest research achievements and the development trends of silicon-based integrated photonic devices. In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following: 

  • Heterogeneous integration based on silicon;
  • Silicon-based light sources; 
  • Silicon-based modulators; 
  • Silicon-based detectors; 
  • Silicon-based passive devices; 
  • Silicon-based optical switches; 
  • New materials for silicon-based integrated photonics.

We look forward to receiving your contributions.

Prof. Dr. Binhao Wang
Dr. Zhiyuan Yu
Dr. Yangming Ren
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • silicon photonics
  • photonic integration
  • active components
  • passive components
  • optical interconnects

Published Papers (1 paper)

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Research

9 pages, 5286 KiB  
Article
Si Photonics FMCW LiDAR Chip with Solid-State Beam Steering by Interleaved Coaxial Optical Phased Array
by Yufang Lei, Lingxuan Zhang, Zhiyuan Yu, Yulong Xue, Yangming Ren and Xiaochen Sun
Micromachines 2023, 14(5), 1001; https://doi.org/10.3390/mi14051001 - 5 May 2023
Cited by 4 | Viewed by 2716
Abstract
LiDAR has attracted increasing attention because of its strong anti-interference ability and high resolution. Traditional LiDAR systems rely on discrete components and face the challenges of high cost, large volume, and complex construction. Photonic integration technology can solve these problems and achieve high [...] Read more.
LiDAR has attracted increasing attention because of its strong anti-interference ability and high resolution. Traditional LiDAR systems rely on discrete components and face the challenges of high cost, large volume, and complex construction. Photonic integration technology can solve these problems and achieve high integration, compact dimension, and low-cost on-chip LiDAR solutions. A solid-state frequency-modulated continuous-wave LiDAR based on a silicon photonic chip is proposed and demonstrated. Two sets of optical phased array antennas are integrated on an optical chip to form a transmitter–receiver interleaved coaxial all-solid-state coherent optical system which provides high power efficiency, in principle, compared with a coaxial optical system using a 2 × 2 beam splitter. The solid-state scanning on the chip is realized by optical phased array without a mechanical structure. A 32-channel transmitter–receiver interleaved coaxial all-solid-state FMCW LiDAR chip design is demonstrated. The measured beam width is 0.4° × 0.8°, and the grating lobe suppression ratio is 6 dB. Preliminary FMCW ranging of multiple targets scanned by OPA was performed. The photonic integrated chip is fabricated on a CMOS-compatible silicon photonics platform, providing a steady path to the commercialization of low-cost on-chip solid-state FMCW LiDAR. Full article
(This article belongs to the Special Issue Silicon-Based Integrated Photonic Devices)
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