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Micromachines
Special Issues
Nanoscale Thermal Transport and Management
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Nanoscale Thermal Transport and Management

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: closed (15 July 2023) | Viewed by 4197

Special Issue Editors

Dr. Tianzhuo Zhan

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Guest Editor
Bio-Nano Electronics Research Centre, Toyo University, Saitama 3508585, Japan
Interests: nanoscale thermal transport; thermoelectric generators; thermal management; thermal interface materials
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Mengjie Song

E-Mail Website
Guest Editor
Department of Energy and Power Engineering, School of Mechanical Engineering, Beijing Institute of Technology, Beijing 100081, China
Interests: frosting; icing; heat pump; thermal comfort; advanced cooling; flow boiling
Special Issues, Collections and Topics in MDPI journals
Dr. Yanguang Zhou

E-Mail Website
Guest Editor
Mechanical and Aerospace Engineering Department, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
Interests: cooling technologies i.e., evaporative and conductive cooling; multi-timescale and spatial scale simulations; quantifying heat transport at the interfaces via experiments and simulations; synthesis of mof based composites; algorithm development on nanoscale heat transfer
Dr. Yen-Ju Wu

E-Mail Website
Guest Editor
National Institute for Materials Science (NIMS), 1-2-1 Sengen, Tsukuba-city 305-0047, Ibaraki, Japan
Interests: thermal management; machine learning; materials informatics; thin film; carrier conductivity

Special Issue Information

Dear Colleagues,

All electronic devices generate Joule heat as a byproduct, which affects the performance, reliability, and service life of these devices. Thus, thermal management is indispensable in various applications, such as microprocessors, power semiconductor devices, light-emitting diodes, photovoltaic systems, batteries, etc. Heat sinks, heat pipes, thermal interface materials, and forced convection are widely used techniques for cooling. Moreover, phase change materials, microchannels, and thermoelectric cooling are innovative and promising techniques for thermal management.

With the continuous decrease in the size of devices, the characteristic length of devices and structures has shrunk to the nanoscale, which is smaller than that of the phonon mean free paths or even comparable to the phonon wavelength. As a result, interfaces play a vital role in nanoscale thermal transport, and thermal boundary resistance dictates the overall thermal resistance of nanostructures and nanosystems. Therefore, the investigation of nanoscale thermal transport is crucial for thermal management.

The aim of this Special Issue is to invite research papers, communications, and review articles on recent experimental, numerical, and theoretical developments in the field of nanoscale thermal transport and thermal management.

Potential topics include but are not limited to the following:

  • Nanoscale thermal transport;
  • Thermal conductivity of nanomaterials;
  • Interfacial thermal resistance;
  • Thermal management techniques;
  • Convection heat transfer;
  • Phase change materials;
  • Thermoelectric cooling;
  • Heat sinks and heat spreaders;
  • Microchannel cooling.

Dr. Tianzhuo Zhan
Prof. Dr. Mengjie Song
Dr. Yanguang Zhou
Dr. Yen-Ju Wu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • nanoscale thermal transport
  • thermal conductivity
  • thermal boundary resistance
  • thermal management
  • thermal interface materials
  • thermoelectric
  • convection cooling
  • phase change materials
  • heat sinks
  • heat pipes
  • microchannels

Published Papers (3 papers)

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Research

21 pages, 7881 KiB  
Article
Thermal Management of Microelectronic Devices Using Nanofluid with Metal foam Heat Sink
by Muhammad Teham Tahir, Shahzaib Anwar, Naseem Ahmad, Mariyam Sattar, Usama Waleed Qazi, Usman Ghafoor and Muhammad Raheel Bhutta
Micromachines 2023, 14(7), 1475; https://doi.org/10.3390/mi14071475 - 23 Jul 2023
Cited by 2 | Viewed by 1382
Abstract
Microelectronic components are used in a variety of applications that range from processing units to smart devices. These components are prone to malfunctions at high temperatures exceeding 373 K in the form of heat dissipation. To resolve this issue, in microelectronic components, a [...] Read more.
Microelectronic components are used in a variety of applications that range from processing units to smart devices. These components are prone to malfunctions at high temperatures exceeding 373 K in the form of heat dissipation. To resolve this issue, in microelectronic components, a cooling system is required. This issue can be better dealt with by using a combination of metal foam, heat sinks, and nanofluids. This study investigates the effect of using a rectangular-finned heat sink integrated with metal foam between the fins, and different water-based nanofluids as the working fluid for cooling purposes. A 3D numerical model of the metal foam with a BCC-unit cell structure is used. Various parameters are analyzed: temperature, pressure drop, overall heat transfer coefficient, Nusselt number, and flow rate. Fluid flows through the metal foam in a turbulent flow with a Reynold’s number ranging from 2100 to 6500. The optimum fin height, thickness, spacing, and base thickness for the heat sink are analyzed, and for the metal foam, the material, porosity, and pore density are investigated. In addition, the volume fraction, nanoparticle material, and flow rate for the nanofluid is obtained. The results showed that the use of metal foam enhanced the thermal performance of the heat sink, and nanofluids provided better thermal management than pure water. For both cases, a higher Nusselt number, overall heat transfer coefficient, and better temperature reduction is achieved. CuO nanofluid and high-porosity low-pore-density metal foam provided the optimum results, namely a base temperature of 314 K, compared to 341 K, with a pressure drop of 130 Pa. A trade-off was achieved between the temperature reduction and pumping power, as higher concentrations of nanofluid provided better thermal management and resulted in a large pressure drop. Full article
(This article belongs to the Special Issue Nanoscale Thermal Transport and Management)
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12 pages, 3041 KiB  
Article
Data-Driven Design of Transparent Thermal Insulating Nanoscale Layered Oxides
by Yen-Ju Wu and Yibin Xu
Micromachines 2023, 14(1), 186; https://doi.org/10.3390/mi14010186 - 11 Jan 2023
Viewed by 1062
Abstract
Predicting the interfacial thermal resistance (ITR) for various material systems is a time-consuming process. In this study, we applied our previously proposed ITR machine learning models to discover the material systems that satisfy both high transparency and low thermal conductivity. The selected material [...] Read more.
Predicting the interfacial thermal resistance (ITR) for various material systems is a time-consuming process. In this study, we applied our previously proposed ITR machine learning models to discover the material systems that satisfy both high transparency and low thermal conductivity. The selected material system of TiO2/SiO2 shows a high ITR of 26.56 m2K/GW, which is in good agreement with the predicted value. The nanoscale layered TiO2/SiO2 thin films synthesized by sputtering exhibits ultralow thermal conductivity (0.21 W/mK) and high transparency (>90%, 380–800 nm). The reduction of the thermal conductivity is achieved by the high density of the interfaces with a high ITR rather than the change of the intrinsic thermal conductivity. The thermal conductivity of TiO2 is observed to be 1.56 W/mK with the film thickness in the range of 5–50 nm. Furthermore, the strong substrate dependence is confirmed as the thermal conductivity of the nanoscale layered TiO2/SiO2 thin films on quartz glass is three times lower than that on Si. The proposed TiO2/SiO2 composites have higher transparency and robustness, good adaptivity to electronics, and lower cost than the current transparent thermal insulating materials such as aerogels and polypropylene. The good agreement of the experimental ITR with the prediction and the low thermal conductivity of the layered thin films promise this strategy has great potential for accelerating the development of transparent thermal insulators. Full article
(This article belongs to the Special Issue Nanoscale Thermal Transport and Management)
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18 pages, 4568 KiB  
Article
Performance of Air-Conditioning System with Different Nanoparticle Composition Ratio of Hybrid Nanolubricant
by Nurul Nadia Mohd Zawawi, Wan Hamzah Azmi, Mohd Fairusham Ghazali and Hafiz Muhammad Ali
Micromachines 2022, 13(11), 1871; https://doi.org/10.3390/mi13111871 - 30 Oct 2022
Cited by 14 | Viewed by 1225
Abstract
To reduce fuel consumption, the automotive air-conditioning (AAC) system’s coefficient of performance (COP) needs to be improved. The use of a diverse selection of hybrid nanolubricant composition ratios is expected to improve the properties of single nanolubricants, resulting in improved AAC system performance. [...] Read more.
To reduce fuel consumption, the automotive air-conditioning (AAC) system’s coefficient of performance (COP) needs to be improved. The use of a diverse selection of hybrid nanolubricant composition ratios is expected to improve the properties of single nanolubricants, resulting in improved AAC system performance. The goal of this study was to find the best combination of hybrid nanolubricants for the best performance of the AAC system. Al2O3-SiO2/PAG hybrid nanolubricants at 0.06% volume concentrations with various composition ratios (20:80, 40:60, 50:50, 60:40, and 80:20) were investigated. An initial refrigerant charge of up to 155 g and a compressor speed of up to 2100 rpm were used in the experiment. The cooling capacity, compressor work, and COP of the AAC system were measured to determine its efficiency. The COP enhancement and compressor work reduction were recorded up to 16.31% and 18.65% for the 60:40 composition ratio, respectively. The maximum cooling capacity up to 75.84% was recorded for the 80:20 ratio, followed by 60:40. The maximum COP value of 8.81 for 155 g of hybrid nanolubricants was obtained at 900 rpm with a 60:40 composition ratio. Therefore, for optimal performance in the AAC system, a 60:40 composition ratio of the Al2O3-SiO2/PAG nanolubricant combination is strongly recommended. Full article
(This article belongs to the Special Issue Nanoscale Thermal Transport and Management)
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