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Micromachines
Special Issues
Microwave Passive Components, 2nd Edition
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Microwave Passive Components, 2nd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".

Deadline for manuscript submissions: 31 August 2024 | Viewed by 3571

Special Issue Editors

Dr. Guoxiang Shu

E-Mail Website
Guest Editor
College of Electronics and Information Engineering, Shenzhen University, Shenzhen 518060, China
Interests: vacuum electronic devices; millimeter-wave/THz passive devices; dielectric microwave measurement
Special Issues, Collections and Topics in MDPI journals
Dr. Guo Liu

E-Mail Website
Guest Editor
School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: vacuum electronic devices; passive pulse compressor; microwave biosensor; dielectric microwave measurement
Special Issues, Collections and Topics in MDPI journals
Dr. Dian Zhang

E-Mail Website
Guest Editor
College of Advanced Interdisciplinary Studies, National University of Defense Technology, Changsha 410073, China
Interests: high power microwave devices; microwave mode converters; millimeter wave sources
Dr. Luqi Zhang

E-Mail Website
Guest Editor
Institute of Applied Electronics, China Academy of Engineering Physics, Mianyang 621900, China
Interests: vacuum electronic devices; microwave passive components; terahertz transmission line; terahertz micromachining

Special Issue Information

Dear Colleagues,

Today, micro-, millimeter and terahertz wave devices and systems have been widely used in various aspects of life, such as the 5G/6G communication, vehicle imaging radar, medical, bio-science, security, etc. As is well-known, microwave passive components play an important role in the design and application of these devices and systems. Especially with the development of advanced machining technologies, such as the micro-electro-mechanical system (MEMS), 3D printing, and micro-/nano-machining, the machining accuracy and ability of the passive components have been improved greatly. In addition, in the past two decades, novel concepts and mechanisms have been continually introduced or proposed from other fields, including the meta-material, vortex electromagnetic wave, and spoof surface plasmon. This has made the microwave passive devices/components enter a new stage controlled by information coding. That means the performance of microwave passive devices still has great potential in the future, which may contribute to the miniaturization and integration of RF circuits and devices. Prof. Guo Liu has organized a Special Issue entitled “Microwave Passive Components”, which received a strong response within the field. Therefore, this Special Issue, entitled “Microwave Passive Components, 2nd Edition”, was created, devoted to continue exploring for research papers, short communications, and review articles focusing on the theory, modeling, simulation, measurement and applications of passive components, circuits, devices and systems in the microwave, millimeter-wave and terahertz-wave bands.

We look forward to receiving your contributions to this Special Issue.

Dr. Guoxiang Shu
Dr. Guo Liu
Dr. Dian Zhang
Dr. Luqi Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • theory, modeling, fabrication, measurement and applications
  • microwave, millimeter and terahertz wave passive component/devices applied in the communication, radar and some other systems
  • passive component/devices in antenna, filters, biosensors, vacuum electronic devices, pulse compressor, particle accelerator, etc.
  • other work related to microwave devices

Related Special Issue

Published Papers (4 papers)

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Research

12 pages, 34515 KiB  
Article
A Compact Broadband Power Combiner for High-Power, Continuous-Wave Applications
by Zihan Yang, Qiang Zhang, Kelin Zhou, Lishan Zhao and Jun Zhang
Micromachines 2024, 15(2), 207; https://doi.org/10.3390/mi15020207 - 30 Jan 2024
Viewed by 689
Abstract
A compact broadband combiner with a high power capacity and a low insertion loss, which is especially useful for solid-state power sources where multi-way power synthesis is needed, was designed and experimentally investigated. The combiner could combine the microwave signals of sixteen terminals [...] Read more.
A compact broadband combiner with a high power capacity and a low insertion loss, which is especially useful for solid-state power sources where multi-way power synthesis is needed, was designed and experimentally investigated. The combiner could combine the microwave signals of sixteen terminals into a single one and was based on a radial-line waveguide whose circumferential symmetry benefited the amplitude and phase consistency of the combiner. Simulation and experimental results showed that the prototype device, designed for S-band applications, exhibited a reflection coefficient S1,1 < −20 dB in the range of 2.06–2.93 GHz, which corresponds to a relative bandwidth of approximately 34.6%. At 2.45 GHz, the phase imbalance was ±4.5° and the 16-way transmission coefficient was concentrated around −12.0~−12.3 dB. The insertion loss of the device at ambient and elevated temperatures was simulated and experimentally verified, which is of importance for the design of similar high-power microwave combiners. High-power tests proved that even without enforced wind or liquid cooling, the device can handle continuous power (CW) of at least 3.9 kW, which can be much enhanced by taking regular cooling measures. The combined features of the designed combiner suggest promising applications for power synthesis in high-power, solid-state RF sources. Full article
(This article belongs to the Special Issue Microwave Passive Components, 2nd Edition)
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13 pages, 16250 KiB  
Article
Broadband Continuous Transverse Stub (CTS) Array Antenna for High-Power Applications
by Yunfei Sun, Kelin Zhou, Juntao He, Zihan Yang, Chengwei Yuan and Qiang Zhang
Micromachines 2023, 14(11), 2127; https://doi.org/10.3390/mi14112127 - 20 Nov 2023
Viewed by 855
Abstract
A continuous transverse stub (CTS) array antenna with broad bandwidth and high-power handling capacity is proposed in this paper. The technologies of multi-step impedance matching and T-shaped electromagnetic band-gap (EBG) loading are utilized, which improved the antenna operating frequency bandwidth. An H-plane lens [...] Read more.
A continuous transverse stub (CTS) array antenna with broad bandwidth and high-power handling capacity is proposed in this paper. The technologies of multi-step impedance matching and T-shaped electromagnetic band-gap (EBG) loading are utilized, which improved the antenna operating frequency bandwidth. An H-plane lens horn is used to feed the CTS array. As a result, a good bandwidth capability of more than 32% is achieved, with a gain variation less than 3.0 dB. The measured sidelobe level (SLL) is below −18 dB in the entire frequency range. Moreover, the power handling capacity of the antenna is more than 80 MW and can reach the GW level after arraying, which indicates that this antenna has application potential in the high-power microwave (HPM) field. Full article
(This article belongs to the Special Issue Microwave Passive Components, 2nd Edition)
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18 pages, 6109 KiB  
Article
Accurate Microwave Circuit Co-Simulation Method Based on Simplified Equivalent Circuit Modeling
by Sanghyun Kim, Won-Sang Yoon, Jongsik Lim and Sang-Min Han
Micromachines 2023, 14(10), 1847; https://doi.org/10.3390/mi14101847 - 27 Sep 2023
Cited by 1 | Viewed by 876
Abstract
A new co-simulation method is proposed for active devices and electromagnetic resonant circuits at microwave frequency range. For the measured and extracted device parameters, three steps of equivalent circuit models are processed of the general, simplified, and EM RLC models. To overcome the [...] Read more.
A new co-simulation method is proposed for active devices and electromagnetic resonant circuits at microwave frequency range. For the measured and extracted device parameters, three steps of equivalent circuit models are processed of the general, simplified, and EM RLC models. To overcome the limited lumped element simulation in an electromagnetic simulator, the simplified equivalent circuit model is established by mathematical computation. The co-simulation procedures are described and experimentally verified for commercial diodes. The application circuit is designed and implemented using the proposed co-simulation method. The experimental results verify that design using the proposed co-simulated method presented excellent agreement for a wideband frequency range of 0–4 GHz, compared with that using a conventional design method. The proposed co-simulation method can be applied to any commercial EM simulation tools without active model error. Full article
(This article belongs to the Special Issue Microwave Passive Components, 2nd Edition)
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14 pages, 3358 KiB  
Article
Design of Multiplexers for IoT-Based Applications Using Stub-Loaded Coupled-Line Resonators
by Muhammad Idrees, Sohail Khalid, Muhammad Abdul Rehman, Syed Sajid Ullah, Saddam Hussain and Jawaid Iqbal
Micromachines 2023, 14(10), 1821; https://doi.org/10.3390/mi14101821 - 23 Sep 2023
Cited by 1 | Viewed by 767
Abstract
This paper presents the design of microstrip-based multiplexers using stub-loaded coupled-line resonators. The proposed multiplexers consist of a diplexer and a triplexer, meticulously engineered to operate at specific frequency bands relevant to IoT systems: 2.55 GHz, 3.94 GHz, and 5.75 GHz. To enhance [...] Read more.
This paper presents the design of microstrip-based multiplexers using stub-loaded coupled-line resonators. The proposed multiplexers consist of a diplexer and a triplexer, meticulously engineered to operate at specific frequency bands relevant to IoT systems: 2.55 GHz, 3.94 GHz, and 5.75 GHz. To enhance isolation and selectivity between the two passband regions, the diplexer incorporates five transmission poles (TPs) within its design. Similarly, the triplexer filter employs seven transmission poles to attain the desired performance across all three passbands. A comprehensive comparison was conducted against previously reported designs, considering crucial parameters such as size, insertion loss, return loss, and isolation between the two frequency bands. The fabrication of the diplexer and triplexer was carried out on a compact Rogers Duroid 5880 substrate. The experimental results demonstrate an exceptional performance, with the diplexer exhibiting a low insertion loss of 0.3 dB at 2.55 GHz and 0.4 dB at 3.94 GHz. The triplexer exhibits an insertion loss of 0.3 dB at 2.55 GHz, 0.37 dB at 3.94 GHz, and 0.2 dB at 5.75 GHz. The measured performance of the fabricated diplexer and triplexer aligns well with the simulated results, validating their effectiveness in meeting the desired specifications. Full article
(This article belongs to the Special Issue Microwave Passive Components, 2nd Edition)
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