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Metals
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Electrochemical Deposition and Characterization of Metallic Materials
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Electrochemical Deposition and Characterization of Metallic Materials

A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Powder Metallurgy".

Deadline for manuscript submissions: closed (20 April 2024) | Viewed by 1832

Special Issue Editor

Dr. Nebojša Nikolić

E-Mail Website
Guest Editor
Department of Electrochemistry, Institute of Chemistry, Technology and Metallurgy, University of Belgrade, Njegoševa 12, Belgrade, Serbia
Interests: electrodeposition; powders; hydrogen evolution; thin films; bright coatings; electrochemical biosensors; mechanical properties.

Special Issue Information

Dear Colleagues,

Electrodeposition is a widely used method of obtaining metals and alloys of desired morphological and structural characteristics and finds use at both nano and micro levels. Morphology, as the most important characteristic of electrodeposited metals and alloys, depends on parameters and regimes of electrodeposition. The primary parameters determining surface morphology are: composition and type of the electrolyte; type of cathodic material; temperature of electrodeposition; the presence of hydrogen evolution as a parallel reaction; an addition of specific substances, known as levelling and brightening additives, to the electrolyte; electrolyte stirring; and time of the electrodeposition. Various surface morphologies, including compact deposits that range from smooth at the atomic level to very disperse (irregular, powder) and honeycomb-like deposits with an extremely high surface area, can be obtained by altering the above-mentioned electrodeposition parameters. In order to obtain these electrodeposits, both constant (potentiostatic and galvanostatic) and periodically changing regimes of electrodeposition, such as pulsating overpotential (PO), pulsating current (PC) and reversing current (RC), are required. The PC and RC regimes are commonly referred to as pulse reverse current (PRC) regimes.

All existing industries, but also other areas like medicine, use the products of electrodeposition. Although electrodeposition processes from aqueous electrolytes are still the most commonly used processes for commercial purposes, processes of electrodeposition from melt, ionic liquids and deep eutectic solvents (DES) are finding increasing application.

This Special Issue will focus on both fundamental and applied aspects of the electrodeposition processes. Reports on morphological and structural characterization of electrodeposited metals and alloys, such as optical microscopy (OM), scanning electron microscopy (SEM), atomic force microscopy (AFM), transmission electron microscopy (TEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and others, are welcome.

Dr. Nebojša Nikolić
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electrodeposition
  • morphology
  • structure
  • characterization
  • powders
  • thin films
  • coatings
  • hydrogen evolution
  • metal matrix composites

Published Papers (2 papers)

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Research

15 pages, 7276 KiB  
Article
Influence of the Applied External Magnetic Field on the Deposition of Ni–Cu Alloys
by Katarzyna Skibińska, Safya Elsharkawy, Karolina Kołczyk-Siedlecka, Dawid Kutyła and Piotr Żabiński
Metals 2024, 14(3), 281; https://doi.org/10.3390/met14030281 - 28 Feb 2024
Viewed by 721
Abstract
Ni–Cu alloys are suitable candidates as catalysts in hydrogen evolution reaction. Because of the different magnetic properties of Ni and Cu, the influence of an applied external magnetic field on the synthesis Ni–Cu alloys was studied. The coatings were prepared with visible changes [...] Read more.
Ni–Cu alloys are suitable candidates as catalysts in hydrogen evolution reaction. Because of the different magnetic properties of Ni and Cu, the influence of an applied external magnetic field on the synthesis Ni–Cu alloys was studied. The coatings were prepared with visible changes in their appearance. The differences between the observed regions were studied in terms of morphology and chemical composition. In addition, the overall chemical and phase compositions were determined using X-ray fluorescence and X-ray diffraction methods, respectively. The catalytic activity was measured in 1 M NaOH using linear sweep voltammetry. The contact angle was determined using contour analysis. All samples were hydrophilic. Hydrogen evolution started at different times depending on the area on the surface. It started earliest on the coating obtained in parallel to the electrode magnetic field at 250 mT. We found that when the Lorenz force is maximal, Cu deposition is preferred because of the enhancement of mass transport. Full article
(This article belongs to the Special Issue Electrochemical Deposition and Characterization of Metallic Materials)
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20 pages, 12586 KiB  
Article
Mechanical Properties of Electrolytically Produced Copper Coatings Reinforced with Pigment Particles
by Ivana O. Mladenović, Marija M. Vuksanović, Stevan P. Dimitrijević, Rastko Vasilić, Vesna J. Radojević, Dana G. Vasiljević-Radović and Nebojša D. Nikolić
Metals 2023, 13(12), 1979; https://doi.org/10.3390/met13121979 - 06 Dec 2023
Viewed by 874
Abstract
Copper from sulfate baths without and with added inorganic pigment particles based on strontium aluminate doped with europium and dysprosium (SrAl2O4: Eu2+, Dy3+) was electrodeposited on a brass cathode by a galvanostatic regime. Morphological, structural, [...] Read more.
Copper from sulfate baths without and with added inorganic pigment particles based on strontium aluminate doped with europium and dysprosium (SrAl2O4: Eu2+, Dy3+) was electrodeposited on a brass cathode by a galvanostatic regime. Morphological, structural, and roughness analysis of the pigment particles, the pure (pigment-free) Cu coating, and the Cu coatings with incorporated pigment particles were performed using SEM, XRD, and AFM techniques, respectively. Hardness and creep resistance were considered for the examination of the mechanical properties of the Cu coatings, applying Chicot–Lesage (for hardness) and Sargent–Ashby (for creep resistance) mathematical models. The wettability of the Cu coatings was examined by the static sessile drop method by a measurement of the water contact angle. The incorporation of pigment particles in the Cu deposits did not significantly affect the morphology or texture of the coatings, while the roughness of the deposits rose with the rise in pigment particle concentrations. The hardness of the Cu coatings also increased with the increasing concentration of pigments and was greater than that obtained for the pigment-free Cu coating. The presence of the pigments caused a change in the wettability of the Cu coatings from hydrophilic (for the pigment-free Cu coating) to hydrophobic (for Cu coatings with incorporated particles) surface areas. Full article
(This article belongs to the Special Issue Electrochemical Deposition and Characterization of Metallic Materials)
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