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Metals
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Advanced Studies in Solder Joints
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Advanced Studies in Solder Joints

A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Welding and Joining".

Deadline for manuscript submissions: 31 December 2024 | Viewed by 2642

Special Issue Editors

Dr. Haoran Ma

E-Mail Website
Guest Editor
School of Microelectronics, Dalian University of Technology, Dalian, China
Interests: solder joint; soldering alloys; intermetallics
Dr. Yi Zhong

E-Mail Website
Guest Editor
School of Electronic Science and Engineering (National Model Microelectronics College), Xiamen University, Xiamen, China
Interests: microsystem packaging; solder interconnect; hybrid bonding
Dr. Anil Kunwar

E-Mail Website
Guest Editor
Faculty of Mechanical Engineering, Silesian University of Technology, Konarskiego 18A, 44-100 Gliwice, Poland
Interests: finite element method; laser-material interaction; data-driven materials science; artificial neural network; Pb-free solder alloys; intermetallic compounds; multi-principal element alloys; dynamics at materials interface; multiphysics simulation; heat transfer; transport phenomena at mesoscale; in situ imaging techniques
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Solder joints have been the key structural component in advanced packaging. Following Moore's Law leading the development of chip technology gradually approaching the physical limit in recent years, the realization of "More than Moore" through advanced packaging technology has become the main developing direction of electronic manufacturing. Significant advances in solder joints have been achieved as a result of interdisciplinary research in related fields of materials characterization, mechanical property, microelectronics technology, physics and chemistry, constitutive modeling, mathematical analysis and numerical methods. On the other hand, also during this period, industries have shown a multitude of interests in developing and testing new solder materials or interconnecting technologies in various kinds of electronics manufacturing and packaging.

This Special Issue on “Advanced Studies in Solder Joints” intends to collect the latest developments in the field, written by well-known researchers who have contributed significantly on at least one of these specific topics - interfacial reaction mechanisms, microstructures and properties characterization, numerical modeling and simulations of solder joints in advanced electronic manufacturing and packaging.

Topics addressed in this Special Issue may include, but are not limited to:

  • Interfacial reaction mechanisms;
  • Innovation in solder material or jointing technology;
  • Solder microstructure and properties;
  • Interconnecting reliability and testing;
  • Computational modeling and numerical simulation;
  • Advanced electronic manufacturing and packaging.

Dr. Haoran Ma
Dr. Yi Zhong
Dr. Anil Kunwar
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • solder joint
  • interfacial reaction
  • microstructure
  • evolution
  • diffusion
  • properties
  • reliability
  • numerical modelling and simulation
  • electronic packaging
  • grain growth
  • intermetallics

Published Papers (2 papers)

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Research

13 pages, 2863 KiB  
Article
First-Principles Study of Cu Addition on Mechanical Properties of Ni3Sn4-Based Intermetallic Compounds
by Jinye Yao, Li Wang, Shihao Guo, Xiaofu Li, Xiangxu Chen, Min Shang, Haoran Ma and Haitao Ma
Metals 2024, 14(1), 64; https://doi.org/10.3390/met14010064 - 05 Jan 2024
Viewed by 778
Abstract
Ni–Cu under-bump metallisation (UBM) can reduce stress and improve wetting ability in technology for electronic packaging technology advances with three-dimensional integrated circuit (3D IC) devices. The bond between the Sn-based solder and Ni–Cu UBM is affected by the formation of intermetallic compounds (IMCs), [...] Read more.
Ni–Cu under-bump metallisation (UBM) can reduce stress and improve wetting ability in technology for electronic packaging technology advances with three-dimensional integrated circuit (3D IC) devices. The bond between the Sn-based solder and Ni–Cu UBM is affected by the formation of intermetallic compounds (IMCs), specifically Ni3Sn4 and (Ni,Cu)3Sn4. This paper investigates the mechanical properties of IMCs, which are critical in assessing the longevity of solder joints. First-principles calculations were carried out to investigate the phase stability, mechanical properties and electronic structures of Ni3Sn4, Ni2.5Cu0.5Sn4, Ni2.0Cu1.0Sn4, and Ni1.5Cu1.5Sn4 IMCs. The calculated formation enthalpies show that the doping of Cu atoms leads to a decrease in the stability of the phases and a reduction in the mechanical properties of the Ni3Sn4 crystal structure. As the concentration of Cu atoms in the Ni3Sn4 cells increases, the bulk modulus values of (Ni,Cu)3Sn4 formed with different compositions decrease from 107.78 GPa to 87.84 GPa, the shear modulus decreases from 56.64 GPa to 45.08 GPa, and the elastic modulus decreases from 144.59 GPa to 115.48 GPa, indicating that the doping of Cu atoms into the Ni3Sn4 cells may adversely affect their mechanical properties and increase the possibility of microcracking at the interface during actual service. The anisotropy of (Ni,Cu)3Sn4 is more significant than that of Ni3Sn4, with Ni2.0Cu1.0Sn4 showing the highest anisotropy. After evaluating the electronic structures, the metallic properties of Ni3Sn4 and the Ni2.5Cu0.5Sn4, Ni2.0Cu1.0Sn4, and Ni1.5Cu1.5Sn4 phases are revealed by electronic structure analysis. The total density of states (TDOS) for (Ni,Cu)3Sn4 structures is mainly influenced by Ni-d and Cu-d states. The addition of Cu atoms can increase the brittleness of Ni3Sn4. In addition, the region where d and p hybridisation occurs gradually increases with increasing Cu content. The electronic properties suggest that the binding energy between Ni and Sn atoms weakens with the addition of Cu atoms, resulting in a decrease in the elastic modulus. This research can serve as a valuable reference and theoretical guide for future applications of these materials. Full article
(This article belongs to the Special Issue Advanced Studies in Solder Joints)
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16 pages, 7452 KiB  
Article
Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates
by Andromeda Dwi Laksono, Tzu-Yang Tsai, Tai-Hsuan Chung, Yong-Chi Chang and Yee-Wen Yen
Metals 2023, 13(1), 12; https://doi.org/10.3390/met13010012 - 21 Dec 2022
Cited by 3 | Viewed by 1279
Abstract
Cu-based alloys are one of the most promising substrates to enhance the performance of lead-frame materials. In the present study, the interfacial reactions in the Sn-0.7 wt.% Cu (SC) lead-free solder reacting with Cu-3.3 wt.% Fe (C194), Cu-2.0 wt.% Be (Alloy 25), and [...] Read more.
Cu-based alloys are one of the most promising substrates to enhance the performance of lead-frame materials. In the present study, the interfacial reactions in the Sn-0.7 wt.% Cu (SC) lead-free solder reacting with Cu-3.3 wt.% Fe (C194), Cu-2.0 wt.% Be (Alloy 25), and Cu-3.3 wt.% Ti (C1990 HP) were investigated. The material underwent a liquid–solid interface reaction, and the reaction time was 0.5 to a few hours at the reaction temperatures of 240 °C, 255 °C, and 270 °C. The morphology, composition, growth rate, and growth mechanism of the intermetallic compounds (IMCs) formed at the interface were investigated in this study. The results showed that the reaction couples of SC/C194, SC/Alloy 25, and SC/C1990 HP formed IMCs, which were the [(Cu, Fe)6Sn5 and (Cu, Fe)3Sn], [(Cu, Be)3Sn and (Cu, Be)6Sn5], and [Cu6Sn5] phases, respectively. Finally, the IMC growth mechanism for the SC/C194, SC/Alloy 25, and SC/C1990 HP couples displayed reaction control, grain boundary diffusion control, and diffusion control, respectively. Full article
(This article belongs to the Special Issue Advanced Studies in Solder Joints)
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