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Microstructure and Mechanical Properties of Solders
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Microstructure and Mechanical Properties of Solders

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Materials Characterization".

Deadline for manuscript submissions: closed (20 August 2023) | Viewed by 3832

Special Issue Editor

Dr. Qingke Zhang

E-Mail Website
Guest Editor
Ningbo Institute of Industrial Technology, Chinese Academy of Sciences, Ningbo, China
Interests: Pb-free solder; low-temperature solder; high-strength solder; thermal fatigue; creep; toughness; coupling damage; fracture mechanisms; interfacial microstructure; brazing; precision connection
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

As a metallurgical joining method with a long history, soldering is now widely used in modern manufacturing, especially in microelectronics. Among all their properties, the mechanical properties of solders are some of the most important; these include tensile properties, shear properties, fatigue life, creep resistance, and impact toughness, among others. The mechanical properties of solders depend directly on their composition and microstructure, and the microstructure (grain structure and precipitates) is affected by the composition, solidification, and aging processes. After the soldering process, the microstructure and mechanical properties of the solders is inevitably affected by the substrates.

Traditionally, SnPb alloys are the most widely used in solder, while Pb has been banned by legislation for environmental reasons. In recent decades, hundreds of Pb-free solders have been proposed. More and more kinds of alloying elements or nanoparticles have been added into Pb-free solders in order to optimize their properties and decrease their cost. The effects and coupled effects of these alloying elements or particles on the microstructure and mechanical properties of solders are complex. In the foreseeable future, Pb-free solders will continue to develop.

The aim of this SI is to understand and summarize the effects of composition and thermal processes on the microstructure and mechanical properties of solders, for example, how the alloy elements affect the solidification and precipitation behaviors of the solders, the relationship between microstructure and mechanical properties. This SI mainly focuses on, but is not limited to, Pb-free solder. Since it is the property of the solder joint that reflects the service performance of a solder, investigations on the effects of soldering on the microstructure of the solder, the effects of solder composition on the solder/substrate interfacial reaction and properties of the solder joint, and the damage behaviors of solders and solder joints will also be welcomed. 

Dr. Qingke Zhang
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • solder
  • microstructure
  • precipitates
  • strength
  • fatigue resistance
  • creep resistance
  • toughness
  • damage mechanisms

Published Papers (2 papers)

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Research

11 pages, 9695 KiB  
Article
Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes
by Hyeokgi Choi, Chang-Lae Kim and Yoonchul Sohn
Materials 2022, 15(23), 8419; https://doi.org/10.3390/ma15238419 - 26 Nov 2022
Cited by 3 | Viewed by 1732
Abstract
Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG) surface finishes. We investigated formation of intermetallic compounds (IMCs) and their diffusion barrier properties at reaction interfaces as functions of Pt NP content in the composite [...] Read more.
Pt-nanoparticle (NP)-alloyed Sn-58Bi solders were reacted with electroless nickel-immersion gold (ENIG) and electroless nickel-electroless palladium-immersion gold (ENEPIG) surface finishes. We investigated formation of intermetallic compounds (IMCs) and their diffusion barrier properties at reaction interfaces as functions of Pt NP content in the composite solders and duration of solid-state aging at 100 °C. At Sn-58Bi-xPt/ENIG interfaces, typical Ni3Sn4/Ni3P(P-rich layer) microstructure was formed. With the large consumption of the Ni-P layer, the Ni-P and Cu layers were intermixed and Cu atoms spread over the composite solder after 500 h of aging. By contrast, a (Pd,Ni)Sn4/thin Ni3Sn4 microstructure was observed at the Sn-58Bi-xPt/ENEPIG interfaces. The (Pd,Ni)Sn4 IMC effectively suppressed the consumption of the Ni-P layer and Ni3Sn4 growth, functioning as a good diffusion barrier. Therefore, the Sn-58Bi-xPt/ENEPIG joint survived 500 h of aging without microstructural degradation. Based on the experimental results and analysis of this study, Sn-58Bi-0.05Pt/ENEPIG is suggested as the optimum combination for future low-temperature soldering systems. Full article
(This article belongs to the Special Issue Microstructure and Mechanical Properties of Solders)
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12 pages, 4278 KiB  
Article
Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints
by Jiye Zhou, Xin Fu Tan, Stuart D. McDonald and Kazuhiro Nogita
Materials 2022, 15(23), 8321; https://doi.org/10.3390/ma15238321 - 23 Nov 2022
Cited by 4 | Viewed by 1635
Abstract
This research evaluates the mechanical properties of a variety of binary In-Sn alloys as potential candidates for low temperature electronic joints. The tensile and hardness tests of as-cast In-5Sn, In-12.5Sn, In-25Sn, In-30Sn, In-35Sn, In-40Sn, In-50Sn, In-60Sn, In-80Sn (wt.%) were assessed at room temperature [...] Read more.
This research evaluates the mechanical properties of a variety of binary In-Sn alloys as potential candidates for low temperature electronic joints. The tensile and hardness tests of as-cast In-5Sn, In-12.5Sn, In-25Sn, In-30Sn, In-35Sn, In-40Sn, In-50Sn, In-60Sn, In-80Sn (wt.%) were assessed at room temperature and compared to those of pure In and Sn. The ultimate tensile strength (UTS) increased from 4.2 MPa to 37.8 MPa with increasing tin content in the alloys under the testing condition of 18 mm/min and the results showed little difference under a lower strain rate (1.8 mm/min). Most compositions showed good ductility in tensile testing with an average of 40% elongation. A melting point range of 119.3 °C to 194.9 °C for tested alloys was measured using differential scanning calorimetry (DSC). The microstructure investigated by scanning electron microscopy (SEM) was discussed with respect to the mechanical properties and it has been found that the presence of the Sn-rich γ-InSn4 phase in the microstructure has a significant impact on mechanical properties. The fundamental data from this study can be used for the development of new low temperature In-Sn alloys. Full article
(This article belongs to the Special Issue Microstructure and Mechanical Properties of Solders)
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