Special Issue "3D Printing Materials: Innovation, Design and Future Technology"
Deadline for manuscript submissions: 20 January 2024 | Viewed by 4687
Nowadays, the challenges that the conventional/traditional electronic device industry faces are that the fabrication pathway is complex, there is a high level of generation of heat/harmful chemicals in the deposition process, a high volume of raw material being wasted and also relies on rigid substrates that do not match with the needs of the industry for flexible, bendable electronics. The 3D printing technology is based on the Additive Manufacturing concept and it is no doubt capable of revolutionising the whole system of manufacturing electronic devices including material selection; design and fabrication steps and device configuration and architecture.
This Special Issue will encompass few of the most important aspects of 3D printing, that are shared by all types of the emerging electronic devices, such as: Materials, Innovation, Design and Manufacturing Technologies. We invite both the academia and industry communities to join togheter and to contribute either by research articles, comments or reviews to this Special Issue.
Dr. Iulia Salaoru
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- 3D manufacturing technologies
- advanced materials for 3d printing
- 3D printed energy storage devices
- 3D printed sensors
- 3D printing actuators
- 3D printed memory devices
- 3D printed photovoltaics
- 3D printed photonics