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Advances in Design, Performance and Applications of Electrochemical Materials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Chemistry".

Deadline for manuscript submissions: 20 June 2024 | Viewed by 520

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Department of Materials and Mineral Resources Engineering, National Taipei University of Technology, Taipei 106, Taiwan
Interests: environmental contaminants monitoring; electrochemical sensor; photocatalysis; deep eutectic solvents; advanced functional nanomaterial synthesis
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Special Issue Information

Dear Colleagues,

This Special Issue of Materials, entitled "Advances in Design, Performance, and Applications of Electrochemical Materials", delves into the latest innovations and breakthroughs in the field of electrochemical materials. Electrochemical materials are integral to a wide range of applications, including energy storage, electrocatalysis, sensors, and more. This collection of research articles intends to showcase cutting-edge developments in the design, synthesis, and characterization of materials that have a profound impact on enhancing performance and enabling novel applications in electrochemistry. This Special Issue brings together contributions from experts in materials science, chemistry, and engineering, presenting a comprehensive view of the current state of the art and future prospects in this dynamic field. From new materials for energy storage to advanced electrocatalysts for green chemistry, this Issue offers valuable insights into the evolving landscape of electrochemical materials.

Dr. Balasubramanian Sriram
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electrochemical materials
  • materials design
  • performance enhancement
  • energy storage
  • electrocatalysis
  • sensor applications
  • materials synthesis
  • characterization techniques
  • green chemistry
  • research advancements

Published Papers (1 paper)

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Research

14 pages, 9822 KiB  
Article
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications
by Jeng-Hau Huang, Po-Shao Shih, Vengudusamy Renganathan, Simon Johannes Gräfner, Yu-Chun Lin, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung and Chengheng Robert Kao
Materials 2024, 17(7), 1638; https://doi.org/10.3390/ma17071638 - 03 Apr 2024
Viewed by 394
Abstract
This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints [...] Read more.
This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints at low temperatures and pressures. However, the complex and time-consuming nature of their production process hinders their suitability for mass production. To overcome these challenges, we propose a tailored plating solution using an enhanced copper concentration and plating rate. By eliminating the need for fluid motion and reducing the process time, this method can be used for mass production. The Taguchi approach is first used to optimize the copper–quadrol complex solution with the plating rate and decomposition time. This solution exhibits a copper concentration that is over five times higher than that of conventional solutions, a plating rate of 22.2 μm/h, and a decomposition time of 8 min on a Cu layer substrate. This technique enables Cu pillars to be successfully bonded within 7 min at 35 °C. Planarizing the pillar surface yields a high bonding percentage of 99%. Mechanical shear testing shows a significant fracture strength of 76 MPa. Full article
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Planned Papers

The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.

Title: Fabrication of strontium molybdate with functionalized carbon nanotubes for electrochemical determination of the antipyretic drug- Acetaminophen
Authors: Sea-Fue Wang
Affiliation: Department of Materials and Mineral Resources Engineering, National Taipei University of Technology, Taipei 106, Taiwan
Abstract: The electrochemical determination of acetaminophen was studied with (SrMoO4@f-CNF) nanocomposite. SrMoO4@f-CNF nanocomposite was produced by the facial hydrothermal followed sonochemical treatment, resulting in a significant enhancement in the PCT determination. The sonochemical process was applied to incorporate SrMoO4 nanoparticles over f-CNF, enabling a network-like structure. The synergistic effect between SrMoO4 and f-CNF contributes to lower the charge transfer resistance (Rct=85 Ω·cm^2), a redox potential Epc= 0.15 V and Epa=0.30 V (vs Ag/AgCl) and a significant limit of detection (1.8 nM) with a wide response range of 0.01 – 28.48 µM towards the PCT determination. The proposed SrMoO4@f-CNF sensor was studied with differential pulse voltammetry (DPV) and cyclic voltammetry (CV) techniques and demonstrates remarkable electrochemical properties with a good recovery range in real-sample analysis.

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