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Ultrasound for Material Characterization and Processing III

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: 10 June 2024 | Viewed by 1098

Special Issue Editor


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Guest Editor
Department of Engineering for Innovation, University of Salento, Lecce, Italy
Interests: material characterization; ultrasonic wave propagation; polymer rheology; curing kinetics of thermosetting matrices; polymer matrix composites; polymer composite processing and joining; heat transfer modelling; polymer based nanocomposites; hybrid welding of dissimilar materials; micro and nanoplastics; sustainability
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Special Issue Information

Dear Colleagues,

Further to the success of the Special Issue of Materials entitled “Ultrasound for Material Characterization and Processing II”, I am delighted to open a new Special Issue entitled “Ultrasound for Material Characterization and Processing  III”.

Ultrasound is currently employed for multiple purposes in a vast range of fields, from the non-destructive inspection of materials to the sonochemical synthesis of materials and welding. Usually, ultrasonic applications are divided into low-intensity–high-frequency ultrasound and high-intensity–low-frequency ultrasound. Low-intensity ultrasound transmits energy through a medium in order to obtain information about the medium or to convey information through the medium. Today, it is an essential tool utilized to assess metals, plastics, aerospace composites, wood, concrete, and cement. High-intensity ultrasound deliberately affects the propagation medium via the high local temperatures and pressures generated primarily by acoustic cavitation.

This Special Issue aims to present recent advances in ultrasound, addressing fundamental science as well as the applications of ultrasound in the field of engineering material characterization and material processing, with the analysis of heat and mass transfer related to the propagation of ultrasonic waves in a material.

This Special Issue welcomes the submission of original articles and review papers addressing the following themes:

Low-intensity ultrasound: non-destructive inspection; ultrasonic dynamic analysis; ultrasonic rheology; ultrasonic spectroscopy of materials; process monitoring and applications in civil, aerospace, and geological materials and structures; and the characterization of biological media; imaging and mapping.

High-intensity ultrasound: industrial processes such as welding, cleaning, emulsification, atomization, etc.; chemical reactions and reactors induced by ultrasonic waves; synthesis of organic and inorganic materials; microstructural effects; heat generation; accelerated materials characterization using ultrasonic fatigue testing; and food processing and environmental protection.

Contributions addressing heat and transport phenomena in ultrasound-based applications are also welcome.

I kindly invite you to submit a manuscript for this Special Issue. Full papers, communications, and reviews are all welcome.

Dr. Francesca Lionetto
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • ultrasonic wave propagation
  • non-destructive inspection
  • guided waves
  • material characterization
  • viscolastic properties
  • ultrasonic welding
  • ultrasonic sonochemistry
  • numerical modeling
  • heat and mass transport phenomena
  • food processing
  • environmental protection
  • industrial processing

Published Papers (1 paper)

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Research

15 pages, 6593 KiB  
Article
Advanced Analysis of the Properties of Solid-Wire Electric Contacts Produced by Ultrasonic Welding and Soldering
by Andraž Logar, Damjan Klobčar, Aleš Nagode, Uroš Trdan, Gregor Černivec and Abhay Sharma
Materials 2024, 17(2), 334; https://doi.org/10.3390/ma17020334 - 09 Jan 2024
Viewed by 729
Abstract
The current article presents an advanced analysis of the properties of solid-wire electric contacts produced with ultrasonic welding and soldering. Soldering is generally used to join thin, solid copper wires to produce electrical contacts in small-volume production, as ultrasonic welding does not provide [...] Read more.
The current article presents an advanced analysis of the properties of solid-wire electric contacts produced with ultrasonic welding and soldering. Soldering is generally used to join thin, solid copper wires to produce electrical contacts in small-volume production, as ultrasonic welding does not provide acceptable peel force and tensile strength due to the deformation and thinning of the wires. In this article, ultrasonic welding of thin, solid copper wires using a ring before and after a thermal shock test is discussed and compared with the standard soldering technique. The thermal shock test was carried out in the temperature range from −30 to 150 °C. Half of the samples, for both the joining techniques and the wires, were subjected to the thermal shock test; the other half were not. Investigations included electrical resistance tests, optical and SEM microscopy, XRD, microhardness measurements, peel tests, tensile tests, and fractographic analysis. The electrical resistance test, microscopy, microhardness measurements, and fracture examinations showed no differences between the thermal shock-exposed and the non-exposed samples with the same joining process. In mechanical tests, the ultrasonic joint demonstrated superior strength compared to the soldered joint. Full article
(This article belongs to the Special Issue Ultrasound for Material Characterization and Processing III)
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