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Material Innovations for Electronic Technical Textiles

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: 30 April 2025

Special Issue Editors


E-Mail Website1 Website2
Guest Editor
Advanced Textiles Research Group, School of Art and Design, Nottingham Trent University, Bonington Building, Dryden Street, Nottingham, NG1 4GG, United Kingdom
Interests: electronic textiles; smart textiles; sensors, design engineering; internet of things
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Advanced Textiles Research Group, Nottingham School of Art and Design, Nottingham Trent University, Bonington Building, Dryden Street, Nottingham, NG1 4GG, United Kingdom
Interests: electronically functional yarn (E-yarn); advanced 3D knitting technology; active compression garments; fabric antennae; electronic textiles
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Advanced Textiles Research Group, School of Art and Design, Nottingham Trent University, Bonington Building, Dryden Street, Nottingham, NG1 4GG, United Kingdom
Interests: technical textiles; medical textiles; compression garments; material testing; electronic textiles

Special Issue Information

This Special Issue on ‘Materials Innovations for Electronic Technical Textiles’ will focus on the development, application, and performance of novel material innovations for use in the creation of technical electronic textiles. Technical textiles describe textiles where their functionality and technical performance are prioritized over their aesthetics. This incorporates a wide array of applications including as medical textiles, preforms for composites, protective textiles, and many others. With the growing interest and market for electronic textile products, electronic functionality has also seen greater adoption in technical textile applications. In turn, this has also fuelled interest in the creation of new materials and integration techniques to add new functionality to textiles.

We invite research articles, communications, and reviews on topics including, but not limited to, the following:

Materials used to produce electronic textiles;

Electronic technical textiles;

Novel fabrication technologies;

Electronic textile manufacturing;

Electronic textile material testing.

Dr. Theodore Hughes-Riley
Prof. Dr. Tilak Dias
Dr. Arash Moghaddassian Shahidi
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • technical textiles
  • E-textiles
  • electronic textiles
  • smart textiles
  • wearables
  • internet of things
  • material testing
  • sensors

Published Papers

This special issue is now open for submission.
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