Electronic Materials
A section of Materials (ISSN 1996-1944).
Section Information
Nowadays, electronic materials are widely used in our daily life. As an example, communication devices, power supplies, energy conversion systems, computers and wireless systems, physical and chemical sensors, solid-state lighting devices, light- and particle-detectors, etc. are all based on the use of a variety of electronic materials, having specific properties and functionalities that are ultimately related to their atomic structure.
Clearly, the comprehension of the fundamental properties of these materials, the development of their processing technology, and their integration in real devices, as well as the correlation of device performance with material properties, require multidisciplinary competences.
The "Electronic Materials" section is a forum for rapid publication of the most recent advances in materials and devices for different areas of interest, e.g., nanotechnology, power and high-frequency electronics, optoelectronic devices, and sensors. In these areas, several materials are the building blocks used for device fabrication: nanostructures, binary and complex oxides, insulators, metallizations, conventional semiconductors (Si, Ge, SiGe, GaAs, etc.), wide-bandgap semiconductors (SiC, GaN, Ga2O3, ZnO, AlN, diamond, etc.), nitride heterostructures, nanowires, 2D materials and compounds (graphene, hexagonal boron nitride, transition metal dichalcogenides, etc.), optical and energy harvesting materials, etc.
Papers based on experimental and theoretical studies on the above electronic materials and related devices are welcome in this section. In addition, the development and/or application of advanced characterization techniques to electronic materials and electronic devices are also in line with the scope of the section.
All the papers submitted for publication in this section will undergo a peer-review process, and the final decisions are made based on the recommendations of independent reviewers.
Editorial Board
Topical Advisory Panel
Special Issues
Following special issues within this section are currently open for submissions:
- Advanced Thermoelectric Materials, Devices and Systems (Deadline: 10 October 2023)
- Electronic Functional Materials: Synthesis, Structure, Property, Mechanism and Application (Deadline: 10 October 2023)
- Semiconductor Materials for Optoelectronic Device Applications (Deadline: 10 October 2023)
- 2D Materials for Electronic and Optoelectronic Devices (Deadline: 10 October 2023)
- Advances in Ferro/Piezoelectric and Multiferroic Materials (Deadline: 10 October 2023)
- Dielectrics and Nanodielectrics (Deadline: 20 October 2023)
- Synthesis, Characterization and Applications of Thermoelectric Materials (Deadline: 20 October 2023)
- Photodetectors: Research Progress, Structure and Materials (Deadline: 20 October 2023)
- Metamaterial and Metasurface Design for Microwave Applications (Deadline: 20 October 2023)
- Electric and Magnetic Materials: Theory and Devices (Deadline: 20 October 2023)
- Reliability Evaluation, Simulation and Mechanical Analysis of Materials for Advanced Electronic Packaging (Deadline: 10 November 2023)
- Carbon-Based Composite Materials for Electrodes (Deadline: 10 November 2023)
- Advanced Materials and Devices for Applied System Innovation (Deadline: 10 November 2023)
- Development of Novel Functional Materials for the Manufacture of Electronic and Optoelectronic Devices (Deadline: 10 November 2023)
- Advances in Magnetic Materials: Fabrication, Properties, and Applications (Deadline: 20 November 2023)
- Advanced and Multifunctional Flexible Electronic Materials and Devices (Deadline: 20 November 2023)
- Electromagnetic Metasurfaces and Metamaterials: From Design to Applications (Deadline: 20 November 2023)
- Advanced Spintronic Materials and Devices (Deadline: 20 November 2023)
- Intermetallic Compounds and Applications in Solder Joints, Photovoltaic Modules and Electronics Packaging (Deadline: 20 November 2023)
- Recent Advances in Graphene and Other Novel Two-Dimensional Materials for Electronic Applications (Deadline: 10 December 2023)
- Electronic Textile Materials (Deadline: 10 December 2023)
- Ultra-Wide Bandgap Semiconductor Materials and Devices (Deadline: 10 December 2023)
- Recent Progress of Perovskite Photodetectors (Deadline: 20 December 2023)
- Electronic Structure of Advanced Functional Materials (Deadline: 20 December 2023)
- Feature Papers in Electronic Materials Section (Volume 2)—15th Anniversary of Materials (Deadline: 31 December 2023)
- Optoelectronic Devices: Design, Fabrication, Characterization, Application and Challenges (Deadline: 20 January 2024)
- Silicon Carbide Materials: Crystal Growth, Device Processing and Functional Applications (Deadline: 20 January 2024)
- Advances in Electronics Packaging Materials and Technology (Deadline: 20 January 2024)
- Piezoelectrics and Ferroelectrics for End Users (Deadline: 10 February 2024)
- Recent Advances in Organic–Inorganic Hybrid Dielectrics Materials (Deadline: 20 February 2024)
- Electromechanical Effects in Ferroelectric Materials: Theory, Modeling, and Experiments (Deadline: 20 February 2024)
- Electrochromic Materials Research and Devices (Deadline: 20 February 2024)
- Low-Dimensional Electromagnetic Functional Materials (Deadline: 10 March 2024)
- Metal Oxide Semiconductors for Electronic Applications (Deadline: 20 March 2024)
- Research on Thermoelectric Materials and Devices: New Advances in Improving Thermoelectric Efficiency (Deadline: 20 March 2024)
- Advanced Semiconductor/Memory Materials and Devices (Deadline: 20 March 2024)
- Design, Synthesis, and Applications of Optoelectronic Functional Materials (Deadline: 20 March 2024)
- High-Performance Materials for Thin-Film Transistors and Other Electronic Device Applications (Deadline: 20 March 2024)
- Advanced Electronic Devices for Biomedical Applications (Deadline: 20 April 2024)
- Silicon Carbide: Material Growth, Device Processing and Applications (Deadline: 20 April 2024)
- Electronic Packaging Materials and Technology Applications (Deadline: 31 August 2024)
