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Future Trends in High-Entropy Alloys (2nd Edition)

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Metals and Alloys".

Deadline for manuscript submissions: 20 November 2024 | Viewed by 79

Special Issue Editors


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Guest Editor
Department of Mechanical Engineering, Institute of Materials Engineering and Engineering, National Central University, Taoyuan, Taiwan
Interests: lightweight high-entropy alloys; bulk metallic glass (BMG) and composite materials; thermoplastic forming of BMG foam
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Guest Editor
1. Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan
2. High Entropy Materials Center, National Tsing Hua University, Hsinchu, Taiwan
Interests: shape memory alloys; high-entropy alloys; wear and tribology; mechanical properties at room temperature and high temperatures; corrosion science of metals and composites; fatigue behavior of metals

Special Issue Information

Dear Colleagues,

High-entropy alloys (HEAs) is an exciting and vibrant research field in materials science, and recently, the research on HEAs has been widespread across the globe. Numerous studies have shown that the high-entropy strategy has great potential for developing new materials with properties beyond those of conventional materials based on one principal element or component by exploring central regions of complex composition space. The topics of interest in this Special Issue include, but are not limited to, the preparation, properties, and applications of materials, encompassing experimental, theoretical, and computational research on phase diagrams, processing, microstructure characterization, and mechanical, physical, chemical, and functional properties of HEMs.

Prof. Dr. Jason Shian-Ching Jang
Prof. Dr. Che-Wei Tsai
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • high-entropy alloys (HEAs)
  • medium-entropy alloys (MEAs)
  • high-entropy alloy thin films and coatings
  • computational alloy design
  • phase diagram
  • microstructure characterization
  • mechanical properties
  • thermomechanical treatment
  • hetero-structural microstructure
  • functional application

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