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Advanced Grinding Technology for Metals and Alloys

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Metals and Alloys".

Deadline for manuscript submissions: closed (10 July 2023) | Viewed by 219

Special Issue Editors

School of Mechanical Engineering and Automation, Northeastern University, Shenyang 110819, China
Interests: grinding; surface quality; subsurface damage; parameter optimization; grinding wheels

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Guest Editor
School of Mechanical Engineering and Automation, Northeastern University, Shenyang, China
Interests: grinding; surface quality; subsurface damage; parameter optimization; grinding wheels

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Guest Editor
School of Mechanical Engineering, Shenyang University of Technology, Shenyang 110870, China
Interests: grinding; surface quality; subsurface damage; parameter optimization; grinding wheels

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Guest Editor
School of Mechanical Engineering, Shandong University, Jinan 250061, China
Interests: grinding mechanism; minimum quantity lubrication; composites; laser
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Special Issue Information

Dear Colleagues,

Grinding is one of the most widely used methods of finishing parts to extremely close tolerances and low surface roughness. However, surface damages, including surface burns, fractures and cracks, and rapid tool wear, are easily generated during the machining process, which inevitably affects the service life of the metal and alloy components and compromises further applications. Investigating the material removal mechanism, revealing the damage evolution involved in grinding process, and optimizing machining process parameters are of great significance to realize the high-precision machining of grinding metals and alloys materials. This collection aims to summarize frontier research on the processing and surface integrity characterization of metal and alloys machined by grinding processes. The scope of this Special Issue includes, but is not limited to:

  • Advanced grinding process technology;
  • Precise grinding process and micro-grinding process;
  • Characterization to reveal damage behaviors and material removal mechanisms involved in grinding processes;
  • Numerical simulation involved in grinding processes;
  • Optimizing machining process parameters in grinding metals and alloys materials;
  • The design of grinding wheels or abrasive tools.

Dr. Yao Sun
Dr. Yunguang Zhou
Dr. Yin Liu
Dr. Shuoshuo Qu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • grinding
  • surface quality
  • grinding force
  • parameter optimization
  • grinding wheel
  • wear
  • machining efficiency
  • accuracy

Published Papers

There is no accepted submissions to this special issue at this moment.
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