From Sensing Technology towards Digital Twin in Applications, 2nd Edition

A special issue of Inventions (ISSN 2411-5134). This special issue belongs to the section "Inventions and Innovation in Design, Modeling and Computing Methods".

Deadline for manuscript submissions: 31 December 2024 | Viewed by 77

Special Issue Editor

Special Issue Information

Dear Colleagues,

This Special Issue follows the publication of the first edition of "From Sensing Technology towards Digital Twin in Applications", which presented eight interesting papers.

Sensing technology drives the motivation of innovation in digital technology, especially technology for data acquisition, machine learning, digital twin, and sustainable materials-based electronics. With the aid of these new technologies in sensing, human–machine connection, data handling, machine learning, and digital twin in the industrial domain, researchers need a general conclusion on these technologies for further thinking. Therefore, sensing towards digital twin technology has been studied and integrated into many fields, with extensive application in traditional industrial fields, such as automatic driving, smart cities, medical care, intelligent robots, etc.

This Special Issue aims to provide selected contributions to advances in physical sensing in machine learning, human–machine interfaces, data confusion, and various potential applications from sensors to digital twin innovations. Potential topics include, but are not limited to, the following:

  • Physical sensing technologies, such as wearable sensors and nano/microsensors;
  • Data confusion and machine learning;
  • Modeling and simulation technology for virtual spaces;
  • Human–computer interaction and collaboration between virtual models and physical entities;
  • Intelligent decision-making based on digital twin technology;

Human factor analysis and optimization related to a digital twin.

Dr. Jianxiong Zhu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Inventions is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • physical sensing
  • machine learning
  • data management
  • human–computer interaction and collaboration
  • dynamic evaluation
  • intelligent decision-making
  • visualization
  • digital twin
  • smart system

Related Special Issue

Published Papers

This special issue is now open for submission.
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