Special Issue "From Sensing Technology Towards Digital Twin in Applications"
A special issue of Inventions (ISSN 2411-5134). This special issue belongs to the section "Inventions and innovation in Design, Modeling and Computing Methods".
Deadline for manuscript submissions: 30 September 2023 | Viewed by 1567
Special Issue Editor

Interests: gas sensors; machine learning; physical sensor
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Sensing technology drives the motivation of innovation in digital technology, especially the technology in data acquisition, machine learning, digital twin, and sustainable materials-based electronics. With the aid of the new technologies in sensing, human–machine connection, data handling, machine learning, and digital twin in the industrial area, a general conclusion on these technologies needs to be concluded for researchers in further thinking. Therefore, sensing towards digital twin technology has been studied and integrated into many fields in extensive application in traditional industrial fields, such as automatic driving, smart city, medical care, intelligent robot, etc.
This Special Issue is aimed at providing selected contributions on advances in physical sensing in machine learning, human–machine interface, data confusion, and various potential applications from sensors towards digital twin innovation. Potential topics include, but are not limited to:
- Physical sensing technologies, such as wearable sensors, nano/microsensors;
- Data confusion and machine learning;
- Modeling and simulation technology of virtual space;
- Human–computer interaction and collaboration between virtual models and physical entities;
- Intelligent decision-making based on digital twin technology;
- Human factors analysis and optimization related to a digital twin.
Special thanks to Dr. Wenyu Wu for his assistance and great support in this Special Issue.
Dr. Jianxiong Zhu
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Inventions is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1500 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- physical sensing
- machine learning
- data management
- human–computer interaction and collaboration
- dynamic evaluation
- intelligent decision-making
- visualization
- digital twin
- smart system