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Electronics
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New Trends in 3D Printing for Novel Materials
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New Trends in 3D Printing for Novel Materials

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: closed (15 January 2024) | Viewed by 5248

Special Issue Editors

Dr. Muammel M. Hanon

E-Mail Website
Guest Editor
Baquba Technical Institute, Middle Technical University, Baghdad 10074, Iraq
Interests: 3D printing; tribology of additively manufactured components; laser materials processing; wear and friction testing; mechanical behavior characterization
Dr. László Zsidai

E-Mail Website
Guest Editor
Institute of Technology, Szent István Campus, MATE University, 2100 Gödöllő, Hungary
Interests: additive manufacturing; tribology; polymers; friction; wear testing; surface analysis
Prof. Dr. Tomasz Kozior

E-Mail Website
Guest Editor
Faculty of Mechatronics and Mechanical Engineering, Department of Metrology and Unconventional Manufacturing Methods, KUT—Kielce University of Technology, 25-314 Kielce, Poland
Interests: 3D/4D printing; additive manufacturing; FDM/FFF; PJM; SLS; SLM; metrology; tribology
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Over the last ten years, 3D printing has advanced quickly. Compared to traditional production methods, additive manufacturing technologies have outstanding benefits in speed, superior surface finishing, high mechanical integrity, and resolution. Moreover, this innovative technology has also revolutionized the industry, being economical, effective, and environmentally friendly. Many sophisticated electromagnetic materials and devices have recently emerged after benefiting from 3D printing. By employing a variety of novel materials, a wide range of electrical appliances are ready to be produced, using an additive manufacturing process, which opens up promising possibilities for better designs with enhanced energy and material consumption efficiency. In addition, 3D printed and assembled electronic devices might be finely customized to meet the diverse demands of a sustainable planet.

This Special Issue of Electronics aims to gather scientific papers dealing with novel materials suitable for 3D printing, focusing on those that can be used for manufacturing electrical and electronic devices. By compiling cutting-edge research findings and imaginative ideas, this Special Issue will serve as a resource that informs researchers about possibilities that highlight the prospect of this impressive technology. Potential article topics can deal with numerous aspects related to the applications of additive manufacturing technologies in sensors and actuators, microelements, multifunctional sensors for robots, MEMS, etc. Additionally, this Special Issue is anticipated to have a collection of papers, demonstrating novel materials for 3D printing, including articles on engineering materials and bio-friendly 3D printed components. Moreover, case studies, printable materials in biomedicine, manufacturing horn antennas, composite materials' 3D printing for electromechanical energy harvesters, as well as review articles highlighting current developments in the area of digital fabrication are also encouraged.

Dr. Muammel M. Hanon
Dr. László Zsidai
Dr. Tomasz Kozior
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • the 3D printing of electronics
  • applications of additive manufacturing technologies
  • manufacturing of sensors and actuators by 3D printing
  • novel materials for 3D printing
  • biofriendly 3D printed components
  • additive manufacturing of microelements
  • applications of 3D printable materials in biomedicine
  • the 3D printing of multifunctional sensors for robots
  • manufacturing horn antennas using 3D printing
  • composite materials' 3D printing for electromechanical energy harvesters
  • engineering materials for 3D printing
  • the 3D printed microelectromechanical systems (MEMS)

Published Papers (3 papers)

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Research

15 pages, 5838 KiB  
Article
Powder Bed Approach to 3D Printing of Structural Electronic Circuits
by Dawid Dembowski and Marcin Słoma
Electronics 2023, 12(14), 3088; https://doi.org/10.3390/electronics12143088 - 16 Jul 2023
Viewed by 935
Abstract
The purpose of this study is to research the possibility of producing structural electronics with the powder bed Binder Jetting (BJ) technique. The adaptation of the BJ ZPrinter 450 printer for the deposition of silver nanoparticle inks and the fabrication of conductive paths [...] Read more.
The purpose of this study is to research the possibility of producing structural electronics with the powder bed Binder Jetting (BJ) technique. The adaptation of the BJ ZPrinter 450 printer for the deposition of silver nanoparticle inks and the fabrication of conductive paths using commercially available consumables was successfully carried out. The research included testing the influence of different orientations of the printed substrates for the conductive paths and also checking the dependence of the resistance on a number of printed nanoparticle ink layers. First, the measured average resistance value equal to 133.86 Ω was reached after 18 printed nanosilver ink layers. The best results have been obtained for 68 printed layers with an average resistance value of 4.64 Ω. The effect of the heat-treatment time and multiple sintering approaches of the prepared samples was also examined. The dependence of the sintering time on the resistance of the path turned out to be consistent with that encountered in the literature. Single sintering of the path with 33 nanosilver ink layers gave an average resistance value of 21.11 Ω. The same number of layers sintered 3 times during the process after several passes of the printhead gave the lowest resistance value of 1.89 Ω. Strength tests of the samples showed that the BJ is not suitable for the application of strain sensor fabrication. Despite this, the results of the study showed that high-efficiency printed electronics are possible to be fabricated using powder bed techniques, and there is a lot of room for future research. Full article
(This article belongs to the Special Issue New Trends in 3D Printing for Novel Materials)
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24 pages, 11722 KiB  
Article
Effect of the Particle Size Distribution of Irregular Al Powder on Properties of Parts for Electronics Fabricated by Binder Jetting
by Joanna Marczyk and Marek Hebda
Electronics 2023, 12(12), 2733; https://doi.org/10.3390/electronics12122733 - 19 Jun 2023
Cited by 1 | Viewed by 1532
Abstract
The present work analyzed the influence of the particle size of irregular aluminum powder on the properties of Binder-Jetting-printed parts, which can be used as electronic components. Powders of various particle sizes as well as blends in the ratio of 73–27 wt.% or [...] Read more.
The present work analyzed the influence of the particle size of irregular aluminum powder on the properties of Binder-Jetting-printed parts, which can be used as electronic components. Powders of various particle sizes as well as blends in the ratio of 73–27 wt.% or 27–73 wt.% of coarse to fine powder particles were used. The parts were printed with constant parameters, such as a layer thickness of 120 µm, roller traverse speed of 10 mm/s, and binder saturation of 80%. For parts made of individual blends, analysis of the XRD, density, porosity, surface roughness, and dimensional changes in X, Y, and Z axes after the sintering process was conducted. The results confirmed the trend of smoothing the surface of 3D-printed parts with a reduction in the size of the powder particles used. The best results in terms of surface roughness were obtained for powder in which coarse particles (73%) had 50 µm and fine particles (27%) had 20 µm. However, the incorporation of coarser particles in an amount of 27 wt.% (AL160) to the fine-grained powder base (ALC100) allowed for the obtaining of details with higher density, lower total porosity, and relatively low surface roughness. The combination of these two powder particle sizes allowed the fine powder to fill the voids between the larger particles, resulting in properties that represent an excellent relationship between density, porosity, and surface quality. The research results indicate that the three-dimensional parts produced by Binder Jetting technology, through the phenomenal thermal conductivity of aluminum, can be successfully used as electronic components, such as heat sinks or transistor housings. Full article
(This article belongs to the Special Issue New Trends in 3D Printing for Novel Materials)
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12 pages, 3517 KiB  
Article
3D Printed Electronic Circuits from Fusible Alloys
by Bartłomiej Podsiadły, Liubomir Bezgan and Marcin Słoma
Electronics 2022, 11(22), 3829; https://doi.org/10.3390/electronics11223829 - 21 Nov 2022
Cited by 4 | Viewed by 2143
Abstract
This work aims to evaluate the possibility of fabricating conductive paths for printed circuit boards from low-temperature melting metal alloys on low-temperature 3D printed substrates and mounting through-hole electronic components using the fused deposition modeling for metals (FDMm) for structural electronics applications. The [...] Read more.
This work aims to evaluate the possibility of fabricating conductive paths for printed circuit boards from low-temperature melting metal alloys on low-temperature 3D printed substrates and mounting through-hole electronic components using the fused deposition modeling for metals (FDMm) for structural electronics applications. The conductive materials are flux-cored solder wires Sn60Pb40 and Sn99Ag0.3Cu0.7. The deposition was achieved with a specially adapted nozzle. A comparison of solder wires with and without flux cores is discussed to determine whether the solder alloys exhibit adequate wettability and adhesion to the polymer substrate. The symmetrical astable multivibrator circuit based on bipolar junction transistors (BJT) was fabricated to demonstrate the possibility of simultaneous production of conductive tracks and through-hole mountings with this additive technique. Additional perspectives for applying this technique to 3D-printed structural electronic circuits are also discussed. Full article
(This article belongs to the Special Issue New Trends in 3D Printing for Novel Materials)
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