Future Information & Communication Engineering 2024
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Computing and Artificial Intelligence".
Deadline for manuscript submissions: 10 November 2024 | Viewed by 366
Special Issue Editors
Interests: compact modeling for circuit simulation; device modeling for TCAD simulation; device characterization; steep-switching device; GAA NW-FET; 2D material transistor; neuromorphic device
Special Issues, Collections and Topics in MDPI journals
Interests: aging science; applied artificial intelligence; digital healthcare; human computer interaction; software engineering
Special Issues, Collections and Topics in MDPI journals
Interests: fuzzy neural network; image processing; medical image recognition; biosignal processing; genetic algorithm; watermarking
Special Issues, Collections and Topics in MDPI journals
Interests: virtual/mixed reality; human computer interaction; virtual human
Special Issues, Collections and Topics in MDPI journals
Interests: information systems; e-business and management; business analytics
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
We are organizing a Special Issue comprising selected original research papers from the 16th International Conference on Future Information and Communication Engineering (ICFICE) 2024 on all the technical aspects of computer science, information, and communication engineering. Potential topics include but are not limited to the following:
- Communication systems and applications;
- Networking and security;
- AI and intelligent information systems;
- Multimedia and digital convergence;
- Semiconductor and communication services;
- Biomedical imaging and engineering;
- Ubiquitous sensor network;
- Database and Internet application;
- IoT and big data;
- IT convergence technology;
- Industrial session.
Prof. Dr. Yun Seop Yu
Prof. Dr. Hee-Cheol Kim
Prof. Dr. Kwang-Baek Kim
Dr. Dongsik Jo
Dr. Jongtae Lee
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- communication systems
- networking
- smart security
- intelligent information systems
- artificial intelligence
- machine learning
- biomedical imaging
- multimedia and digital convergence
- semiconductors
- ubiquitous sensor networks
- databases
- Internet application
- big data
- Internet of Things (IoT)
- information technology (IT) convergence
- augmented reality (AR)/virtual reality (VR)
- metaverse
