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Advanced Power Devices and Power Systems
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Advanced Power Devices and Power Systems

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Energy Science and Technology".

Deadline for manuscript submissions: closed (30 September 2023) | Viewed by 6950

Special Issue Editor

Prof. Dr. Przemysław Ptak

E-Mail Website1 Website2
Guest Editor
Department of Marine Electronics, Gdynia Maritime University, Morska 81-87, 81-225 Gdynia, Poland
Interests: power electronic circuits; power LED supplies; power LED; light sensors; microcontrollers; soldering alloy uses in assembly LED diodes
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

For many years, various power components have been used in power conversion systems. It is estimated that more than 70% of the world’s electricity is preprocessed by low and medium power circuits and systems. These circuits are designed using advanced semiconductor elements and magnetic elements. These elements are the subject of much scientific research around the world. However, a lot of scientific attention is also given to power electronic circuits built for the purpose of converting the supplied electrical energy.

Advanced semiconductor and magnetic power elements are increasingly used in the process of converting electrical energy between the producer and the user in order to change high and medium voltage to low voltage, which is suitable for end users.

An important element in the design process of power electronic systems is the modeling of phenomena occurring in these systems, while most attention is paid to electrothermal models of power semiconductor elements and magnetic elements. The most important phenomenon in power electronic systems is also reliability, which is achieved by selecting appropriate advanced power components. This Special Issue of Applied Sciences will be devoted to the advanced power elements and power systems.

Assist. Prof. Dr. Przemysław Ptak
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • power electronic circuits
  • power semiconductor elements
  • magnetic elements
  • modeling
  • compact electrothermal models
  • 2D and 3D electrothermal models
  • cooling systems
  • power electronic systems

Published Papers (3 papers)

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Research

20 pages, 3764 KiB  
Article
Application of Statistical Methods to Analyze the Quality of Electronic Circuits Assembly
by Krzysztof Górecki and Wojciech Kowalke
Appl. Sci. 2022, 12(24), 12694; https://doi.org/10.3390/app122412694 - 11 Dec 2022
Cited by 1 | Viewed by 1399
Abstract
The paper discusses selected statistical methods enabling the effective assessment of the influence of selected factors on the efficiency of the assembly process of RF systems. The considerations were carried out on the example of the investigations into the influence of the size [...] Read more.
The paper discusses selected statistical methods enabling the effective assessment of the influence of selected factors on the efficiency of the assembly process of RF systems. The considerations were carried out on the example of the investigations into the influence of the size of the voids appearing in the soldering area of RF power transistors on the value of selected electrical parameters of these devices in a considered electronic module. Selected quality tools were described and additional analyses were performed using the Six Sigma methodology and the Minitab application. With the use of the QFD (Quality Function Deployment) method and the HoQ (House of Quality) tool, all the relevant output quantities of the tested system and its components were defined. The obtained results of statistical analyses allow determining the existing correlations between particular quantities, which include, among others, the temperature of the transistor case, the size of the void spaces in the soldering area or the location of transistors on the PCB (Printed Circuit Board). From the performed investigations, it is clear that no correlation between the void size and the thermal resistance of the tested transistors was observed. Full article
(This article belongs to the Special Issue Advanced Power Devices and Power Systems)
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11 pages, 1787 KiB  
Article
Possibilities of Powering Military Equipment Based on Renewable Energy Sources
by Mariusz Frączek, Krzysztof Górski and Leszek Wolaniuk
Appl. Sci. 2022, 12(2), 843; https://doi.org/10.3390/app12020843 - 14 Jan 2022
Cited by 3 | Viewed by 2385
Abstract
Nowadays, the land forces of the Republic of Poland use mainly two forms of powering their equipment and military devices: by connecting various devices to the national power grid and by diesel-electric generators of individual vehicles. With the first solution, power cuts have [...] Read more.
Nowadays, the land forces of the Republic of Poland use mainly two forms of powering their equipment and military devices: by connecting various devices to the national power grid and by diesel-electric generators of individual vehicles. With the first solution, power cuts have to be taken into account. In the latter case, it is necessary to ensure large fuel deliveries on a timely manner. It entails a search for new solutions able to effectively meet the needs of an individual soldier and command posts. It has inspired engineers to work on renewable energy sources. This review paper presents a concept for photovoltaic cells usage and a concept for air turbines used to charge electric power sources of different powers for the individual needs of soldiers and command posts. Examples of solutions for mobile energy systems are presented in the research work. They were verified in terms of their suitability for military applications. The concept of using a personal device to supply power for charging batteries and elements of individual soldier equipment, including low-power radio stations, has been presented as well. Full article
(This article belongs to the Special Issue Advanced Power Devices and Power Systems)
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12 pages, 4316 KiB  
Article
The Influence of Soldering Profile on the Thermal Parameters of Insulated Gate Bipolar Transistors (IGBTs)
by Adrian Pietruszka, Paweł Górecki, Sebastian Wroński, Balázs Illés and Agata Skwarek
Appl. Sci. 2021, 11(12), 5583; https://doi.org/10.3390/app11125583 - 16 Jun 2021
Cited by 11 | Viewed by 2375
Abstract
The effect of solder joint fabrication on the thermal properties of IGBTs soldered onto glass-epoxy substrate (FR4) was investigated. Glass-epoxy substrates with a thickness of 1.50 mm, covered with a 35 μm thick Cu layer, were used. A surface finish was prepared from [...] Read more.
The effect of solder joint fabrication on the thermal properties of IGBTs soldered onto glass-epoxy substrate (FR4) was investigated. Glass-epoxy substrates with a thickness of 1.50 mm, covered with a 35 μm thick Cu layer, were used. A surface finish was prepared from a hot air leveling (HAL) Sn99Cu0.7Ag0.3 layer with a thickness of 1 ÷ 40 μm. IGBT transistors NGB8207BN were soldered with SACX0307 (Sn99Ag0.3Cu0.7) paste. The samples were soldered in different soldering ovens and at different temperature profiles. The thermal impedance Zth(t) and thermal resistance Rth of the samples were measured. Microstructural and voids analyses were performed. It was found that the differences for different samples reached 15% and 20% for Zth(t) and Rth, respectively. Although the ratio of the gas voids in the solder joints varied between 3% and 30%, no correlation between the void ratios and Rth increase was found. In the case of the different soldering technologies, the microstructure of the solder joint showed significant differences in the thickness of the intermetallic compounds (IMC) layer; these differences correlated well with the time above liquidus during the soldering process. The thermal parameters of IGBTs could be changed due to the increased thermal conductivity of the IMC layer as compared to the thermal conductivity of the solder bulk. Our research highlighted the importance of the soldering technology used and the thermal profile in the case of the assembly of IGBT components. Full article
(This article belongs to the Special Issue Advanced Power Devices and Power Systems)
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