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Journal: Inventions, 2023
Volume: 8
Number: 61

Article: Overcoming Chip Shortages: Low-Cost Open-Source Parametric 3-D Printable Solderless SOIC to DIP Breakout Adapters
Authors: by Cameron K. Brooks, Jack E. Peplinski and Joshua M. Pearce
Link: https://www.mdpi.com/2411-5134/8/2/61

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