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Journal: Electronics, 2020
Volume: 9
Number: 1341

Article: Analysis of the Multi-Steps Package (MSP) for Series-Connected SiC-MOSFETs
Authors: by Luciano F. S. Alves, Pierre Lefranc, Pierre-Olivier Jeannin, Benoit Sarrazin and Jean-Christophe Crebier
Link: https://www.mdpi.com/2079-9292/9/9/1341

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