Next Article in Journal
An Automatic Generation and Verification Method of Software Requirements Specification
Next Article in Special Issue
Powder Bed Approach to 3D Printing of Structural Electronic Circuits
Previous Article in Journal
CEEMDAN-ICA-Based Radar Monitoring of Adjacent Multi-Target Vital Signs
Previous Article in Special Issue
3D Printed Electronic Circuits from Fusible Alloys
 
 
Article

Article Versions Notes

Electronics 2023, 12(12), 2733; https://doi.org/10.3390/electronics12122733
Action Date Notes Link
article xml file uploaded 19 June 2023 12:12 CEST Original file -
article xml uploaded. 19 June 2023 12:12 CEST Update https://www.mdpi.com/2079-9292/12/12/2733/xml
article pdf uploaded. 19 June 2023 12:12 CEST Version of Record https://www.mdpi.com/2079-9292/12/12/2733/pdf
article supplementary file uploaded. 19 June 2023 12:12 CEST - https://www.mdpi.com/2079-9292/12/12/2733#supplementary
article html file updated 19 June 2023 12:14 CEST Original file -
article html file updated 6 July 2023 20:46 CEST Update https://www.mdpi.com/2079-9292/12/12/2733/html
Back to TopTop