Nondestructive Sensing and Imaging in Ultrasound
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Sensing and Imaging".
Deadline for manuscript submissions: closed (31 May 2023) | Viewed by 14833
Special Issue Editors
Interests: NDE; ultrasound; ultrasonic tomographic; digital communication receivers; development of wireless monitoring systems; signal processing; machine learning
Interests: materials characterization; ultrasound; building materials; heritage buildings; ultrasonic imaging; smart materials; WSN structures and materials
Special Issue Information
Dear Colleagues,
Nondestructive evaluation by ultrasound is a transversal line that is present in a wide range of industrial sectors, from automobilist and aeronautic to medical, transport, and civil infrastructure, among others. Ultrasonic imaging is used extensively to establish the properties and quality of materials and infrastructures. The development of new methodologies, sensors, and instrumentation in NDE has to follow the trends in the informatization, digitization, and networking of industrial production. The development of nondestructive sensors is a transversal line with multiple applications in different thematic areas. New production techniques, for example, 3D printing, will allow efficient and timely production of low numbers of unique parts customized for the needs of NDE.
This Special Issue aims to highlight advances in nondestructive sensing and imaging in ultrasound in different thematic areas that allow sharing a multidisciplinary vision of this topic.
Prof. Dr. Miguel Ángel García Izquierdo
Dr. Margarita Hernández
Guest Editors
Manuscript Submission Information
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Keywords
- nondestructive sensing
- ultrasonic imaging
- WSN
- instrumentation
- sensors
- smart materials