sensors-logo

Journal Browser

Journal Browser

Intelligent Sensors and Artificial Intelligence in Building

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".

Deadline for manuscript submissions: 31 August 2024 | Viewed by 230

Special Issue Editors


E-Mail Website
Guest Editor
Department of Mechanical and Electrical Engineering, Hunan University, Changsha 410082, China
Interests: AI; IoT; smart building; smart environment

E-Mail Website
Guest Editor
School of Mechatronic Engineering, China University of Mining and Technology, Xuzhou 221116, China
Interests: artificial-intelligence-based testing and verification
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Department of the Built Environment, National University of Singapore, Singapore 119077, Singapore
Interests: AI; data-driven design; parametric structural optimization Social Media Account
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Smart building is an important component in the progress of constructing smart city and smart city 4.0. Intelligent sensors with the abilities of precise perception, automatic detection/diagnosis, data mining, information interaction, etc., providing the underlying support of big data and industrial Internet of Things (IoT) for smart building. Based on the remote sensing information supported by intelligent sensors, various artificial intelligence (AI) technologies such as deep learning, edge computing, smart blockchain, have been deeply involved in the full life-cycle management of intelligent building, greatly improving the comfort, safety and humanization of modern building.

This Special Issue therefore aims to put together original research and review articles on recent advances, technologies, solutions, applications, and new challenges for intelligent sensors and artificial intelligence in building. Potential topics include but are not limited to:

  1. Non-contact, non-intrusive building environment perception technology.
  2. Intelligent devices and instruments for smart building.
  3. IoT applications with intelligent sensors in building.
  4. AI-assisted building decision making.
  5. AI-based energy consumption prediction of building.
  6. Intelligent security monitoring and building facility fault diagnosis.
  7. Building information modeling (BIM) with AI.
  8. Cutting-edge AI technologies for full life-cycle management of building

Dr. Ke Yan
Dr. Xin Li
Dr. Vincent Gan
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers

This special issue is now open for submission.
Back to TopTop