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Modelling, Simulation, Design, and Manufacturing of CMOS Integrated MEMS
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Modelling, Simulation, Design, and Manufacturing of CMOS Integrated MEMS

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (31 December 2021) | Viewed by 11063

Special Issue Editors

Dr. Frédérick Mailly

E-Mail Website
Guest Editor
Laboratoire d'Informatique, de Robotique et de Microélectronique de Montpellier LIRMM, Microelectronics Department, Montpellier, France
Interests: CMOS; MEMS; Design of integrated circuits; analog; mixed; digital; emerging technology; physical modeling; statistical design; life monitoring; component security
Prof. Dr. Pascal Nouet

E-Mail Website
Guest Editor
Laboratory of Informatics, Robotics, and Microelectronics, University of Montpellier, Montpellier, France
Interests: CMOS analog circuits; MEMS; sensor conditioning; signal processing
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

For the last few decades, MEMS research and the MEMS market were often based on the “one product, one process” principle. Even if this approach seems to be the best for high-performance applications, it leads to high manufacturing costs due to the low volume of each specific process and high packaging costs due to the low compatibility of the MEMS process with integrated electronics that imposes multi-die systems. Thus, monolithic integration of micro and nanosystems in standard microelectronics technologies (CMOS, BiCMOS, SOI, FinFET, etc.) is a key issue for the development of new low-cost sensing applications, Internet-of-Things systems and multisensor systems. Moreover, the use of standard technologies, the development of high-level models, and the integration of MEMS design capabilities in EDA software should allow to obtain libraries of customizable MEMS IPs that could be used by microelectronics system engineers as microelectronic standard cells (processor, memory, amplifier, etc.) for rapid and efficient design of highly integrated systems.

Therefore, this Special Issue focuses on the modeling, simulation, design, and manufacture of CMOS-integrated MEMS sensors, but MEMS integrated in other standard microelectronics technologies will be also considered. Original research and review papers are welcome. Topics include but are not limited to:

  • Modeling, simulation, and integration of new physical, chemical or biological MEMS sensors in standard microelectronics technologies;
  • Technological add-ons to standard microelectronics technologies for MEMS integration;
  • Electronic design automation for MEMS design, co-simulation of MEMS with electronics, high-level modeling of MEMS;
  • Integrated self-test and self-calibration of MEMS, industrial test procedures of CMOS MEMS.

Dr. Frédérick Mailly
Prof. Dr. Pascal Nouet
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • CMOS MEMS
  • CMOS-compatible MEMS process
  • Monolithic integration
  • MEMS modelling
  • Co-simulation of MEMS with electronics
  • MEMS testing, built-in self-test, and self-calibration

Published Papers (1 paper)

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Review

24 pages, 4071 KiB  
Review
Integrated On-Chip Transformers: Recent Progress in the Design, Layout, Modeling and Fabrication
by Rayan Bajwa and Murat Kaya Yapici
Sensors 2019, 19(16), 3535; https://doi.org/10.3390/s19163535 - 13 Aug 2019
Cited by 18 | Viewed by 10461
Abstract
On-chip transformers are considered to be the primary components in many RF wireless applications. This paper provides an in-depth review of on-chip transformers, starting with a presentation on the various equivalent circuit models to represent transformer behavior and characterize their performance. Next, a [...] Read more.
On-chip transformers are considered to be the primary components in many RF wireless applications. This paper provides an in-depth review of on-chip transformers, starting with a presentation on the various equivalent circuit models to represent transformer behavior and characterize their performance. Next, a comparative study on the different design and layout strategies is provided, and the fabrication techniques for on-chip implementation of transformers are discussed. The critical performance parameters to characterize on-chip transformers, such as the Q-factor, coupling factor (k), resonance frequency (fSR), and others, are discussed with reference to trade-offs in silicon chip real-estate. The performance parameters and area requirements for different types of on-chip transformers are summarized in tabular form and compared. Several techniques for performance enhancement of on-chip transformers, including the different types of micromachining and integration approaches stemming from MEMS (microelectromechanical systems) technologies are also analyzed. Lastly, the different uses and applications of on-chip transformers are discussed to highlight the evolution of on-chip transformer technology over the recent years and provide directions for future work in this field. Full article
(This article belongs to the Special Issue Modelling, Simulation, Design, and Manufacturing of CMOS Integrated MEMS)
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