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Recent Advances in Quality Assessment of Ultrasound-Based Sensing Technology and Systems

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".

Deadline for manuscript submissions: closed (15 April 2024) | Viewed by 809

Special Issue Editors


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Guest Editor
Department of Industrial, Electronic and Mechanical Engineering, University of Roma Tre, Via Della Vasca Navale 79, 00146 Rome, Italy
Interests: mechanical and thermal measurement systems and instrumentation; design and testing of biomedical instrumentation; experimental mechanics applied in biomedical fields
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Department of Industrial, Electronic and Mechanical Engineering, University of Roma Tre, 00146 Rome, Italy
Interests: clinical engineering; mechanical and thermal measurement systems and instrumentation; methods and systems for quality assessment of Doppler ultrasound equipment for clinical use

Special Issue Information

Dear Colleagues,

The quality assessment (QA) of sensing technology and systems based on ultrasound (US) has been receiving growing interest over the years due to their relevance and proliferation in several industries, healthcare fields and applications. In this regard, performance monitoring over time and non-conformities’ detection require protocols based on specific measurement methods and systems in order to check the quality in accordance with the manufacturer’s recommendations, comply with regulatory requirements and, in many cases, ensure user and environment health and safety.

  • This Special Issue aims at collecting original research and review articles on recent advances and innovative solutions in the quality assessment of ultrasound-based sensing technologies and systems to provide useful information on the test protocols and methods as well as instrumentation performance to the end user.
  • Topics of interest include but are not limited to QA of ultrasound-based technologies and systems in the following:

- Industrial measurement, test and process control applications;
- Healthcare;
- Pharmaceutical industry;
- Food science and technology;
- Manufacturing and production;
- Marine applications;
- Power applications;
- Materials chemistry;
- Automotive and transportation industry.

Dr. Andrea Scorza
Dr. Giorgia Fiori
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • quality assessment
  • ultrasound
  • sensing
  • power ultrasound
  • measurement
  • systems
  • technology

Published Papers

There is no accepted submissions to this special issue at this moment.
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