Special Issue "Thermally Conductive Nanomaterials and Their Applications"

A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Nanofabrication and Nanomanufacturing".

Deadline for manuscript submissions: 20 April 2024 | Viewed by 48

Special Issue Editors

School of Chemistry and Chemical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China
Interests: micro- and nano-composite materials; energy storage materials; thermal conductivity enhancement technique; ultrafine powder
Prof. Dr. Yi Jin
E-Mail Website
Guest Editor
Nanjing Jinhe Energy Material Co., Ltd., Nanjing 210047, China
Interests: energy storage materials and technique; thermal conductivity enhancement technique

Special Issue Information

Dear Colleagues,

Over the past few decades, materials at the nanoscale have garnered significant attention, especially regarding their unique thermal conductivity properties. From early foundational experiments to modern sophisticated applications, such nanomaterials have increasingly come to the forefront of numerous high-tech applications. This field spans, but is not limited to, thermal interface materials, thermally conductive composites, and cooling solutions for electronic devices. Optimizing the thermal performance of these materials to meet the growing demands of microelectronics and energy storage devices is the main goal of current research.

The present Special Issue “Thermal Conductivity Nanomaterials and Their Applications” of Nanomaterials is aimed at introducing the role and application of nanomaterials in thermal conductivity enhancement. It is important to explore the fundamental mechanisms of heat transfer at the nanoscale and propose innovative strategies for enhancing thermal conductivity to further improve the application and performance of nanomaterials. Therefore, fundamental theoretical research, simulations and modeling, experimental validations, and applications of these nanomaterials are suitable for the Special Issue. With rapid technological advancements, thermally conductive nanomaterials and their applications undoubtedly continue to herald revolutionary changes for both the scientific and industrial communities.

We look forward to receiving your contributions.

Prof. Dr. Linghua Tan
Prof. Dr. Yi Jin
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2900 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • nanomaterials
  • thermal interface materials
  • composites
  • thermal conductivity
  • heat transfer
  • heat conduction model

Published Papers

This special issue is now open for submission.
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