Thermally Conductive Nanomaterials and Their Applications

A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Nanofabrication and Nanomanufacturing".

Deadline for manuscript submissions: 20 October 2024 | Viewed by 1640

Special Issue Editors


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Guest Editor
School of Chemistry and Chemical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China
Interests: micro- and nano-composite materials; energy storage materials; thermal conductivity enhancement technique; ultrafine powder

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Guest Editor
Nanjing Jinhe Energy Material Co., Ltd., Nanjing 210047, China
Interests: energy storage materials and technique; thermal conductivity enhancement technique

Special Issue Information

Dear Colleagues,

Over the past few decades, materials at the nanoscale have garnered significant attention, especially regarding their unique thermal conductivity properties. From early foundational experiments to modern sophisticated applications, such nanomaterials have increasingly come to the forefront of numerous high-tech applications. This field spans, but is not limited to, thermal interface materials, thermally conductive composites, and cooling solutions for electronic devices. Optimizing the thermal performance of these materials to meet the growing demands of microelectronics and energy storage devices is the main goal of current research.

The present Special Issue “Thermal Conductivity Nanomaterials and Their Applications” of Nanomaterials is aimed at introducing the role and application of nanomaterials in thermal conductivity enhancement. It is important to explore the fundamental mechanisms of heat transfer at the nanoscale and propose innovative strategies for enhancing thermal conductivity to further improve the application and performance of nanomaterials. Therefore, fundamental theoretical research, simulations and modeling, experimental validations, and applications of these nanomaterials are suitable for the Special Issue. With rapid technological advancements, thermally conductive nanomaterials and their applications undoubtedly continue to herald revolutionary changes for both the scientific and industrial communities.

We look forward to receiving your contributions.

Prof. Dr. Linghua Tan
Prof. Dr. Yi Jin
Guest Editors

Manuscript Submission Information

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Keywords

  • nanomaterials
  • thermal interface materials
  • composites
  • thermal conductivity
  • heat transfer
  • heat conduction model

Published Papers (2 papers)

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Research

16 pages, 15639 KiB  
Article
Playing with Low Amounts of Expanded Graphite for Melt-Processed Polyamide and Copolyester Nanocomposites to Achieve Control of Mechanical, Tribological, Thermal and Dielectric Properties
by Ruben Vande Ryse, Michiel Van Osta, Mounia Gruyaert, Maarten Oosterlinck, Ádám Kalácska, Mariya Edeleva, Frederik Pille, Dagmar R. D’hooge, Ludwig Cardon and Patrick De Baets
Nanomaterials 2024, 14(7), 606; https://doi.org/10.3390/nano14070606 - 29 Mar 2024
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Abstract
Polyamide 11 (PA11) and copolyester (TPC-E) were compounded through melt extrusion with low levels (below 10%) of expanded graphite (EG), aiming at the manufacturing of a thermally and electrically conductive composite resistant to friction and with acceptable mechanical properties. Thermal characterisation showed that [...] Read more.
Polyamide 11 (PA11) and copolyester (TPC-E) were compounded through melt extrusion with low levels (below 10%) of expanded graphite (EG), aiming at the manufacturing of a thermally and electrically conductive composite resistant to friction and with acceptable mechanical properties. Thermal characterisation showed that the EG presence had no influence on the onset degradation temperature or melting temperature. While the specific density of the produced composite materials increased linearly with increasing levels of EG, the tensile modulus and flexural modulus showed a significant increase already at the introduction of 1 wt% EG. However, the elongation at break decreased significantly for higher loadings, which is typical for composite materials. We observed the increase in the dielectric and thermal conductivity, and the dissipated power displayed a much larger increase where high frequencies (e.g., 10 GHz) were taken into account. The tribological results showed significant changes at 4 wt% for the PA11 composite and 6 wt% for the TPC-E composite. Morphological analysis of the wear surfaces indicated that the main wear mechanism changed from abrasive wear to adhesive wear, which contributes to the enhanced wear resistance of the developed materials. Overall, we manufactured new composite materials with enhanced dielectric properties and superior wear resistance while maintaining good processability, specifically upon using 4–6 wt% of EG. Full article
(This article belongs to the Special Issue Thermally Conductive Nanomaterials and Their Applications)
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14 pages, 4108 KiB  
Article
Enhanced Electrostatic Safety and Thermal Compatibility of Special Powders Based on Surface Modification
by Xuchao Pan, Libo Zhang, Jialu Guan, Jing Lv, Yifei Xie, Haifeng Yang and Linghua Tan
Nanomaterials 2024, 14(1), 126; https://doi.org/10.3390/nano14010126 - 04 Jan 2024
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Abstract
Electrostatic accumulation is associated with almost all powder-conveying processes which could bring about electrostatic discharges. In most cases of industrial accidents, electrostatic discharge is proven to be the primary source of ignition and explosion. Herein, a surface modification process of polyaniline (PANI) is [...] Read more.
Electrostatic accumulation is associated with almost all powder-conveying processes which could bring about electrostatic discharges. In most cases of industrial accidents, electrostatic discharge is proven to be the primary source of ignition and explosion. Herein, a surface modification process of polyaniline (PANI) is proposed to construct highly exothermic special powders, namely, HMX@PANI energetic composites, with low charge accumulation for improving powder electrostatic safety. Pure HMX are encapsulated within the PANI-conductive polymer layer through simple hydrogen bonding. Simulation results demonstrate that the forming process of HMX/aniline structure is a spontaneously thermodynamical process. The resultant inclusion complex exhibits excellent thermal stability, remarkable compatibility and intensive heat release. Importantly, PANI possesses superior electrostatic mobility characteristics because of the π-conjugated ligand, which can significantly reduce the accumulated charges on the surface of energetic powders. Moreover, the modified explosive has a narrower energy gap, which will improve the electron transition by reducing the energy barrier. The electrostatic accumulation test demonstrates that HMX@PANI composites possess a trace electrostatic accumulation of 34 nC/kg, which is two orders of magnitude lower than that of pure HMX (−6600 nC/kg) and might indicate a higher electrostatic safety. In conclusion, this surface modification process shows great promise for potential applications and could be extensively used in the establishment of high electrostatic safety for special powders. Full article
(This article belongs to the Special Issue Thermally Conductive Nanomaterials and Their Applications)
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