Special Issue "Thermally Conductive Nanomaterials and Their Applications"
Deadline for manuscript submissions: 20 April 2024 | Viewed by 48
Interests: micro- and nano-composite materials; energy storage materials; thermal conductivity enhancement technique; ultrafine powder
Over the past few decades, materials at the nanoscale have garnered significant attention, especially regarding their unique thermal conductivity properties. From early foundational experiments to modern sophisticated applications, such nanomaterials have increasingly come to the forefront of numerous high-tech applications. This field spans, but is not limited to, thermal interface materials, thermally conductive composites, and cooling solutions for electronic devices. Optimizing the thermal performance of these materials to meet the growing demands of microelectronics and energy storage devices is the main goal of current research.
The present Special Issue “Thermal Conductivity Nanomaterials and Their Applications” of Nanomaterials is aimed at introducing the role and application of nanomaterials in thermal conductivity enhancement. It is important to explore the fundamental mechanisms of heat transfer at the nanoscale and propose innovative strategies for enhancing thermal conductivity to further improve the application and performance of nanomaterials. Therefore, fundamental theoretical research, simulations and modeling, experimental validations, and applications of these nanomaterials are suitable for the Special Issue. With rapid technological advancements, thermally conductive nanomaterials and their applications undoubtedly continue to herald revolutionary changes for both the scientific and industrial communities.
We look forward to receiving your contributions.
Prof. Dr. Linghua Tan
Prof. Dr. Yi Jin
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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- thermal interface materials
- thermal conductivity
- heat transfer
- heat conduction model