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Micromachines
Special Issues
Feature Papers of Micromachines in 'Materials and Processing' 2023
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Special Issue "Feature Papers of Micromachines in 'Materials and Processing' 2023"

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 31 December 2023 | Viewed by 1446

Special Issue Editor

Dr. Mehmet Remzi Dokmeci

grade E-Mail Website
Guest Editor
Terasaki Institute for Biomedical Innovation, 1018 Westwood Blvd, Los Angeles, CA 90024, USA
Interests: bio-micro-electro-mechanical systems (BioMEMS); biomedical and implantable devices; biosensors; organs-on-a-chip; micro- and nanosensors for monitoring organs-on-a-chip; flexible electronics and sensors for wound healing; packaging and encapsulation of implantable devices; biomaterials; biofabrication
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We are pleased to announce this Special Issue entitled "Feature Papers of Micromachines in Materials and Processing 2023". In the past several years, we have worked in conjunction with excellent scholars and research groups to publish several high-impact high-quality manuscripts, which have received a large number of views and citations. Our goal is to publish latest scientific and technological advances in areas related to micro/nanofabrication with applications in biomedical sciences and biology, materials, semiconductors, photonics, and energy, through which we hope to make great contributions to the scientific community.

This Special Issue will be a collection of high-quality papers from excellent scholars around the world. Both original research articles and comprehensive review papers are welcome. The papers will be published free of charge, with full open access after peer review to benefit both authors and readers.

You are welcome to send short proposals for submissions of feature papers to our Editorial Office (aria.zeng@mdpi.com) before submission. The proposals will first be evaluated by the Editors. Please note that the selected full papers will still be subject to a thorough and rigorous peer review.

We look forward to receiving your excellent work.

Dr. Mehmet Remzi Dokmeci
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • biomedical microdevices
  • micro/nanofabrication
  • BioMEMS
  • organs-on-a-chip
  • minimally invasive devices
  • wearable devices
  • biosensors
  • 3D bioprinting
  • MEMS and CMOS technologies
  • point of care devices
  • III–V devices, thin film transistors
  • artificial intelligence with applications to micro/nanofabrication and sensors

Published Papers (2 papers)

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Article
Microscale Engineering of n-Type Doping in Nanostructured Gallium Antimonide: AC Impedance Spectroscopy Insights on Grain Boundary Characterization and Strategies for Controlled Dopant Distribution
by
Michael J. Hall
and
Daryoosh Vashaee
Micromachines 2023, 14(9), 1801; https://doi.org/10.3390/mi14091801 - 21 Sep 2023
Viewed by 166
Abstract
This paper investigates the microscale engineering aspects of n-type doped GaSb to address the challenges associated with achieving high electrical conductivity and precise dopant distribution in this semiconductor material. AC impedance spectroscopy is employed as a reliable technique to characterize the microstructural and [...] Read more.
This paper investigates the microscale engineering aspects of n-type doped GaSb to address the challenges associated with achieving high electrical conductivity and precise dopant distribution in this semiconductor material. AC impedance spectroscopy is employed as a reliable technique to characterize the microstructural and electrical properties of GaSb, providing valuable insights into the impact of grain boundaries on overall electrical performance. The uneven distribution of dopants, caused by diffusion, and the incomplete activation of introduced dopants pose significant obstacles in achieving consistent material properties. To overcome these challenges, a careful selection of alloying elements, such as bismuth, is explored to suppress the formation of native acceptor defects and modulate band structures, thereby influencing the doping and compensator formation processes. Additionally, the paper examines the effect of microwave annealing as a potential solution for enhancing dopant activation, minimizing diffusion, and reducing precipitate formation. Microwave annealing shows promise due to its rapid heating and shorter processing times, making it a viable alternative to traditional annealing methods. The study underscores the need for a stable grain boundary passivation strategy to achieve significant improvements in GaSb material performance. Simple grain size reduction strategies alone do not result in better thermoelectric performance, for example, and increasing the grain boundary area per unit volume exacerbates the issue of free carrier compensation. These findings highlight the complexity of achieving optimal doping in GaSb materials and the importance of innovative analytical techniques and controlled doping processes. The comprehensive exploration of n-type doped GaSb presented in this research provides valuable insights for future advancements in the synthesis and optimization of high-conductivity nanostructured n-type GaSb, with potential applications in thermoelectric devices and other electronic systems. Full article
(This article belongs to the Special Issue Feature Papers of Micromachines in 'Materials and Processing' 2023)
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Article
Towards Broadband High-Frequency Vibration Attenuation Using Notched Cross-Shaped Metamaterial
by
Jin Guo
,
Rui Zhao
and
Yunbo Shi
Micromachines 2023, 14(2), 414; https://doi.org/10.3390/mi14020414 - 09 Feb 2023
Viewed by 987
Abstract
This paper reports a plate-type metamaterial designed by arranging unit cells with variable notched cross-sections in a periodical array for broadband high-frequency vibration attenuation in the range of 20 kHz~100 kHz. The dispersion relation and displacement field of the unit cell were calculated [...] Read more.
This paper reports a plate-type metamaterial designed by arranging unit cells with variable notched cross-sections in a periodical array for broadband high-frequency vibration attenuation in the range of 20 kHz~100 kHz. The dispersion relation and displacement field of the unit cell were calculated by simulation analysis, and the causes of the bandgap were analyzed. By studying the influence of critical structural parameters on the energy band structure, the corresponding structural parameters of a relatively wide bandgap were obtained. Finally, the plate-type metamaterial was designed by arranging unit cells with variable notched cross-sections in the periodical array, and the simulation results show that the vibration attenuation amplitude of the metamaterial can reach 99% in the frequency range of 20 kHz~100 kHz. After fabricating the designed plate-type metamaterial by 3D printing techniques, the characterization of plate-type metamaterial was investigated and the experiment results indicated that an 80% amplitude attenuation can be obtained for the suppression of vibration with the frequency of 20 kHz~100 kHz. The experimental results demonstrate that the periodic arrangement of multi-size cell structures can effectively widen the bandgap and have a vibration attenuation effect in the bandgap range, and the proposed plate-type metamaterial is promising for the vibration attenuation of highly precise equipment. Full article
(This article belongs to the Special Issue Feature Papers of Micromachines in 'Materials and Processing' 2023)
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